Prosecution Insights
Last updated: October 01, 2026
Application No. 18/776,459

CIRCUIT BOARD ASSEMBLY AND METHOD

Non-Final OA §102§103
Filed
Jul 18, 2024
Priority
Jul 20, 2023 — DE 102023206893.1
Examiner
INOUSSA, MOULOUCOULAY
Art Unit
Tech Center
Assignee
Vitesco Technologies GmbH
OA Round
1 (Non-Final)
86%
Grant Probability
Favorable
1-2
OA Rounds
2m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 86% — above average
86%
Career Allowance Rate
676 granted / 790 resolved
+25.6% vs TC avg
Moderate +8% lift
Without
With
+8.2%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
25 currently pending
Career history
801
Total Applications
across all art units

Statute-Specific Performance

§101
2.4%
-37.6% vs TC avg
§103
44.3%
+4.3% vs TC avg
§102
38.0%
-2.0% vs TC avg
§112
15.1%
-24.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 790 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-3, 13 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Bagung et al. (US 2022/0115290 A1 hereinafter referred to as “Bagung”). With respect to claim 1, Bagung discloses, in Figs.1-6b, a circuit board assembly, comprising: an insert (5, 31-33); a printed circuit board (PCB) (2), the insert (31-33) connected to the PCB (2); at least one semiconductor device (3-4); a primary connection (31) between the insert (31-33) and the at least one semiconductor device (3-4); and a secondary connection (32-33) between the insert (31-33) and the at least one semiconductor device (3-4); wherein the secondary connection (32-33) provides electrical and thermal communication between the at least one semiconductor device (4) and the insert (31-33) when the primary connection (32) fails (see Par.[0061] wherein The semiconductor component arrangement 1 comprises a semiconductor component 3, which is installed in a housing 4 and which is therefore not shown in greater detail in the figures. The example used is a so-called power MOSFET, i.e. a power metal oxide semiconductor field-effect transistor; see Par.[0062]-[0064] wherein 2he heat dissipation device 2 comprises a comparatively large first metal block 31, a comparatively small second metal block 32, also shown in sectional view in FIG. 4, as well as a third metal block 33 and a fourth metal block 34, which are similar in size to the second metal block 32 and are arranged behind the second metal block 32 in the viewing direction of FIG. 4; the four metal blocks 31, 32, 33 and 34 in functional terms form a prefabricated metal block group for connecting the semiconductor component 3 to the printed circuit board 5). With respect to claim 2, Bagung discloses, in Figs.1-6b, the circuit board assembly, the primary connection between the insert (5, 31-33) and the at least one semiconductor device (3-4) further comprising a sintered connection (15), wherein the insert (5, 31-33) and the at least one semiconductor device (3-4) are in electrical and thermal communication with one another through the sintered connection (see Par.[0064] wherein the metal plate 13 and thus the first electrical connector 21 is connected in an electrically conductive manner to the first metal block 31 by means of a solder joint 14, which has the soldering tin layer 15 shown in cross-section in FIG. 4. FIG. 1 shows that the soldering tin layer 15 is applied to a first end face 16 of the first metal block 31). With respect to claim 3, Bagung discloses, in Figs.1-6b, the circuit board assembly, the sintered connection further comprising a sintering compound connecting the insert and the at least one semiconductor device (see Fig.4). With respect to claim 13, Bagung discloses, in Figs.1-6b, the circuit board assembly, the sintered connection further comprising a sintering compound (15) connecting the insert (5, 31-33) and the at least one semiconductor device (3-4) (see Par.[0064] wherein the metal plate 13 and thus the first electrical connector 21 is connected in an electrically conductive manner to the first metal block 31 by means of a solder joint 14, which has the soldering tin layer 15 shown in cross-section in FIG. 4. FIG. 1 shows that the soldering tin layer 15 is applied to a first end face 16 of the first metal block 31). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 4-5, 9, 14-15 are rejected under 35 U.S.C. 103 as being unpatentable over Bagung in view of Le et al. (US 2025/0052803 A1 hereinafter referred to as “Le”). With respect to claim 4, Bagung discloses all the claimed limitations of claim 1. However, Bagung does not explicitly disclose the limitations of claim 4. Le discloses, in Figs.1-10, the circuit board assembly of one of the proceeding, the secondary connection further comprising a limp-home function if the primary connection fails (see Par.[0023]-[0025] wherein an (optional) safety-relevant (i.e.; limp home function) or safety-critical on-board power system path or on-board power subsystem 11 is thus connected to the terminal KL 30_1 and not connected to other non-safety-relevant terminal KL 30_0). Bagung and Le are analogous art because they are all directed to a printed circuit board used in control unit, and one of ordinary skill in the art would have had a reasonable expectation of success by modifying Bagung to include Le because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to modify PCB connector/terminal function in Bagung by including safety relevant function in one terminal when the other terminal fails as taught by Le in order to utilize redundant hardware used in highly safety-relevant applications so that, if a part of the system fails, the entire operation can still be maintained by means of the redundant design so as reliable and current statements regarding the functionality can thus be made thus the safety of the arrangement of the overall device is thereby further increased. With respect to claim 5, Bagung discloses, in Figs.1-6b, the circuit board assembly, the secondary connection between the insert and the at least one semiconductor device further comprising a solder connection (15) (see Par.[0064] wherein the metal plate 13 and thus the first electrical connector 21 is connected in an electrically conductive manner to the first metal block 31 by means of a solder joint 14, which has the soldering tin layer 15 shown in cross-section in FIG. 4. FIG. 1 shows that the soldering tin layer 15 is applied to a first end face 16 of the first metal block 31). With respect to claim 9, Bagung discloses, in Figs.1-6b, a method for providing multiple connections (31-33) between an insert (5, 31-33) and at least one semiconductor device (3-4) of a circuit board assembly (2), comprising the steps of: providing an insert (5, 31-33); providing a printed circuit board (PCB) (2); and providing at least one semiconductor device (3-4); connecting the insert to the PCB (2); connecting the insert (5, 31-33) to the at least one semiconductor device (3-4) such that there is a primary connection (31) between the insert and the at least one semiconductor device, and a secondary connection (32-33) between the insert (5, 31-33) and the at least one semiconductor device (3-4) (see Par.[0061] wherein The semiconductor component arrangement 1 comprises a semiconductor component 3, which is installed in a housing 4 and which is therefore not shown in greater detail in the figures. The example used is a so-called power MOSFET, i.e. a power metal oxide semiconductor field-effect transistor; see Par.[0062]-[0064] wherein 2he heat dissipation device 2 comprises a comparatively large first metal block 31, a comparatively small second metal block 32, also shown in sectional view in FIG. 4, as well as a third metal block 33 and a fourth metal block 34, which are similar in size to the second metal block 32 and are arranged behind the second metal block 32 in the viewing direction of FIG. 4; the four metal blocks 31, 32, 33 and 34 in functional terms form a prefabricated metal block group for connecting the semiconductor component 3 to the printed circuit board 5). However, Bagung does not explicitly disclose operating the circuit board assembly using a limp-home function with the secondary connection if the primary connection fails. Le discloses, in Figs.1-10, the circuit board assembly of one of the proceeding, the secondary connection further comprising a limp-home function if the primary connection fails (see Par.[0023]-[0025] wherein an (optional) safety-relevant (i.e.; limp home function) or safety-critical on-board power system path or on-board power subsystem 11 is thus connected to the terminal KL 30_1 and not connected to other non-safety-relevant terminal KL 30_0). Bagung and Le are analogous art because they are all directed to a printed circuit board used in control unit, and one of ordinary skill in the art would have had a reasonable expectation of success by modifying Bagung to include Le because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to modify PCB connector/terminal function in Bagung by including safety relevant function in one terminal when the other terminal fails as taught by Le in order to utilize redundant hardware used in highly safety-relevant applications so that, if a part of the system fails, the entire operation can still be maintained by means of the redundant design so as reliable and current statements regarding the functionality can thus be made thus the safety of the arrangement of the overall device is thereby further increased. With respect to claim 14, Bagung discloses all the claimed limitations of claim 2. However, Bagung does not explicitly disclose the limitations of claim 14. Le discloses, in Figs.1-10, the circuit board assembly of one of the proceeding, the secondary connection further comprising a limp-home function if the primary connection fails (see Par.[0023]-[0025] wherein an (optional) safety-relevant (i.e.; limp home function) or safety-critical on-board power system path or on-board power subsystem 11 is thus connected to the terminal KL 30_1 and not connected to other non-safety-relevant terminal KL 30_0). Bagung and Le are analogous art because they are all directed to a printed circuit board used in control unit, and one of ordinary skill in the art would have had a reasonable expectation of success by modifying Bagung to include Le because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to modify PCB connector/terminal function in Bagung by including safety relevant function in one terminal when the other terminal fails as taught by Le in order to utilize redundant hardware used in highly safety-relevant applications so that, if a part of the system fails, the entire operation can still be maintained by means of the redundant design so as reliable and current statements regarding the functionality can thus be made thus the safety of the arrangement of the overall device is thereby further increased. With respect to claim 15, Bagung discloses all the claimed limitations of claim 3. However, Bagung does not explicitly disclose the limitations of claim 15. Le discloses, in Figs.1-10, the circuit board assembly of one of the proceeding, the secondary connection further comprising a limp-home function if the primary connection fails (see Par.[0023]-[0025] wherein an (optional) safety-relevant (i.e.; limp home function) or safety-critical on-board power system path or on-board power subsystem 11 is thus connected to the terminal KL 30_1 and not connected to other non-safety-relevant terminal KL 30_0). Bagung and Le are analogous art because they are all directed to a printed circuit board used in control unit, and one of ordinary skill in the art would have had a reasonable expectation of success by modifying Bagung to include Le because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to modify PCB connector/terminal function in Bagung by including safety relevant function in one terminal when the other terminal fails as taught by Le in order to utilize redundant hardware used in highly safety-relevant applications so that, if a part of the system fails, the entire operation can still be maintained by means of the redundant design so as reliable and current statements regarding the functionality can thus be made thus the safety of the arrangement of the overall device is thereby further increased. Allowable Subject Matter Claims 6-8, 10-12, 16-19 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: none of the prior art of record teaches, suggest, or renders obvious, either alone or in combination, at least one protrusion integrally formed as part of the insert, the at least one protrusion being part of the primary connection; and at least one aperture integrally formed as part of the PCB; wherein the at least one protrusion at least partially extends into the at least on aperture when the insert is assembled to the PCB. Citation of Pertinent Prior Art The prior art made of record (e.g.; see PTO-892) and not relied upon is considered pertinent to applicant's disclosure. Examiner’s Telephone/Fax Contacts Any inquiry concerning this communication or earlier communications from the examiner should be directed to MOULOUCOULAYE INOUSSA whose telephone number is (571)272-0596. The examiner can normally be reached Monday-Friday (10-18). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, JEFF W NATALINI can be reached at 571-272-2266. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Mouloucoulaye Inoussa/ Primary Examiner, Art Unit 2818
Read full office action

Prosecution Timeline

Jul 18, 2024
Application Filed
Aug 19, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
86%
Grant Probability
94%
With Interview (+8.2%)
2y 5m (~2m remaining)
Median Time to Grant
Low
PTA Risk
Based on 790 resolved cases by this examiner. Grant probability derived from career allowance rate.

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