Prosecution Insights
Last updated: October 01, 2026
Application No. 18/800,278

THROUGH-HOLE ELECTRODE SUBSTRATE

Non-Final OA §DOUBLEPATENT
Filed
Aug 12, 2024
Priority
Nov 21, 2013 — JP 2013-241392 +6 more
Examiner
JEAN BAPTISTE, WILNER
Art Unit
Tech Center
Assignee
Dai Nippon Printing Co., Ltd.
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
1m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
956 granted / 1104 resolved
+26.6% vs TC avg
Moderate +5% lift
Without
With
+5.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
21 currently pending
Career history
1119
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
62.4%
+22.4% vs TC avg
§102
25.0%
-15.0% vs TC avg
§112
9.0%
-31.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1104 resolved cases

Office Action

§DOUBLEPATENT
DETAILED ACTION Notice of Pre-AIA or AIA Status 1. The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . CROSS-REFERENCE TO RELATED APPLICATIONS 2. This application is a continuation of U.S. Patent Application Serial No. 17/725,627, filed on April 21, 2022, which, in turn, is a continuation of U.S. Patent Application Serial No. 16/936,519 (now U.S. Patent No. 11,362,028), filed on July 23, 2020, which, in turn, is a continuation of U.S. Patent Application Serial No. 16/743,145 (now U.S. Patent Application No. 10,790,221), filed on January 15, 2020, which, in turn, is a continuation of U.S. Patent Application Serial No. 16/266,203 (now U.S. Patent No. 10,580,727), filed on February 4, 2019, which, in turn, is a continuation of U.S. Patent Application Serial No. 15/159,323 (now U.S. Patent No. 10,256,176), filed on May 19, 2016, which in turn, is based upon and claims the benefit of priority from Japanese Patent Application No. 2013-241392, filed on November 21, 2013, and PCT Application No. PCT/JP2014/080649, filed on November 19, 2014, the entire contents of which are incorporated herein by reference. Double Patenting 3. The non-statutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A non-statutory obviousness-type double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); and In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969). A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on a non-statutory double patenting ground provided the conflicting application or patent either is shown to be commonly owned with this application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. Effective January 1, 1994, a registered attorney or agent of record may sign a terminal disclaimer. A terminal disclaimer signed by the assignee must fully comply with 37 CFR 3.73(b). 4. Claim 1 is/are rejected on the ground of non-statutory obviousness-type double patenting as being unpatentable over claims 1-2 of U.S. Patent No. 12,080,637 B2 (here and after ‘637) in view of claim 1 or 2 of U.S. Patent No. 11,362,028-B2 (here and after ‘028). Although the conflicting claims are not identical, they are not patentably distinct from each other because the following rationale. 5. Claim 1 reads in claims 1-2, of U.S. Patent No. 12,080,637 B2 respectively with no non-obvious difference between the subject matter included in pending claim 1, and in claims 1-2, of ‘637. The only difference as a comprising claim being “a conductive layer arranged within the through-hole; and an insulating resin layer overlapping with the through-hole in a plan view” as disclosed in claim 1. As both references disclose a through-hole electrode substrate with similar structure, the differences between these claims and the claims of ‘637 in view of claims 1 or 2 of ‘028 are seen as obvious. Therefore, at the time of invention, it would have been obvious to a person having ordinary skill in the art having the teachings of the instant application and the claims of ‘637 in view of claims ‘028 to maintain electrical continuity between layers, and using the Insulating resin to protect the pad, seal the vias, improve mechanical strength, and support assembly and environmental reliability. As per claims 2-13, these claims are at least rejected for their dependencies, directly or indirectly, on the rejected claim 1, above. Therefore, they are rejected for the same reason set forth in paragraph above. 6. The following table shows the corresponding conflicting claims between the instant application and U.S. Patent No. 12,080,637 B2. Application 18/800278 U.S. Patent No. 12,080,637 B2 1. A through-hole electrode substrate comprising: a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface; a conductive layer arranged within the through-hole; and an insulating resin layer overlapping with the through-hole in a plan view and contacting the conductive layer exposed to at least one of the first surface and the second surface, wherein the through-hole includes a minimum aperture part between the first aperture and the second aperture, an area of the minimum aperture part is the smallest among a plurality of areas of the through-hole in the plan view, and the insulating layer has a gas discharge function. 1. A through-hole electrode substrate comprising: a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than an area of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, an area of the minimum aperture part being the smallest among a plurality of areas of the through-hole in a planar view; a first member arranged within the through-hole; and an insulating resin layer contacting the first member exposed to one of the first surface and the second surface. 2. The through-hole electrode substrate according to claim 1, wherein the insulating resin layer has a gas discharge function. Allowable Subject Matter 7. Claims 1-13 would be allowable over the prior art of record upon a timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to WILNER JEAN BAPTISTE whose telephone number is (571)270-7394. The examiner can normally be reached M-T 8:00-6:00. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dale Page can be reached at 571-270-7877. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /W.J/Examiner, Art Unit 2899 /DALE E PAGE/Supervisory Patent Examiner, Art Unit 2899
Read full office action

Prosecution Timeline

Aug 12, 2024
Application Filed
Aug 27, 2026
Non-Final Rejection mailed — §DOUBLEPATENT (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12745404
SEMICONDUCTOR MEMORY DEVICE
3y 0m to grant Granted Sep 22, 2026
Patent 12745474
PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT
2y 6m to grant Granted Sep 22, 2026
Patent 12733481
DEVICE HAVING DIFFERENT FIRST METALLIZATION LAYER AND FIRST BURIED METALLIZATION LAYER ARCHITECTURES AND METHOD OF MANUFACTURING SAME
2y 8m to grant Granted Sep 08, 2026
Patent 12721223
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
3y 4m to grant Granted Aug 25, 2026
Patent 12713917
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
3y 10m to grant Granted Aug 18, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
92%
With Interview (+5.1%)
2y 3m (~1m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1104 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month