Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claims 22-23 and 25 are rejected under 35 U.S.C sec. 103 as being unpatentable as obvious in view of United States Patent Pub. No.: US20070001336A1 to Nishibori that was filed in 2003 (hereinafter “NISHIBORI”) and in view of Japanese Patent Pub. No.: JP H0938982 A to Koyama that was filed in 1997.
PNG
media_image1.png
716
582
media_image1.png
Greyscale
NISHIBORI discloses “..22. (Original) An insert-molding tool for manufacturing a seat cushion, comprising: (See paragraph 11)
a bowl having a body portion and a first plurality of side walls; (see Fig. 5 where the seat cushion is made using a female die 11 having a body portion and a number of side walls)”.
PNG
media_image2.png
770
602
media_image2.png
Greyscale
The primary reference is silent but KOYAMA teaches “...a plurality of pins on a top surface of the body portion of the bowl for securely receiving a mat; (see Fig. 27 where the mold has pins 252 that can enter and provide a space 251 in the mold to prevent the material from the entering of the space 251 so a second sensor or the like can enter the space later post production; As shown in FIG. 27 (b), the molding apparatus of this embodiment has a cylindrical hollow magnet 251 having a through hole and a detecting device 2 press-fitted into the through hole of the hollow magnet 251.
The insert product 205 is formed by insert molding using an integrated product including
This is to manufacture a magnetic detection device in which is sealed with resin.
As shown in FIG. 27A, the insert 205 is press-fitted until the datum A of the detecting device 252 is aligned with the datum B of the hollow magnet 251, thereby detecting the detecting device 15
2 has the structure that determines the distance e (the distance from the magnetized surface of the hollow magnet 251 to the tip surface of the detection device 252) e with the best output characteristics.
As shown in FIG. 26, the molding apparatus according to the present embodiment is equipped with a mold 201 composed of a fixed mold 211 and a movable mold 212 that can be opened and closed in the left and right directions, and a heating means. The main elements are four holding pins 202 that are movable back and forth, and two support pins 207 that are provided in the mold 201 and that are provided with a heating means and are movable back and forth.)
PNG
media_image3.png
558
600
media_image3.png
Greyscale
a lid having a body portion and a second plurality of side walls, the body portion of the lid having a plurality of through holes; and (see FIG. 23-27 where the mold has an upper portion 145 and a bottom portion 145 and a space and the pin provides a through point through the material to leave a hole in the material post production via element 252 and 251 shown in Fig. 27; As shown in FIG. 23 (a), the thin-walled forming portion 145 is held by the holding pin 142 in the resin injection direction.
You may arrange | position it behind rather than. Note that FIG. 23B is a sectional view in the direction of the arrow in FIG. 23A, and the thin-walled forming portion 145 is arranged to project into the cavity 143 so as to make one turn with respect to the insert 140. It was done. Of course, a thin-walled forming portion that replaces the thin-walled forming portion 145 may be provided on the insert 140 side.
There is a hybrid IC in which a semiconductor IC, a capacitor and the like are mounted on a ceramic substrate as one of magnetic detection devices using a semiconductor IC. As a waterproof and oilproof measure for the sensor element of this hybrid IC, It is conceivable that insert molding is performed using the molding apparatus of the first and second embodiments and that the surface is resin-sealed. However, if the hybrid IC is used as an insert product and integrated resin molding is performed, the resin molding pressure becomes high (usually 20
Since it is up to 80 MPa), there is a problem that the ceramic substrate is cracked by stress.
Therefore, primary molding is performed with a molding material (epoxy material or the like having high fluidity) including a sensor element arranged at one end of the ceramic substrate under a resin molding pressure (6 to 8 MPa) that does not cause cracks in the ceramic substrate. If the molded IC formed by the above is used as an insert product, the insert molding can be performed by the molding apparatus of the first and second embodiments without cracking of the ceramic substrate.)
PNG
media_image4.png
234
288
media_image4.png
Greyscale
a moving plate having a plate base and a plurality of clamping pins (see pins 202) extended downwardly from a bottom surface of the plate base, wherein the plurality of clamping pins is configured to penetrate through the corresponding through holes and to engage the corresponding pins of the bowl, (see FIG. 21-29 where there is a first top side die plate and a second bottom side die plate and a moving die member with pins that are powered by power sources on either side of the die 203 where an electric heating device can be inserted into the device via pins which are four holding pins 202 The mold 201 has a cavity 213 corresponding to the outer peripheral shape of the molded product formed by the surfaces of the closed fixed mold 211 and the movable mold 212 that face each other. Further, gates 214 for filling the cavity 213 with a molten resin (not shown) are provided at both upper ends of the mold 201. Two holding pins 202 are installed in each of the fixed die 211 and the movable die 212 in a state where the holding pins 202 are laterally fitted and inserted in a substantially central portion of the side surface of the die 201, and are movable back and forth toward the inside of the cavity 213. It is provided. Each holding pin 202 has a position between the position where the side surface of the hollow magnet 251 of the insert 205 arranged in the cavity 213 is held by its tip and the position where the tip portion substantially coincides with the mold surface forming the cavity 213. There is provided an air cylinder (not shown) for driving the air cylinder back and forth. This holding pin 202)
and wherein when a bottom surface of the plate base is placed on a top surface of the lid such that the lid engages the lid to form a liquid leakage-proof space. (see paragraph 2 and FIG. 5 where the resulting device is water proof; Since it is not necessary to heat the holding pin 2 after the holding pin 2 is retracted while the molten resin 6 is further filled if necessary, the power supply to the electric heater 3 is stopped. As a result, as shown in FIG. 7, the molten resin 6 around each holding pin 2 flows into the pin hole after the holding pin 2 is removed and is sufficiently fused, and the pin hole almost disappears and is not fused. No part remains. Then, the molten resin 6 in the cavity 13 is cooled and solidified, so that the insert 5 is completely sealed with the resin to form a molded article having high waterproofness and oil proofness.)
It would have been obvious for one of ordinary skill in the art to combine the teachings of KOYAMA with the disclosure of NISHIBORI before the effective filing date of the present disclosure was made with a reasonable expectation of success since KOYAMA teaches that an improved molding can be made using a machine that has a first upper member and a second lower member and a third and fourth lateral pressing member. The device can include four locking pins 252 shown in FIG. 26-28. These locking pins can be heating to a high temperature and pierce the molded resin material to leave holes in the resin and then retreat back from the resin into the machine. This can cause the molded resin to not stick to the pins. Then an insert can be added to the hole for a waterproof assembly. After that, the entire molten resin 106 filled in the cavity 113 is cooled and solidified to form a highly waterproof molded product in which the insert 105 is sufficiently sealed with the resin. For example, a magnetic sensor device 251 can be added to the hole for a magnetic device sealed in the resin.
Nishibori discloses the so-called bowl that is configured to receive resin. It would have been obvious to provide a "substitution of parts",
It would have been obvious for substituting the male die of Fig. 26 (which appears to be engaging from all 4 sides, rather than a die coming from just the top of Nishibori) with that of Fig. 5. It would have been obvious for water proofing the device to create electrical components as this is well known in the art and within the skill of one of ordinary skill in the art.
PNG
media_image5.png
766
564
media_image5.png
Greyscale
Koyoma teaches “...23. (Original) The insert-molding tool of claim 22, wherein each of the pins includes a base extending from the top surface of the bowl and a top portion extending from the top surface of the base”. (see Fig. 21-28 where the die machine includes a first and a second pins that can extend on the sides and on the top in FIG. 27 and protrude through and can be heated so an aperture remains so a sensor or element can be added to the finished product)
It would have been obvious for one of ordinary skill in the art to combine the teachings of KOYAMA with the disclosure of NISHIBORI before the effective filing date of the present disclosure was made with a reasonable expectation of success since KOYAMA teaches that an improved molding can be made using a machine that has a first upper member and a second lower member and a third and fourth lateral pressing member. The device can include four locking pins 252 shown in FIG. 26-28. These locking pins can be heating to a high temperature and pierce the molded resin material to leave holes in the resin and then retreat back from the resin into the machine. This can cause the molded resin to not stick to the pins. Then an insert can be added to the hole for a waterproof assembly. After that, the entire molten resin 106 filled in the cavity 113 is cooled and solidified to form a highly waterproof molded product in which the insert 105 is sufficiently sealed with the resin. For example, a magnetic sensor device 251 can be added to the hole for a magnetic device sealed in the resin.
Claim 24 is rejected under 35 U.S.C sec. 103 as being unpatentable as obvious in view of United States Patent Pub. No.: US20070001336A1 to Nishibori that was filed in 2003 (hereinafter “NISHIBORI”) and in view of Japanese Patent Pub. No.: JP H0938982 A to Koyama that was filed in 1997 and in view of JP 2013116620 A to Taniguchi et al.
Taniguchi et al. teaches “...24. (Original) The insert-molding tool of claim 22, wherein the mat comprises sensors including a flexible printed circuit”. (see paragraph 2 from the bottom where a flexible printed circuit is added via a laminate operation; as for this mold release film, it is useful as the process film which is used when producing the etched circuit baseplate and the ceramic electronic part, the thermosetting metaplasia resin product and the decorative laminated sheet etc. Furthermore, the process film which is said here, when producing the printed circuit board and the ceramic electronic part, the thermosetting metaplasia resin product and the decorative laminated sheet etc, in order the metallic plate and for the resin not to glue, calls the film which is inserted between the said metallic plates and between the resin at the time of forming step, at the time of especially laminate production, at the time of flexible printed circuit board production, at the time of advanced composite material product production, at the time of sport leisure-time articles production it is something which is used for ideal.).
It would have been obvious for one of ordinary skill in the art to combine the teachings of TANIGUCHI with the disclosure of NISHIBORI before the effective filing date of the present disclosure was made with a reasonable expectation of success since TANIGUCHI teaches that an improved molding can be made by adding a flexible printed circuit board when the device is removed from the mold to provide an improved composite computing device.
Koyoma teaches “...25. (Original) The insert-molding tool of claim 22, wherein the bowl has 15 pins, the lid has 15 through holes, and the moving plate has 15 clamping pins”. (see Fig. 21-28 where there are four locking pins to provide the holes and prevent the flow from entering the holes via a heating device;( (see Fig. 21-28 where the die machine includes a first and a second pins that can extend on the sides and on the top in FIG. 27 and protrude through and can be heated so an aperture remains so a sensor or element can be added to the finished product)
It would have been obvious for one of ordinary skill in the art to combine the teachings of KOYAMA with the disclosure of NISHIBORI before the effective filing date of the present disclosure was made with a reasonable expectation of success since KOYAMA teaches that an improved molding can be made using a machine that has a first upper member and a second lower member and a third and fourth lateral pressing member. The device can include four locking pins 252 shown in FIG. 26-28. These locking pins can be heating to a high temperature and pierce the molded resin material to leave holes in the resin and then retreat back from the resin into the machine. This can cause the molded resin to not stick to the pins. Then an insert can be added to the hole for a waterproof assembly. After that, the entire molten resin 106 filled in the cavity 113 is cooled and solidified to form a highly waterproof molded product in which the insert 105 is sufficiently sealed with the resin. For example, a magnetic sensor device 251 can be added to the hole for a magnetic device sealed in the resin.
Claim 26 is rejected under 35 U.S.C sec. 103 as being unpatentable as obvious in view of United States Patent Pub. No.: US20070001336A1 to Nishibori that was filed in 2003 (hereinafter “NISHIBORI”) and in view of Japanese Patent Pub. No.: JP H0938982 A to Koyama that was filed in 1997 and in view of Chinese Patent Pub. No.: 103321687 A to FREUD et al. that was filed in 2013.
The primary reference was silent but Freud et al. teaches “...26. (Original) The insert-molding tool of claim 22, wherein each of the through holes includes a bush. ‘ (see paragraph 17 where the foam can be made with a foam bushing to reduce the stress on the pad)
It would have been obvious for one of ordinary skill in the art to combine the teachings of FREUD with the disclosure of NISHIBORI before the effective filing date of the present disclosure was made with a reasonable expectation of success since FREUD teaches that an improved device can be molded with a bushing to alleviate stress and prevent cracking.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JEAN PAUL CASS whose telephone number is (571)270-1934. The examiner can normally be reached Monday to Friday 7 am to 7 pm; Saturday 10 am to 12 noon.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Scott A. Browne can be reached at 571-270-0151. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/JEAN PAUL CASS/Primary Examiner, Art Unit 3666