Prosecution Insights
Last updated: July 17, 2026
Application No. 18/848,638

POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE

Non-Final OA §102
Filed
Sep 19, 2024
Priority
Mar 29, 2022 — JP 2022-053006 +1 more
Examiner
BURNS, TREMESHA WILLIS
Art Unit
Tech Center
Assignee
UBE Corporation
OA Round
1 (Non-Final)
78%
Grant Probability
Favorable
1-2
OA Rounds
8m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 78% — above average
78%
Career Allowance Rate
673 granted / 867 resolved
+17.6% vs TC avg
Strong +18% interview lift
Without
With
+17.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
54 currently pending
Career history
887
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
47.2%
+7.2% vs TC avg
§102
49.9%
+9.9% vs TC avg
§112
1.8%
-38.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 867 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1 – 6 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Oka et al. (WO 2017209197). Regarding claim 1, Oka discloses polyimide precursor composition for flexible wiring boards, comprising a polyimide precursor having a repeating unit represented by following general formula (I) (Formula (1-1), Abstract; pg. 3, 1st paragraph in Description of Embodiments section): wherein in general formula I, X1 (A11) is a tetravalent aliphatic group or aromatic group (aromatic or aliphatic tetracarboxylic acids, 3rd and 5th paragraphs in Description of Embodiments section; page 4, 3rd – 5th paragraphs), Y1 (B11) is a divalent aliphatic group or aromatic group (aromatic or aliphatic tetracarboxylic acids, page 5, 2nd and 4th – 6th paragraphs), R1 (X1) and R2 (X2) are each independently a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an alkylsilyl group having 3 to 9 carbon atoms (page 9, 2nd paragraph), wherein more than 0 mol % and less than 30 mol % of Y1 (30 mol %, page 5, 4th paragraph) is a group represented by formula (1) (B11 can be represented by Formula (B-1)): wherein in formula (1), A (Y2) is a structure represented by formula (A): PNG media_image1.png 357 455 media_image1.png Greyscale wherein n is an integer of 1 to 4 (page 4, 3rd paragraph), m is an integer of 0 to 4 (m = 2), B (Y2) is one selected from the group consisting of an alkyl group having 1 to 6 carbon atoms (Y2 can represent a methyl group, claim 5), an alkoxy group having 1 to 6 carbon atoms, a halogen group, and a fluoroalkyl group having 1 to 6 carbon atoms, and U (Q1, Q2) independently represents -CO-O- or -O-CO- (claim 5, page 44). Regarding claim 2, Oka discloses wherein A is a structure selected from the group consisting of a 1,4-phenylene group and a 4,4'-biphenylene group (claim 5, page 44). Regarding claim 3, Oka discloses wherein 50 mol % or more of the X1 are groups represented by following formula (21) (page 5, 4th paragraph): PNG media_image2.png 168 517 media_image2.png Greyscale (21) Regarding claim 4, Oka discloses polyimide film for flexible wiring boards, obtained from the polyimide precursor composition according to any one of claim 1 (page 45). Regarding claim 5, Oka discloses polyimide metal laminate comprising a polyimide film according to claim 4 and a metal foil or metal layer laminated therewith (Industrial Applicability section & page 45). Regarding claim 6, Oka discloses flexible wiring board having wiring formed by patterning the metal foil or metal layer of the polyimide metal laminate according to claim 5 (Industrial Applicability section & page 45). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to TREMESHA W BURNS whose telephone number is (571)270-3391. The examiner can normally be reached Monday-Friday 8am - 4:30 pm EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at (571) 272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. TREMESHA W. BURNS Primary Examiner Art Unit 2847 /TREMESHA W BURNS/Primary Examiner, Art Unit 2847
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Prosecution Timeline

Sep 19, 2024
Application Filed
Jun 03, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
78%
Grant Probability
95%
With Interview (+17.7%)
2y 6m (~8m remaining)
Median Time to Grant
Low
PTA Risk
Based on 867 resolved cases by this examiner. Grant probability derived from career allowance rate.

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