Prosecution Insights
Last updated: August 17, 2026

Examiner: JEAN BAPTISTE, WILNER

Tech Center 2800 • Art Units: 2823 2897 2899

This examiner grants 86% of resolved cases

Performance Statistics

86.5%
Allow Rate
+18.5% vs TC avg
1,118
Total Applications
+5.1%
Interview Lift
833
Avg Prosecution Days
Based on 1098 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
25.1%
§102 Novelty
62.5%
§103 Obviousness
8.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18592697 INTEGRATED CIRCUIT DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18716464 SEMICONDUCTOR DEVICE, ELECTRONIC EQUIPMENT, AND WAFER Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18551648 PHOTODETECTION DEVICE AND ELECTRONIC DEVICE Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18649636 VERTICALLY COUPLED INDUCTORS IN SUBSTRATE Non-Final OA QUALCOMM Incorporated
18043628 LOW TEMPERATURE BONDING OF MICRODEVICE INTEGRATION INTO A SYSTEM SUBSTRATE Non-Final OA VueReal Inc.
18671088 DISPLAY DEVICE Non-Final OA Japan Display Inc.
18732621 SEMICONDUCTOR DEVICE INCLUDING RESONANT TUNNELING LAYER Non-Final OA SK hynix Inc.
18731821 BONDED STRUCTURE WITH HALF-OVAL BONDING PAD PAIR DESIGN AND METHOD OF FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18398856 SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A VERTICAL CHANNEL Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18327179 PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18173086 PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SIDEWALLS AND METHOD OF FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18641927 Apparatus and Bonding Process for Wafer Bonding Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18625651 REDUCE WELL DOPANT LOSS IN FINFETS THROUGH CO-IMPLANTATION Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18400949 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18628059 TRANSISTOR CONTACT STRUCTURE WITH UPPER LEVEL INSULATING SPACER AND METHOD OF MAKING THE SAME Non-Final OA SANDISK TECHNOLOGIES LLC

Facing This Examiner?

IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.

Build Your Strategy

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month