DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant's election with traverse of Species 2 in the reply filed on 8/12/26 is acknowledged. The traversal is on the ground(s) that claim 1 is generic; however claim 1 is not generic to the all claims since Group II pertains to a method. In addition the Applicant argues that the examination of Species 1 should be carried out- however such an argument is not persuasive because a separate search would be required to address the additional species. An exhaustive search has been conducted and the most relevant art has been applied to species 2. An additional search for a second species would be burdensome and the art of record does not read upon the second species. Applicant is reminded that should future prosecution determine allowable subject matter- and the withdrawn claims incorporate the allowable subject matter through either amendment or dependency upon an allowable claim- rejoinder of the withdrawn claims will occur.
The requirement is still deemed proper and is therefore made FINAL.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 5-10 is/are rejected under 35 U.S.C. 102a1 as being anticipated by Wan et al (US 2020/0051894).
An electronic device, comprising:
first and second integrated circuit (IC) dies (Fig.1A (104/106) and [0016]) co-located on a surface of a substrate (Fig.1A (102) and [0017]) in proximity to each other;
a heat sink (Fig.1A (114) and [0022]) disposed on the first and second IC dies (Figs.1A-6 (4104/106) and [0016]); and
a lid (Figs.1A-6 (110/136) and [0024]), which is disposed between the first IC die (Figs. 1A-6 (104) and [0016]) and the heat sink (Fig.1A (114) and [0022]), and the lid (Figs.1A-6 (110/136) and [0024]) is not disposed between the second IC die (Figs. 1A-6 (106) and [0016]) and the heat sink (Fig.1A (114) and [0022]).
5. The electronic device according to claim 1, wherein the first IC die (Figs. 1A-6 (104) and [0016]) is configured to operate at a first temperature [0027], and the second IC die (Figs. 1A-6 (106) and [0016]) is configured to operate at a second temperature [0027], different from the first temperature [0027], and comprising (i) a first thermal interface material (TIM) (Figs.1A-6 (108) and [0022]) disposed between the first IC die (Figs. 1A-6 (104) and [0016]) and the lid (Figs.1A-6 (110/136) and [0024]), (ii) a second TIM (Figs.1A-6 (108) and [0022]) disposed between the second IC die (Figs. 1A-6 (106) and [0016]) and the heat sink (Fig.1A (114) and [0022]), wherein the first and second TIMs (Figs.1A-6 (108) and [0022]) are separated from one another (Fig.1A-6) (108- left and 108-right), and (iii) a structure (Fig.1A-6 (140) and [0029]) formed between the first and second IC dies (Fig.1A (104/106) and [0016]), and configured to reduce heat transfer between the first IC die and the second IC die (Fig.1A (104/106) and [0016]) and [0027-0029].
6. The electronic device according to claim 5, and comprising a dam structure (Fig.1A-6 (140) and [0029]) disposed between the first TIM (Figs.1A-6 (108) and [0022]) and the second TIM (Figs.1A-6 (108) and [0022]), the dam structure (Fig.1A-6 (140) and [0029]) being configured to reduce material transfer between the first TIM and the second TIM (Figs.1A-6 (108) and [0022]).
7. The electronic device according to claim 5, wherein the lid (Figs.1A-6 (110/136) and [0024]) has a confining section (see annotated drawing below) disposed between the first TIM (Figs.1A-6 (108) and [0022]) and the second TIM (Figs.1A-6 (108) and [0022]), the confining section being configured to reduce material transfer between the first TIM (Figs.1A-6 (108) and [0022]) and the second TIM (Figs.1A-6 (108) and [0022]).
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8. The electronic device according to claim 7, and comprising a groove (see annotated drawing made below) formed in the structure between the first IC die and the second IC die (Fig.1A (104/106) and [0016]), wherein the groove is configured to reduce heat transfer between the first IC die and the second IC die (Fig.1A (104/106) and [0016]).
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9. The electronic device according to claim 8, wherein the confining section of the lid is shaped to fit in at least part of the groove (see above annotated drawings- the confining section is partially in the grooves).
10. The electronic device according to claim 8, wherein the confining section of the lid is configured to self-align with the groove (see above annotated drawings- the confining section is partially self aligned within the grooves).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Chen et al (US2017/0162542); Eid et al (US 20240030098) and Wan et al (US 11456232) teach similar heat sinks and lids for heat dissipation of mounted dies.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to LAURA M MENZ whose telephone number is (571)272-1697. The examiner can normally be reached Monday-Friday 7:00-3:30.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Steven Gauthier can be reached at 571-270-0373. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/LAURA M MENZ/Primary Examiner, Art Unit 2813
8/21/26
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