DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Specification
The title of the invention is not descriptive. The current title is highly vague and provides little informative value for a person of ordinary skill in the art of via detection whether the document warrants further review. A new title is required that is clearly indicative of the invention to which the claims are directed. MPEP 606.01 guides that a descriptive title may result in slightly longer title, but the loss in brevity of title will be more than offset by the gain in its informative value in indexing, classifying, searching, etc.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(d):
(d) REFERENCE IN DEPENDENT FORMS.—Subject to subsection (e), a claim in dependent form shall contain a reference to a claim previously set forth and then specify a further limitation of the subject matter claimed. A claim in dependent form shall be construed to incorporate by reference all the limitations of the claim to which it refers.
The following is a quotation of pre-AIA 35 U.S.C. 112, fourth paragraph:
Subject to the following paragraph [i.e., the fifth paragraph of pre-AIA 35 U.S.C. 112], a claim in dependent form shall contain a reference to a claim previously set forth and then specify a further limitation of the subject matter claimed. A claim in dependent form shall be construed to incorporate by reference all the limitations of the claim to which it refers.
Claims 9, 10, 14, and 15 are rejected under 35 U.S.C. 112(d) or pre-AIA 35 U.S.C. 112, 4th paragraph, as being of improper dependent form for failing to further limit the subject matter of the claim upon which it depends. Claims 9, 10, 14, and 15 are dependent on a claim directed to the structure of a device but only recite results from the use of the device, rather than further limiting the structure of the device. The claims only describe the images obtained. As an analogy, a dependent claim that only describes an image of a flower by the colors the petals and stem do not further limit an independent claim drawn to the structure of a digital camera. The camera of the independent claim would be the same as the camera of the dependent claim. Applicant may cancel the claim(s), amend the claim(s) to place the claim(s) in proper dependent form, rewrite the claim(s) in independent form, or present a sufficient showing that the dependent claim(s) complies with the statutory requirements.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 2, 16, and 17 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Jeong et al. (KR 10-2022-0105770).
Jeong shows an inspection system of glass holes as follows:
1. A via detection device (e.g Fig. 5) for a through glass via (TGV) glass substrate, comprising:
a first depth-of-field (DOF) camera (vision camera 100 of inspection unit 1 120) and a first collimated light source ("a light source 200 with strong straightness" of inspection unit 1 120) arranged on a glass substrate with at least one glass substrate via, and orthogonally facing an upper surface of the glass substrate (please note that "orthogonally facing" does not limit which side of the substrate "facing" is from, thus can be facing a surface from the top or the bottom);
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a second DOF camera (vision camera 100 of inspection unit 2 140) and a second collimated light source arranged below the glass substrate (inspection unit 2 faces the bottom surface and also once the glass substrate is inverted by inversion unit 130. The "bottom" is not distinguished as to which is the bottom and which is the top. Please also note that the claim does not require the camera to also be below the glass substrate, i.e., the claim does not require both the camera and light source to be on the same side of the glass substrate), and orthogonally facing a lower surface of the glass substrate; and
a microcontroller unit (inspection module) electrically connected with the first DOF camera, the first collimated light source, the second DOF camera and the second collimated light source;
wherein the first collimated light source and the second collimated light source are respectively configured to emit a first collimated beam and a second collimated beam ("a light source 200 with strong straightness") to the glass substrate (objects worked upon by an apparatus do not serve to structurally distinguish. See MPEP 2115), an optical band of the first collimated beam is different from or identical to an optical band of the second collimated beam (inherent as there are no other possibilities), and the first DOF camera and the second DOF camera are respectively configured to obtain a first image and a second image (inherent with cameras), and the microcontroller unit is configured to obtain at least one detection result of the at least one glass substrate via according to the first image and the second image ("a determination module that determines whether the target image is good or bad."; "Thus, the diameter and shape of the top of the through hole and the diameter of the waist are measured at the same time.").
2. The via detection device for the TGV glass substrate according to claim 1, wherein the detection result comprises at least one of an opening diameter of an upper opening of the glass substrate via, an opening diameter of a lower opening of the glass substrate via, an opening coordinate, an opening roundness, a crack detection result, a dustiness detection result, a dot damage detection result, a scratch detection result, an impurity detection result, an edge collapse detection result, a via diameter of the glass substrate via, a hole congestion detection result and an offset amount between the upper opening and the lower opening of the glass substrate via ("Thus, the diameter and shape of the top of the through hole and the diameter of the waist are measured at the same time.").
16. A via detection method for a through glass via (TGV) glass substrate, being executed by a via detection device of the TGV glass substrate; wherein the via detection device comprises a first depth-of-field (DOF) camera, a first collimated light source, a second DOF camera and a second collimated light source; the first DOF camera and the first collimated light source are arranged on a glass substrate with at least one glass substrate via, and orthogonally face an upper surface of the glass substrate; the second DOF camera and the second collimated light source are arranged below the glass substrate, and orthogonally face a lower surface of the glass substrate (See citation given for claim 1); the via detection method comprises:
controlling, by a microcontroller unit of the via detection device for the TGV glass substrate, the first DOF camera, the first collimated light source, the second DOF camera and the second collimated light source so that the first collimated light source and the second collimated light source respectively emit a first collimated beam and a second collimated beam to the glass substrate, and the first DOF camera and the second DOF camera respectively obtain a first image and a second image, wherein an optical band of the first collimated beam is different from or identical to an optical band of the second collimated beam (See citation given for claim 1 where the act flows from functions of the structure) ; and
obtaining, by the microcontroller unit of the via detection device for the TGV glass substrate, at least one detection result of the at least one glass substrate via according to the first image and the second image (See citation given for claim 1 where the act flows from functions of the structure).
17. The via detection method for the TGV glass substrate according to claim 16, wherein the detection result comprises at least one of an opening diameter of an upper opening of the glass substrate via, an opening diameter of a lower opening of the glass substrate via, an opening coordinate, an opening roundness, a crack detection result, a dustiness detection result, a dot damage detection result, a scratch detection result, an impurity detection result, an edge collapse detection result, a via diameter of the glass substrate via, a hole congestion detection result and an offset amount between the upper opening and the lower opening of the glass substrate via (See citation given for claim 2).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 1-10 and 16-20 is/are rejected under 35 U.S.C. 103 as being unpatentable over Goers et al. (US 20180003477).
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Goers shows the measurement of through holes in a substrate as follows:
1. A via detection device (See e.g. Fig. 4) for a through glass via (TGV) glass substrate, comprising:
a first depth-of-field (DOF) camera (camera 106') and a first collimated light source (coaxial light source 130; Para. [0043]: "collimated illuminator") arranged on a glass substrate with at least one glass substrate via, and orthogonally facing an upper surface of the glass substrate;
a second DOF camera and a second collimated light source arranged below the glass substrate, and orthogonally facing a lower surface of the glass substrate (Para. [0057]:"In some embodiments, multiple cameras 106, 106′ may be utilized to increase the speed of scanning the substrate. In some embodiments, multiple illuminator 108 may be used in conjunction with the multiple cameras." See discussion of the breadth of the claim 1 with regards to Jeong above with regards to the relative terms facing, below, lower, etc.); and
a microcontroller unit (Para. [0048]:"controller 140" or "processor 144") electrically connected with the first DOF camera, the first collimated light source, the second DOF camera and the second collimated light source (Goers does not explicitly teach that the second camera and light source are connected to the controller. Before the effective filing date of the claimed invention, it would have been obvious to connect these elements to the controller in order to receive their signals and send control signals)
wherein the first collimated light source and the second collimated light source are respectively configured to emit a first collimated beam and a second collimated beam to the glass substrate (See Fig. 4 and Para. [0057]), an optical band of the first collimated beam is different from or identical to an optical band of the second collimated beam (inherent as there are no other possibilities), and the first DOF camera and the second DOF camera are respectively configured to obtain a first image and a second image, and the microcontroller unit is configured to obtain at least one detection result of the at least one glass substrate via according to the first image and the second image (Para. [0048]:"The processor 144 may be configured to process the image data to determine one or more geometric parameters, such as clear aperture size, of through holes represented in the image data.").
2. The via detection device for the TGV glass substrate according to claim 1, wherein the detection result comprises at least one of an opening diameter of an upper opening of the glass substrate via, an opening diameter of a lower opening of the glass substrate via, an opening coordinate, an opening roundness, a crack detection result, a dustiness detection result, a dot damage detection result, a scratch detection result, an impurity detection result, an edge collapse detection result, a via diameter of the glass substrate via, a hole congestion detection result and an offset amount between the upper opening and the lower opening of the glass substrate via (Para. [0048]:"The processor 144 may be configured to process the image data to determine one or more geometric parameters, such as clear aperture size, of through holes represented in the image data.").
3. The via detection device for the TGV glass substrate according to claim 1, wherein the first DOF camera and the first collimated light source are integrated into a first telecentric lens imaging module (Para. [00415]:"a modified system 101A including a different lighting arrangement that may be used with the telecentric lens 112."); the first telecentric lens imaging module comprises a light receiving lens module, and a telecentric lens module (telecentric lens 112) and an imaging module (Para. [0018]:"a camera comprising an image sensor and a lens having a depth of field greater than a thickness of the substrate." Alternatively, it would be obvious to use an additional lens(es) for the predictable result of sizing an image to match a sensor); the first telecentric lens imaging module is in a T-shape (See Fig. 4), the imaging module is arranged at a top of the first telecentric lens imaging module (See Fig. 4), the light receiving lens module is arranged at a side of the first telecentric lens imaging module, and the telecentric lens module is arranged at a bottom of the first telecentric lens imaging module (See Fig. 4); the light receiving lens module receives a beam from an initial light source, the telecentric lens module is configured to emit the first collimated beam and receive a first sensing beam, and the imaging module is configured to generate the first image according to the first sensing beam (Para. [0041]).
4. The via detection device for the TGV glass substrate according to claim 3, wherein the second DOF camera and the second collimated light source are integrated into a second telecentric lens imaging module; the second telecentric lens imaging module comprises another light receiving lens module, another telecentric lens module and another imaging module; the second telecentric lens imaging module is in a T-shape, the other imaging module is arranged at a top of the second telecentric lens imaging module, the other light receiving lens module is arranged at a side of the second telecentric lens imaging module, and the other telecentric lens module is arranged at a bottom of the second telecentric lens imaging module; the other light receiving lens module receives a beam from another initial light source, and the other telecentric lens module is configured to emit the second collimated beam and receive a second sensing beam, and the other imaging module is configured to generate the second image according to the second sensing beam (this second telecentric module would be a duplicate of the first telecentric module as Goers does not state it is different nor provide any reason it is different).
5. The via detection device for the TGV glass substrate according to claim 4, further comprising: a main frame body (Para. [0047]: "translation stage 117 "); and a glass substrate supporting structure arranged in the main frame body and configured to contact at least a part of the glass substrate to support the glass substrate (See vertical supports in Fig. 4 as well as Para. [0047]).
6. The via detection device for the TGV glass substrate according to claim 5, further comprising: a base structure comprising a common base, a first base and a second base, wherein the first base and the second base are formed on opposite sides of the common base and are respectively configured to support and fix the first telecentric lens imaging module and the second telecentric lens imaging module, and the common base is arrange in the main frame body.
Goers teaches the telecentric modules are held in fixed positions or maybe operated in a scanning mode (see para. [0047], but does not show the structure that holds the telecentric modules so that they are fixed in place or scanned.
Official notice is taken that supports and common bases were well known. Before the effective filing date of the claimed invention, it would have been obvious to mount the telecentric modules (multiple modified systems 101A) to a common base so that they are in a fixed position. As such each of these modules would be mounted and thus each would have a mount or base from which they are mounted to the common base.
7. The via detection device for the TGV glass substrate according to claim 6, wherein the common base is fixed in the main frame body, and the glass substrate supporting structure is movably arranged in the main frame body, so that the glass substrate moves relative to the first telecentric lens imaging module and the second telecentric lens imaging module; or the common base is movably arranged in the main frame body, and the glass substrate supporting structure is fixed in the main frame body, so that the glass substrate moves relative to the first telecentric lens imaging module and the second telecentric lens imaging module through the movement of the common base. (Para. [0047]:"However, scanning of the substrate will allow all the holes in the substrate or all the holes within a desired volume of the substrate to be measured. Scanning involves providing relative motion between the substrate 100 and the imaging apparatus 104. In one embodiment, the camera 106 and backlight illuminator 108 (or camera 106′ and coaxial light source 130 in the embodiment of FIG. 4) may be held in fixed positions while the substrate 100 is translated in a plane perpendicular to the optical axis 115 of the camera 106 (i.e., the XY plane as shown in FIG. 2B). This will allow different sub-volumes of the substrate 100 to be moved into the field of view of the camera 106 over the scanning period. A translation stage 117 may be coupled to the substrate 100 and operated to translate the substrate 100 in the desired directions or plane. It is also possible to hold the substrate 100 fixed while translating the camera 106 and backlight illuminator 108 (or camera 106′ and coaxial light source 130 in the embodiment of FIG. 4) relative to the substrate 100. ")
8. The via detection device for the TGV glass substrate according to claim 1, wherein each of a color of the first collimated beam and a color of the second collimated beam is selected from red, green, blue and white (Para. [0050]:"Both images in FIGS. 5A and 5B were taken at 1X optical magnification with green backlighting.").
9. The via detection device for the TGV glass substrate according to claim 1, wherein the first image is an image showing an upper opening of the at least one glass substrate via of the glass substrate, a via of a waist of the at least one glass substrate via of the glass substrate, and a part of the upper surface of the glass substrate near the upper opening; a color of the via is a color of the second collimated beam, a color from the upper opening to the via is black, and a color of the part of the upper surface of the glass substrate near the upper opening is a mixed color of a color of the first collimated beam and the color of the second collimated beam.
(The claim is drawn to the structure of a detection device but recites results from operating the device. The via and glass substrate are objects worked upon by the apparatus and thud do not impart a structural limitation. See MPEP 2115. The claim is not found to structurally distinguish. Furthermore, since Goers shows the same structure as claimed, it is reasonable to conclude that the device of Goers can be operated in a manner to produce the claimed results of claim 9).
10. The via detection device for the TGV glass substrate according to claim 1, wherein the second image is an image showing the lower opening of the at least one glass substrate via of the glass substrate, a via of a waist of the at least one glass substrate via of the glass substrate, and a part of the lower surface of the glass substrate near the lower opening; a color of the via is a color of the first collimated beam, a color from the lower opening to the via is black, and a color of the part of the lower surface of the glass substrate near the lower opening is a mixed color of the color of the first collimated beam and a color of the second collimated beam. (The claim is drawn to the structure of a detection device but recites results from operating the device. The via and glass substrate are objects worked upon by the apparatus and thud do not impart a structural limitation. See MPEP 2115. The claim is not found to structurally distinguish. Furthermore, since Goers shows the same structure as claimed, it is reasonable to conclude that the device of Goers can be operated in a manner to produce the claimed results of claim 9).
16. A via detection method for a through glass via (TGV) glass substrate, being executed by a via detection device of the TGV glass substrate; wherein the via detection device comprises a first depth-of-field (DOF) camera, a first collimated light source, a second DOF camera and a second collimated light source; the first DOF camera and the first collimated light source are arranged on a glass substrate with at least one glass substrate via, and orthogonally face an upper surface of the glass substrate; the second DOF camera and the second collimated light source are arranged below the glass substrate, and orthogonally face a lower surface of the glass substrate (See citation given for claim 1); the via detection method comprises:
controlling, by a microcontroller unit of the via detection device for the TGV glass substrate, the first DOF camera, the first collimated light source, the second DOF camera and the second collimated light source so that the first collimated light source and the second collimated light source respectively emit a first collimated beam and a second collimated beam to the glass substrate, and the first DOF camera and the second DOF camera respectively obtain a first image and a second image, wherein an optical band of the first collimated beam is different from or identical to an optical band of the second collimated beam (See citation given for claim 1 where the act flows from functions of the structure) ; and
obtaining, by the microcontroller unit of the via detection device for the TGV glass substrate, at least one detection result of the at least one glass substrate via according to the first image and the second image (See citation given for claim 1 where the act flows from functions of the structure).
17. The via detection method for the TGV glass substrate according to claim 16, wherein the detection result comprises at least one of an opening diameter of an upper opening of the glass substrate via, an opening diameter of a lower opening of the glass substrate via, an opening coordinate, an opening roundness, a crack detection result, a dustiness detection result, a dot damage detection result, a scratch detection result, an impurity detection result, an edge collapse detection result, a via diameter of the glass substrate via, a hole congestion detection result and an offset amount between the upper opening and the lower opening of the glass substrate via (See citation given for claim 2).
18. The via detection method for the TGV glass substrate according to claim 16, wherein each a color of the first collimated beam and a color of the second collimated beam is selected from red, green, blue and white (See discussion for claim 8).
19. The via detection method for the TGV glass substrate according to claim 16, wherein the first image is an image showing an upper opening of the at least one glass substrate via of the glass substrate, a via of a waist of the at least one glass substrate via of the glass substrate, and a part of the upper surface of the glass substrate near the upper opening; a color of the via is a color of the second collimated beam, a color from the upper opening to the via is black, and a color of the part of the upper surface of the glass substrate near the upper opening is a mixed color of a color of the first collimated beam and the color of the second collimated beam (See Figs. 1B, 3, 5A, 5B, 6A, and 6B).
20. The via detection method for the TGV glass substrate according to claim 16, wherein the second image is an image showing the lower opening of the at least one glass substrate via of the glass substrate, a via of a waist of the at least one glass substrate via of the glass substrate, and a part of the lower surface of the glass substrate near the lower opening; a color of the via is a color of the first collimated beam, a color from the lower opening to the via is black, and a color of the part of the lower surface of the glass substrate near the lower opening is a mixed color of the color of the first collimated beam and a color of the second collimated beam (See Figs. 1B, 3, 5A, 5B, 6A, and 6B).
Claim(s) 11-15 is/are rejected under 35 U.S.C. 103 as being unpatentable over Jeong (and in the alternative Goers) as applied to claim 1 above, and further in view of Powell et al. (US 2017/0053411).
With respect to claim 11, Jeong shows all the limitations of claim 11 as identified for claim 1 above, but does not show a beamsplitter and a third DOF camera as follows:
11. A via detection device for a through glass via (TGV) glass substrate, comprising:
a first depth-of-field (DOF) camera and a first collimated light source arranged on a glass substrate with at least one glass substrate via, and orthogonally facing an upper surface of the glass substrate (See citation given for claim 1);
a second DOF camera and a second collimated light source arranged below the glass substrate, and orthogonally facing a lower surface of the glass substrate (See citation given for claim 1);
a microcontroller unit electrically connected with the first DOF camera, the first collimated light source, the second DOF camera and the second collimated light source (See citation given for claim 1);
(See citation given for claim 1), (inherent as the object is glass. also does not serve to distinguish as it directed to intended results, rather than structure), a split portion of the second collimated beam passing through the glass substrate and a split portion of the first collimated beam emitted to the glass substrate from the first collimated light source and a split portion of the first collimated beam reflected by the glass substrate (inherent as there are no other possibilities), the first DOF camera, the second DOF camera a
As stated above, Jeong does not show the use of a beamsplitter and another (third) DOF camera.
Jeong in view of Powell
In Figure 4, Jeong shows the use of a single camera that is scanned to different heights to measure different height points of the substrate (upper surface and waist) to measure the diameters at those different height points.
Similarly, Powell shows a depth sensing system that measures at different depths by the addition of another image sensor with the use of a beamsplitter to couple both image sensors. Each image sensor is focused at different depths of the substrate (e.g. para. [0088]):
FIG. 12 illustrates another example arrangement of elements that support computer vision depth sensing at video rate using DFD. The arrangement includes an imaging lens 1200, a beamsplitter 1210, a first image sensor 1230, a first telecentric correcting lens 1220, a second image sensor 1240, and a second telecentric correcting lens 1250. The first image sensor 1230 may accept an image having a first focus plane (e.g., far) while the second image sensor 1240 may accept an image having a second focus plane (e.g., near)
Powell further teaches that prior art systems sequentially took images at different focal depths by physically moving optics or the object which took additional time and risked blurring (para. [0013]).
Before the effective filing date of the claimed invention, it would have been obvious to add an additional camera with the use of a beamsplitter to Jeong's embodiment of Figure 4 where the camera has to be moved to different focal points. This addition of a camera and beamsplitter would allow obtaining images at two different depths (top surface and waist) simultaneously thus saving to acquire both images.
Goers in view of Powell
In the alternative to the rejection of claim 11 in view of Jeong, Goers teaches to select optics that allow the entire depth of the substrate to be imaged without having to make adjustments or refocusing (para. [0004], [0050]). This advantage, however, requires selecting optics from e.g. Table 1 which limits the magnification and field of view.
Before the effective filing date of the claimed invention, it would have been obvious to add an additional camera with the use of a beamsplitter to Goers' system of Figure 4, where selectable optics limited the magnification and field of view. This addition of a camera and beamsplitter would allow obtaining images at two different depths (top surface and waist) at the same time while being able to choose a desired magnification and field of view.
12. The via detection device for the TGV glass substrate according to claim 11, wherein the detection result comprises at least one of an opening diameter of an upper opening of the glass substrate via, an opening diameter of a lower opening of the glass substrate via, an opening coordinate, an opening roundness, a crack detection result, a dustiness detection result, a dot damage detection result, a scratch detection result, an impurity detection result, an edge collapse detection result, a via diameter of the glass substrate via, a hole congestion detection result and an offset amount between the upper opening and the lower opening of the glass substrate via (See citations given for claim 2 for Jeong and Goers).
13. The via detection device for the TGV glass substrate according to claim 11, wherein each of a color of the first collimated beam and a color of the second collimated beam is selected from red, green, blue and white (Goers, Para. [0050]:"Both images in FIGS. 5A and 5B were taken at 1X optical magnification with green backlighting.").
14. The via detection device for the TGV glass substrate according to claim 11, wherein each of the first image and the third image is an image showing an upper opening of the at least one glass substrate via of the glass substrate, a via of a waist of the at least one glass substrate via of the glass substrate, and a part of the upper surface of the glass substrate near the upper opening (See discussion of claim 11 where different depth/focus is imaged by the additional camera, i.e. third camera); a color of the via is a color of the second collimated beam, a color from the upper opening to the via is black, and a color of the part of the upper surface of the glass substrate near the upper opening is a mixed color of a color of the first collimated beam and the color of the second collimated beam (inherent as the object is glass. also does not serve to distinguish as it directed to intended results, rather than structure).
15. The via detection device for the TGV glass substrate according to claim 11, wherein the second image is an image showing the lower opening of the at least one glass substrate via of the glass substrate, a via of a waist of the at least one glass substrate via of the glass substrate, and a part of the lower surface of the glass substrate near the lower opening; a color of the via is a color of the first collimated beam, a color from the lower opening to the via is black, and a color of the part of the lower surface of the glass substrate near the lower opening is a mixed color of the color of the first collimated beam and a color of the second collimated beam (Does not serve to distinguish as it directed to intended results, rather than structure).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Freischlad et al. (US 6,847,458) shows two interferometers (20, 40) that simultaneously obtains images on both sides of an object (60), each interferometer having a camera and light source on the same side of the measured object.
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/Hwa Andrew Lee/Primary Examiner, Art Unit 2877