Tech Center 2800 • Art Units: 2823 2899
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18480148 | OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18446844 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18315689 | HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18390159 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18514851 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18501558 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18480366 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18551648 | PHOTODETECTION DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18303177 | CHIP ARRANGEMENT | Final Rejection | Infineon Technologies AG |
| 18568070 | Backing Films For Displays With Curved Surfaces | Non-Final OA | Apple Inc. |
| 18458918 | 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding | Non-Final OA | Apple Inc. |
| 18178820 | 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding | Non-Final OA | Apple Inc. |
| 17958734 | INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS | Final Rejection | International Business Machines Corporation |
| 18173086 | PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SIDEWALLS AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18091676 | TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN NUMBERS | Non-Final OA | Intel Corporation |
| 18614583 | SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES USING REGISTRATION MARKS | Non-Final OA | Micron Technology, Inc. |
| 18518735 | CRYSTALLINE INZNO OXIDE SEMICONDUCTOR, METHOD OF FORMING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE CRYSTALLINE INZNO OXIDE SEMICONDUCTOR | Non-Final OA | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) |
| 18043628 | LOW TEMPERATURE BONDING OF MICRODEVICE INTEGRATION INTO A SYSTEM SUBSTRATE | Final Rejection | VueReal Inc. |
| 18144162 | ELECTRONIC PACKAGE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 17813972 | STACKED CHIP SCALE OPTICAL SENSOR PACKAGE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18196070 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18498766 | MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV) | Non-Final OA | Menlo Microsystems, Inc. |
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