Prosecution Insights
Last updated: May 29, 2026

Examiner: INOUSSA, MOULOUCOULAY

Tech Center 2800 • Art Units: 2818

This examiner grants 86% of resolved cases

Performance Statistics

85.8%
Allow Rate
+17.8% vs TC avg
794
Total Applications
+7.3%
Interview Lift
887
Avg Prosecution Days
Based on 766 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
26.7%
§102 Novelty
69.0%
§103 Obviousness
4.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18531836 SEMICONDUCTOR DEVICES Non-Final OA Samsung Electronics Co., Ltd.
18475803 SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL Non-Final OA President and Fellows Of Harvard College
18508985 DUAL-SIDE ORGANIC LIGHT EMITTING DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18494027 HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE Non-Final OA Texas Instruments Incorporated
18459075 WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18043474 SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC APPARATUS Final Rejection SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18387505 PHASE CHANGE SWITCH WITH ADHESION LAYER Non-Final OA Infineon Technologies AG
18494075 LIGHT-EMITTING DIODE, LIGHT-EMITTING DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE Non-Final OA TIANJIN SANAN OPTOELECTRONICS CO., LTD.
18393713 NITRIDE SEMICONDUCTOR DEVICE Non-Final OA ROHM CO., LTD.
18477870 SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE Non-Final OA ROHM CO., LTD.
18494073 SRAM STRUCTURE WITH DUAL SIDE POWER RAILS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18367315 METHOD OF SURFACE MODIFICATION FOR WAFER BONDING Non-Final OA Tokyo Electron Limited
18387228 METHODS FOR SELECTIVE DEPOSITION OF PRECURSOR MATERIALS AND RELATED DEVICES Non-Final OA ENTEGRIS, INC.
18337622 DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR Non-Final OA NXP B.V.
18179744 OPTICAL SENSOR PACKAGE Final Rejection SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
18228898 INTEGRATED CIRCUIT PACKAGE Final Rejection STMicroelectronics (Grenoble 2) SAS
18408914 EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUCTOR DEVICES Non-Final OA Saras Micro Devices, Inc.

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