Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
DETAILED ACTION
Claim Rejections - 35 USC § 102
1. In the event that the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Campbell et al. US2013/0021746.
Per claim 1 Campbell et al. teaches a heat dissipation system (200, see fig.3; [0033]), wherein the heat dissipation system comprises a heat dissipation cavity (see fig.3, “portion with 231, 232, 241, 242 and 210”), a first liquid cooling assembly (215, 235, 243 & 300, see fig.3), an air cooling assembly (234 & 237, see fig.3), a first power cavity (210; [0002], see fig.3, “cavity that holds electronic component/servers”), and a first power device ([0002], “power supply within rack or frame”), the first liquid cooling assembly and the first power cavity are disposed inside the heat dissipation cavity (see fig.3), the first power device is disposed inside the first power cavity ([0002]), the first power cavity is in contact with the first liquid cooling assembly (see fig.3; [0034], [0049]), an air inlet (230 & 234) and an air outlet (237 & 238) of the air cooling assembly are disposed on the heat dissipation cavity (see fig.3), and airflow in an air-cooled channel connected between the air inlet and the air outlet passes through at least one of the first liquid cooling assembly (243, see fig.3) or the first power cavity; and the first liquid cooling assembly and the air cooling assembly are configured to dissipate heat for the first power device ([0001]-[0003]).
Allowable Subject matter
2. Claims 2-20 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Claim 2, includes allowable subject matter because the heat dissipation system according to claim 1, wherein the first liquid cooling assembly (comprises a first condenser, a first evaporator, and a first heat conducting structure, the first condenser is disposed at a top of the heat dissipation cavity, and the first evaporator is in contact with the first power cavity and is disposed below the first condenser; and the first heat conducting structure connects the first evaporator and the first condenser to form a circulation loop, and a cooling working substance circulating in the circulation loop is used to bring heat of the first evaporator to the first condenser.
Per claims 3-20, depends on claim 2 therefore allowable for the same reason.
Email Communication
3. Applicant is encouraged to authorize the Examiner to communicate via email by filing form PTO/SB/439 either via USPS, Central Fax, or EFS-Web. See MPEP 502.01, 502, 502.05.
Conclusion
4. The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Zeighami et al. US2015/0048950 discloses an assembly comprising: a plurality of heat exchangers configured to transfer heat to a heat disposal medium from liquid coolant passed in heat exchange relationship through a set of rack-mounted modular electronic equipment units.
Matsushima et al. US2010/0027216 discloses a cooling system comprising an inside room for containing therein an electronic device, an air conditioning area under its floor level, an air conditioner and a ceiling air duct.
Applicants are directed to consider additional pertinent prior are included on the Notice of References Cited (PTOL 892) attached herewith. The Examiner has pointed out particular references contained in the prior art of record within the body of this action for the convenience of the Applicant. Although the specified citations are representative of the teachings in the art and are applied to the specific limitations within the individual claim, other passages and figures may apply. Applicant, in preparing the response, should consider fully the entire reference as potentially teaching all or part of the claimed invention, as well as the context of the passage as taught by the prior art or disclosed by the Examiner.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MICHAEL A MATEY whose telephone number is (571)270-5648. The examiner can normally be reached Monday-Friday 8-5 EST.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, JAYPRAKASH GANDHI can be reached at 5712723740. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/MICHAEL A MATEY/Primary Examiner, Art Unit 2841
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