Prosecution Insights
Last updated: October 02, 2026
Application No. 18/768,352

FLEXIBLE SUBSTRATE AND BUS BAR MODULE

Final Rejection §102
Filed
Jul 10, 2024
Priority
Jul 12, 2023 — JP 2023-114566
Examiner
BURNS, TREMESHA WILLIS
Art Unit
2847
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Yazaki Corporation
OA Round
2 (Final)
78%
Grant Probability
Favorable
3-4
OA Rounds
3m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 78% — above average
78%
Career Allowance Rate
698 granted / 893 resolved
+10.2% vs TC avg
Strong +17% interview lift
Without
With
+17.2%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
43 currently pending
Career history
947
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
33.4%
-6.6% vs TC avg
§102
47.0%
+7.0% vs TC avg
§112
17.8%
-22.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 893 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Amendment Applicant's arguments with respect to claims 1 – 7 have been considered but are moot in view of the new ground(s) of rejection. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1 – 7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Takada et al. (WO 2022/163420). Regarding claim 1, in Figure 6 (with Figure 6 being upside down), Takada discloses a flexible substrate comprising: an electronic component (20) that has an electrode (35); a base film (26); a conductor circuit (comprising 18, 33, 34) that is formed on a lower side surface of the base film in a vertical direction, and has a first joint region (area including 33, 34, 36) to which the electrode is jointed using a joint material (solder 36); and a coverlay (27) that covers at least a part of a lower side surface of the conductor circuit in the vertical direction, and has a first opening (32) that is exposed to an outside and that exposes the first joint region to the outside (Figure 6). Regarding claim 2, in Figure 9 (with Figure 9 being upside down), Takada discloses a flexible substrate comprising: an electronic component (20) that has an electrode (35); a base film (26); a conductor circuit (comprising 18, 33, 34) that is formed on a lower side surface of the base film in a vertical direction, and has a first joint region (area including 33, 34, 36) to which the electrode is jointed using a joint material (solder 36); and a coverlay (27) that covers at least a part of a lower side surface of the conductor circuit in the vertical direction, and has a first opening (32) exposing the first joint region (Figure 6), wherein the first opening is covered with insulating oil (21, insulating liquid resin 21, pg. 7, 3rd paragraph; Figure 9). Regarding claim 3, Takada discloses a metal plate, wherein the coverlay further covers a part of a lower side surface of the base film in the vertical direction, except for a region exposed to the outside in the first opening, the metal plate is provided on a lower side surface of the coverlay in the vertical direction, and surrounds the electronic component, and a reinforcing plate is not provided on an upper side surface of the base film in the vertical direction (Figure 6). Regarding claim 4, Takada discloses wherein the conductor circuit has a second joint region to which a part of the metal plate is jointed, and the coverlay has a second opening exposing the second joint region to the outside (Figure 6). Regarding claim 5, Takada discloses wherein the flexible substrate is included in a bus bar module having a plurality of bus bars each of which electrically connects positive and negative electrode terminals of adjacent single cells, the metal plate is joined to one bus bar among the plurality of bus bars, and the electronic component is electrically connected to the one bus bar via the conductor circuit and the metal plate (Figure 6). Regarding claim 6, Takada discloses a trunk portion; and a branch portion branching from the trunk portion, wherein the branch portion is folded back so as to intersect with the trunk portion in a plan view, and an end portion of the branch portion has the electronic component, the base film, the conductor circuit, the coverlay, and the metal plate (Figure 6). Regarding claim 7, Takada discloses wherein the trunk portion is formed in a substantially U-shape, and has a first extension portion, a second extension portion extending in parallel with the first extension portion, and a coupling portion which couples an end portion of the first extension portion and an end portion of the second extension portion, when the branch portion branches in a direction approaching the second extension portion from the first extension portion, the branch portion is folded back in a direction away from the second extension portion so as to intersect with the first extension portion in a plan view, and when the branch portion branches in a direction approaching the first extension portion from the second extension portion, the branch portions is folded back in a direction away from the first extension portion so as to intersect with the second extension portion in a plan view (Figure 6). Allowable Subject Matter Claim 8 is allowed. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to TREMESHA W BURNS whose telephone number is (571)270-3391. The examiner can normally be reached Monday-Friday 8am - 4:30 pm EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at (571) 272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. TREMESHA W. BURNS Primary Examiner Art Unit 2847 /TREMESHA W BURNS/Primary Examiner, Art Unit 2847
Read full office action

Prosecution Timeline

Jul 10, 2024
Application Filed
Apr 02, 2026
Non-Final Rejection mailed — §102
May 28, 2026
Response Filed
Sep 16, 2026
Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12751302
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
2y 8m to grant Granted Sep 29, 2026
Patent 12750956
DISPLAY DEVICE
2y 1m to grant Granted Sep 29, 2026
Patent 12745347
IMAGE PICKUP UNIT AND ENDOSCOPE
3y 0m to grant Granted Sep 22, 2026
Patent 12734981
ELECTRONIC MODULE WITH SELF-RETAINING FEATURE AND METHOD OF USING SAME
2y 6m to grant Granted Sep 15, 2026
Patent 12727806
FLEXIBLE ELECTRONIC DEVICE
2y 7m to grant Granted Sep 08, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
78%
Grant Probability
95%
With Interview (+17.2%)
2y 6m (~3m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 893 resolved cases by this examiner. Grant probability derived from career allowance rate.

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