DETAILED ACTION
This Action is responsive to the communication filed on 08/22/2024.
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
Claims 2-8 are rejected under 35 U.S.C. 112(b) as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, regards as the invention.
Claim 2, which depends from Claim 1, recites the limitation: “an encapsulation member for covering the first electrodes and the semiconductor light emitting chip, wherein the insulating material serves as the encapsulation member” (emphasis added). Further, Claim 1 recites the limitation: “an insulating material is filled in-between inner lateral surfaces of the first electrodes” (emphasis added). Claim 2 has been rendered indefinite because it is unclear whether the limitation “the insulating material serves as the encapsulation member” intends to claim that the insulating material of Claim 1 that is filled in-between the inner lateral surfaces of the first electrodes also includes covering the first electrodes and the semiconductor light emitting chip or intends to claim that the insulating material in Claim 2 is redefined as the encapsulation member covering the first electrodes and the semiconductor light emitting chip previously introduced within Claim 2.
Claim 3 is also rejected under 35 U.S.C. 112(b) as being indefinite due to the claims’ dependency to Claim 2.
Claim 4, which depends from Claim 1, recites the limitation: “an insulation layer with a thru hole, under the semiconductor light emitting chip, wherein the insulating material serves as the insulation layer” (emphasis added). Further, Claim 1 recites the limitation: “an insulating material is filled in-between inner lateral surfaces of the first electrodes” (emphasis added). Claim 4 has been rendered indefinite because it is unclear whether the limitation “the insulating material serves as the insulation layer” intends to claim that the insulating material of Claim 1 that is filled in-between the inner lateral surfaces of the first electrodes also includes a thru hole or intends to claim that the insulating material in Claim 2 is redefined as the insulating layer previously introduced within Claim 2.
Claims 5-7 are also rejected under 35 U.S.C. 112(b) as being indefinite due to the claims’ dependency to Claim 4.
Claim 8, which depends from Claim 1, recites the limitation: “an insulation layer with a thru hole, under the semiconductor light emitting chip, wherein the insulating material serves as the insulation layer” (emphasis added). Further, Claim 1 recites the limitation: “an insulating material is filled in-between inner lateral surfaces of the first electrodes” (emphasis added). Claim 8 has been rendered indefinite because it is unclear whether the limitation “the insulating material serves as the insulation layer” intends to claim that the insulating material of Claim 1 that is filled in-between the inner lateral surfaces of the first electrodes also includes a thru hole or intends to claim that the insulating material in Claim 8 is redefined as the insulating layer previously introduced within Claim 8.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1 and 9 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hsieh (US 2015/0349231).
Regarding claim 1, Hsieh (see, e.g., FIG. 2B) discloses a semiconductor light emitting device comprising:
a semiconductor light emitting chip 30 (Para 0029); and
first electrodes 511, 512 (left); 511, 512 (right) electrically connected to the semiconductor light emitting chip 30, with the first electrodes 511, 512 (left); 511, 512 (right) each having a planar area larger than that of the semiconductor light emitting chip 30, wherein lower surfaces e.g., lower surfaces of 511, 512 (left); 511, 512 (right) of the first electrodes 511, 512 (left); 511, 512 (right) are exposed externally, and an insulating material 261 is filled in-between inner lateral surfaces e.g., inner lateral surfaces of 511, 512 (left); 511, 512 (right) of the first electrodes 511, 512 (left); 511, 512 (right) (Para 0028, Para 0030).
Regarding claim 9, Hsieh (see, e.g., FIG. 2B) teaches the semiconductor light emitting device of claim 1, wherein the first electrode 511, 512 (left); 511, 512 (right) and the semiconductor light emitting chip 30 are electrically connected through a conductive adhesive material e.g., anisotropic conductive adhesive material (Para 0029).
Claims 1 and 10 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ting (US 2015/0325748).
Regarding claim 1, Ting (see, e.g., FIG. 4B, inverted) discloses a semiconductor light emitting device comprising:
a semiconductor light emitting chip 122, 124 (Para 0071); and
first electrodes 126d2, 128d2 electrically connected to the semiconductor light emitting chip 122, 124, with the first electrodes 126d2, 128d2 each having a planar area larger than that of the semiconductor light emitting chip 122, 124, wherein lower surfaces of the first electrodes 126d2, 128d2 are exposed externally, and an insulating material 130d is filled in-between inner lateral surfaces e.g., inner lateral surfaces of 126d2, 128d2 of the first electrodes 126d2, 128d2 (Para 0080).
Regarding claim 10, Ting (see, e.g., FIG. 4B, inverted) teaches the semiconductor light emitting device of claim 1, wherein the lower surfaces e.g., lower surfaces of 126d2, 128d2 of the first electrodes 126d2, 128d2 and the lower surface e.g., lower surface of 130d of the encapsulation member 130d are joined evenly without a step.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANTONIO CRITE whose telephone number is (571) 270-5267. The examiner can normally be reached Monday - Friday, 10:00 am - 6:30 pm.
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/ANTONIO B CRITE/Primary Examiner, Art Unit 2817
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