Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1799 2800 2877 2886 3792
This examiner grants 72% of resolved cases
Examiner HWA S LEE is positioned in Tech Center 3700 and Art Unit 1799. The examiner has overseen 748 resolved cases. The data indicates an allowance rate of 72.3 percent. This metric represents the proportion of applications that successfully transition from examination to a granted patent. An allowance rate of 72.3 percent offers a statistical foundation for evaluating the likelihood of a positive outcome in Art Unit 1799.
The median days to allowance for this examiner is 1095. This figure provides a specific timeframe for the duration of the prosecution process from filing to issuance. Practitioners can use the 1095 days benchmark to plan for the expected length of time an application might remain pending. This duration is a key consideration for applicants operating within Tech Center 3700.
The interview lift is 3.1 percent. This figure represents the increase in the probability of allowance when an interview is conducted compared to cases without one. A lift of 3.1 percent suggests that verbal communication may assist in resolving outstanding issues during prosecution. For the 748 resolved cases, this statistic implies that interviews are a factor to consider for this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18791502 | SINGLE-PIXEL MULTISPECTRAL IMAGER FOR FLARE AND BURNER COMBUSTION EFFICIENCY MEASUREMENT | Non-Final OA | Schlumberger Technology Corporation |
| 18810230 | SHARED SET OF OBJECT REGISTRATIONS FOR SURGICAL DEVICES USING INDEPENDENT REFERENCE PLANES | Final Rejection | Cilag GmbH International |
| 18700512 | System and Methods for Measuring Stimulated Raman Scattering | Final Rejection | Google LLC |
| 17994900 | AUTOMATIC QUALITY CATEGORIZATION METHOD AND SYSTEM FOR PHARMACEUTICAL GLASS CONTAINERS | Non-Final OA | CORNING INCORPORATED |
| 18039053 | METHOD FOR DETECTING DEFECTS IN A 3D PRINTER USING IMAGE SPATIAL RESOLUTION | Non-Final OA | Siemens Energy Global GmbH & Co. KG |
| 18950734 | DIFFERENTIAL MEASUREMENT OF IR ABSORPTION IN PLASMONIC MEMS SENSORS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18957428 | MAGNETO-OPTICAL CHEMICAL SENSORS FOR PROCESS CHAMBERS | Non-Final OA | Applied Materials, Inc. |
| 18989928 | METHOD AND COMPUTER PROGRAM FOR PREDICTING PARAMETER OF SAMPLE IN OPTICAL MEASUREMENT SYSTEM, AND RECORDING MEDIUM STORING COMPUTER PROGRAM FOR IMPLEMENTING SAME | Non-Final OA | INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY |
| 18326018 | TEST SYSTEM AND TEST METHOD TO WAFERS | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18838745 | OPTICAL APPARATUS | Final Rejection | RENISHAW PLC |
| 18133914 | MEASUREMENTS OF TEMPORAL DYNAMICS USING OPTICAL SCATTERING IN A DIFFUSIVE CAVITY | Non-Final OA | University of Central Florida Research Foundation, Inc. |
| 18967887 | METHOD AND SYSTEM FOR DETECTING HEMOLYSIS IN BLOOD USING REFRACTOMETRY | Non-Final OA | Terumo BCT, Inc. |
| 18863040 | SPECTROSCOPIC ANALYSIS DEVICE | Final Rejection | HAMAMATSU PHOTONICS K.K. |
| 18884192 | SPECTROSCOPIC ANALYZER | Final Rejection | HAMAMATSU PHOTONICS K.K. |
| 18865955 | ENHANCED ALIGNMENT APPARATUS FOR LITHOGRAPHIC SYSTEMS | Final Rejection | ASML Netherlands B.V. |
| 17311422 | APPARATUS AND METHOD FOR GROUPING IMAGE PATTERNS TO DETERMINE WAFER BEHAVIOR IN A PATTERNING PROCESS | Non-Final OA | ASML NETHERLANDS B.V. |
| 18707413 | METROLOGY APPARATUS AND METHOD | Non-Final OA | Cymer, LLC |
| 18749338 | METHOD AND SYSTEM FOR PERFORMING CLEAVE ANGLE METROLOGY FOR AN OPTICAL FIBER | Non-Final OA | RAM Photonics Industrial, LLC |
| 18137756 | PROPULSOR BLADE IMAGING ASSEMBLY FOR AN AIRCRAFT PROPULSION SYSTEM | Non-Final OA | Raytheon Technologies Corporation |
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