Tech Center 2800 • Art Units: 2835 2838 2841
This examiner grants 80% of resolved cases
Michael A. Matey has resolved 596 cases in Art Unit 2835 with an allowance rate of 79.9%. The median days to allowance is 761, which is relatively fast for Tech Center 2800. The interview lift is 18.3%, indicating that interviews are highly effective at moving cases toward allowance. Given the 79.9% baseline, an interview can be a decisive factor in reaching a grant. The 761-day median pendency is a favorable metric for applicants.
With 596 resolved cases, the data is robust and provides a reliable look at his practices. The 18.3% lift shows that the examiner is open to direct communication. Practitioners should consider the 761-day timeline when planning their prosecution strategy. In Art Unit 2835, the 79.9% allowance rate is a strong indicator of success. The 18.3% lift provides a tactical option for resolving rejections.
In Tech Center 2800, the 761-day median is an attractive metric for budgeting and planning. The 18.3% interview lift can be used to further improve the already high 79.9% baseline. Applicants can rely on the 761-day median as a benchmark for pendency. This profile suggests a consistent and predictable path to allowance under Michael A. Matey.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18885432 | ELECTRONIC DEVICE INCLUDING SLIDE-OUT DISPLAY | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18795871 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18866995 | GLASSES ARM DESIGN | Non-Final OA | Apple Inc. |
| 18763932 | HEAD MOUNTABLE DISPLAY | Non-Final OA | Apple Inc. |
| 18865743 | PASSIVE COOLING APPARATUS FOR COOLING OF IMMERSION FLUID AND POWER CONVERSION EQUIPMENT AND RELATED SYSTEMS | Non-Final OA | Eaton Intelligent Power Limited |
| 18787644 | HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE | Non-Final OA | HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD. |
| 18344308 | COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS | Non-Final OA | Intel Corporation |
| 18285542 | CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18931923 | THERMAL ISLANDING HEATSINK | Non-Final OA | Micron Technology, Inc. |
| 18896111 | CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18724112 | CONTROL DEVICE FOR HEAT DISSIPATION OF SERVER AND METHOD FOR CONTROLLING HEAT DISSIPATION OF SERVER | Non-Final OA | SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. |
| 18939839 | PLUGGABLE MODULE AND CAGE FOR IMPROVING AIRFLOW IN NETWORK SWITCH SYSTEM | Non-Final OA | Arista Networks, Inc. |
| 18886369 | COOLING MODULE | Non-Final OA | 1FINITY Inc. |
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