Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18811194 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18788330 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18779407 | MEMORY DEVICE INCLUDING POWER GATING SWITCH | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18749965 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18742371 | INFORMATION READING METHOD OF SELF-SELECTING MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18337622 | DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR | Non-Final OA | NXP B.V. |
| 18780598 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18752151 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18631237 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18782316 | DETECTION DEVICE | Non-Final OA | Magnolia White Corporation |
| 18546631 | SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18837603 | UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE | Non-Final OA | RESONAC CORPORATION |
| 18776220 | SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Kioxia Corporation |
| 18494027 | HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE | Non-Final OA | Texas Instruments Incorporated |
| 18740361 | TRANSPOSED SPARSE MATRIX MULTIPLY BY DENSE MATRIX FOR NEURAL NETWORK TRAINING | Non-Final OA | NVIDIA Corporation |
| 18782320 | MEMORY CONNECTION WITH OXIDE-NITRIDE-SILICON (ONP) SCHEME | Non-Final OA | Applied Materials, Inc. |
| 18776441 | ENGINEERING METAL OXIDE LAYER INTERFACES TO IMPROVE ELECTRONIC DEVICE STABILITY | Non-Final OA | Applied Materials, Inc. |
| 18776459 | CIRCUIT BOARD ASSEMBLY AND METHOD | Non-Final OA | Vitesco Technologies GmbH |
| 18617979 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18408958 | POWER MODULE WITH METALLIC HEAT SPREADER | Final Rejection | Monolithic Power Systems, Inc. |
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