DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of claims 1-12, 19-10 in the reply filed on 8/2/26 is acknowledged.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1, 7, and 8 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Chen et al. (US pub 20240297120).
With respect to claim 1, Chen et al. teach a semiconductor package comprising (see figs. 1-4D, particularly fig. 1B and associated text):
a rewiring structure 114,108,106 including a rewiring pattern 108,106 and at least one insulating layer 114;
a semiconductor device 110, 112 provided on the rewiring structure and electrically connected to the rewiring pattern; and
a side surface protector 116 covering a first side surface (left) of the semiconductor device and extending to a side surface of the rewiring structure,
wherein an upper surface of the semiconductor device, which is opposite to a lower surface of the semiconductor device facing the rewiring structure, and an upper surface of the side surface protector are at the same vertical level and are coplanar with each other, and the side surface protector extends from the insulating layer of the rewiring structure.
With respect to claim 7, Chen et al. teach the insulating layer and the side surface protector are comprised of the same material (epoxy). See fig. 1B and associated text.
With respect to claim 8, Chen et al. teach the insulating layer and the side surface protector are comprised of a photo imageable dielectric (PID) material (epoxy). See fig. 1B and associated text.
Allowable Subject Matter
Claims 19-20 are allowed.
Claims 2-6, 9-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Examiner’s Cited References
The cited references generally show the similar or related structure having a stack of semiconductor device and rewiring structure, having a protective layer covering sides of the semiconductor device and rewiring structure, where upper surfaces of the device and the protective layer are co-planar as presently claimed by applicant.
Conclusion
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LONG . PHAM
Examiner
Art Unit 2823
/LONG PHAM/Primary Examiner, Art Unit 2897
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