DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Status of the Claims
The status of the claims as filed in the reply dated 7/30/2025 are as filed:
Claims 1 and 12 are amended,
Claims 1-16 are currently pending.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-16 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Singh (US 10,685,900, previously cited).
In regards to claim 1, Singh discloses
A modular energy system (Fig.5) comprising:
a module (10, 110) comprising an energy source (24, col 2, lines 14-15) and converter electronics (60, col 2, lines 27-28), wherein the converter electronics are mounted on a substrate (68) and connected to the energy source (Fig.1);
a heatsink (52) adjacent and thermally coupled to the substrate; and
an enclosure (152, 252) for the module comprising a conduit section (56) configured to pass coolant to cool the module;
wherein the heatsink is positioned between the conduit section and the substrate (Fig.5).
In regards to claim 2, Singh discloses that the energy source comprises a fuel cell, a battery module, or a capacitor (col.1 lines 16-20, a semiconductor device is disclosed for vehicle applications incorporated into power electronic modules, which include battery modules).
In regards to claim 3, Singh discloses that the enclosure comprises a top portion and a bottom portion, and wherein the conduit section is located within the top portion of the enclosure (Fig.5).
In regards to claim 4, Singh discloses that the bottom portion of the enclosure also includes the conduit section and the conduit section fluidly couples the top portion of the enclosure and the bottom portion of the enclosure (col.10 lines 54-59).
In regards to claim 5, Singh discloses that the heatsink is positioned between the conduit section in the top portion of the enclosure and the substrate (Fig.5).
In regards to claim 6, Singh discloses that the heatsink is positioned between the conduit section in the bottom portion of the enclosure and the substrate (Fig.5).
In regards to claim 7, Singh discloses that the enclosure comprises a channel having a shape corresponding to a shape of the conduit section, wherein the conduit section is located within the channel (Fig.5).
In regards to claim 8, Singh discloses an interface layer (131) positioned between the conduit section and the heatsink.
In regards to claim 9, Singh discloses that the interface layer is deformable (col.12 lines 37-41).
In regards to claim 10, Singh discloses that the interface layer comprises a thermally conductive polymer (col.12 lines 37-41).
In regards to claim 11, Singh discloses that the conduit section is in contact with the interface layer, the interface layer is in contact with the heatsink, and the heatsink is in contact with the substrate (Fig.5).
In regards to claim 12, Singh discloses
A modular energy system (Fig.5) comprising:
a plurality of modules (10, 110), each module of the plurality of modules comprises an energy source and converter electronics connected to the energy source (Figs.1 ang 5);
an enclosure (152, 252) for the plurality of modules, the enclosure comprising a conduit network (56) to pass coolant to cool the plurality of modules, wherein, for each module of the plurality of modules, the converter electronics are positioned between the energy sources and the conduit network (Fig.5).
In regards to claim 13, Singh discloses that the enclosure comprises a top portion and a bottom portion, and wherein the conduit network is located within the top portion of the enclosure (Fig.5).
In regards to claim 14, Singh discloses that the bottom portion of the enclosure also includes the conduit network and the conduit network fluidly couples the top portion of the enclosure and the bottom portion of the enclosure (col.10 lines 54-59).
In regards to claim 15, Singh discloses that the energy source comprises a fuel cell, a battery module, or a capacitor (col.1 lines 16-20, a semiconductor device is disclosed for vehicle applications incorporated into power electronic modules, which include battery modules).
In regards to claim 16, Singh discloses that the enclosure comprises a top portion and a bottom portion, and wherein the conduit network is located within the bottom portion of the enclosure (Fig.5).
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-16 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Singh (US 10,685,900, previously cited).
In regards to claim 1, Singh discloses
A modular energy system (Fig.5) comprising:
a module (10, 110) comprising an energy source and converter electronics mounted on a substrate (68) and connected to the energy source (Fig.1);
a heatsink (52) adjacent and thermally coupled to the substrate; and
an enclosure (152, 252) for the module comprising a conduit section (56) configured to pass coolant to cool the module;
wherein the heatsink is positioned between the conduit section and the substrate (Fig.5).
In regards to claim 2, Singh discloses that the energy source comprises a fuel cell, a battery module, or a capacitor (col.1 lines 16-20, a semiconductor device is disclosed for vehicle applications incorporated into power electronic modules, which include battery modules).
In regards to claim 3, Singh discloses that the enclosure comprises a top portion and a bottom portion, and wherein the conduit section is located within the top portion of the enclosure (Fig.5).
In regards to claim 4, Singh discloses that the bottom portion of the enclosure also includes the conduit section and the conduit section fluidly couples the top portion of the enclosure and the bottom portion of the enclosure (col.10 lines 54-59).
In regards to claim 5, Singh discloses that the heatsink is positioned between the conduit section in the top portion of the enclosure and the substrate (Fig.5).
In regards to claim 6, Singh discloses that the heatsink is positioned between the conduit section in the bottom portion of the enclosure and the substrate (Fig.5).
In regards to claim 7, Singh discloses that the enclosure comprises a channel having a shape corresponding to a shape of the conduit section, wherein the conduit section is located within the channel (Fig.5).
In regards to claim 8, Singh discloses an interface layer (131) positioned between the conduit section and the heatsink.
In regards to claim 9, Singh discloses that the interface layer is deformable (col.12 lines 37-41).
In regards to claim 10, Singh discloses that the interface layer comprises a thermally conductive polymer (col.12 lines 37-41).
In regards to claim 11, Singh discloses that the conduit section is in contact with the interface layer, the interface layer is in contact with the heatsink, and the heatsink is in contact with the substrate (Fig.5).
In regards to claim 12, Singh discloses
A modular energy system (Fig.5) comprising:
a plurality of modules (10, 110), each module of the plurality comprises an energy source (24, col 2, lines 14-15) and converter electronics connected to the energy source (Figs.1 ang 5);
an enclosure (152, 252) for the plurality of modules, the enclosure comprising a conduit network (56) to pass coolant to cool the plurality of modules, wherein the converter electronics of the plurality of modules are positioned between the energy sources and the conduit network (Fig.5).
In regards to claim 13, Singh discloses that the enclosure comprises a top portion and a bottom portion, and wherein the conduit network is located within the top portion of the enclosure (Fig.5).
In regards to claim 14, Singh discloses that the bottom portion of the enclosure also includes the conduit network and the conduit network fluidly couples the top portion of the enclosure and the bottom portion of the enclosure (col.10 lines 54-59).
In regards to claim 15, Singh discloses that the energy source comprises a fuel cell, a battery module, or a capacitor (col.1 lines 16-20, a semiconductor device is disclosed for vehicle applications incorporated into power electronic modules, which include battery modules).
In regards to claim 16, Singh discloses that the enclosure comprises a top portion and a bottom portion, and wherein the conduit network is located within the bottom portion of the enclosure (Fig.5).
Response to Arguments
Applicant's arguments filed 7/28/2025 have been fully considered but they are not persuasive.
Applicant argues (pages 4-5) that Singh does not discloses an energy or source of converter electronics. The Examiner respectfully disagrees; Singh teaches the cooling of converters (see col 1, lines 12-25).
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
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/HARRY E ARANT/Primary Examiner, Art Unit 3763