Tech Center 2800 • Art Units: 2835 2841
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18885432 | ELECTRONIC DEVICE INCLUDING SLIDE-OUT DISPLAY | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18659325 | HEAT SINK ASSEMBLY WITH SPRING-ADJUSTABLE HEAT PIPE FOR IMPROVED HEAT DISSIPATION, AND RELATED CIRCUIT BOARD ASSEMBLIES AND ASSEMBLY METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18724112 | CONTROL DEVICE FOR HEAT DISSIPATION OF SERVER AND METHOD FOR CONTROLLING HEAT DISSIPATION OF SERVER | Non-Final OA | SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. |
| 18896111 | CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18651380 | Smart Liquid Cooling Manifold | Final Rejection | Dell Products L.P. |
| 18886369 | COOLING MODULE | Non-Final OA | 1FINITY Inc. |
| 18601337 | PRINTED CIRCUIT BOARD | Non-Final OA | Hamilton Sundstrand Corporation |
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