Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2891 2892
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18586112 | 3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL STRUCTURES, SOURCE/DRAIN REGIONS, AND GATE STRUCTURES AT DIFFERENT LEVELS | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18741244 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18028299 | ARRAY SUBSTRATE AND ELECTRONIC APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18545492 | SEMICONDUCTOR DEVICE WITH MULTIPLE DEVICE REGIONS AND METHOD OF FABRICATION THEREFOR | Non-Final OA | NXP USA, INC. |
| 18736026 | SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18513260 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18558233 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18576110 | DISPLAY SYSTEM | Final Rejection | SONY GROUP CORPORATION |
| 18523129 | THREE-DIMENSIONAL MEMORY DEVICE WITH VARIABLE WORD LINE VIA CONTACT DENSITY AS FUNCTION OF CONTACT DEPTH AND METHODS OF FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18669948 | SEMICONDUCTOR STRUCTURE WITH REDUCED BODY LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18662168 | HIGHLY PHYSICAL ION RESISTIVE SPACER TO DEFINE CHEMICAL DAMAGE FREE SUB 60NM MRAM DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18603779 | INTEGRATED CIRCUIT PACKAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18596123 | MECHANISMS FOR GROWING EPITAXY STRUCTURE OF FINFET DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 17875206 | HARDENED INTERLAYER DIELECTRIC LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18633496 | LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE USING THE SAME | Non-Final OA | Lextar Electronics Corporation |
| 18641195 | LIGHT-EMITTING DEVICE | Non-Final OA | EPISTAR CORPORATION |
| 18479944 | Package having component carrier with cavity and electronic component as well as functional filling medium therein | Non-Final OA | AT&S Austria Technologie & Systemtechnik AG |
| 18426159 | METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Final Rejection | JMJ Korea Co., Ltd. |
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