Prosecution Insights
Last updated: April 19, 2026
Application No. 18/864,075

Device, and Method of Manufacture of a Device

Non-Final OA §102§103
Filed
Nov 08, 2024
Examiner
PHAN, THO GIA
Art Unit
2845
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Telefonaktiebolaget Lm Ericsson (Publ)
OA Round
1 (Non-Final)
91%
Grant Probability
Favorable
1-2
OA Rounds
2y 3m
To Grant
96%
With Interview

Examiner Intelligence

Grants 91% — above average
91%
Career Allow Rate
930 granted / 1017 resolved
+23.4% vs TC avg
Minimal +5% lift
Without
With
+4.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
28 currently pending
Career history
1045
Total Applications
across all art units

Statute-Specific Performance

§101
1.0%
-39.0% vs TC avg
§103
38.9%
-1.1% vs TC avg
§102
38.0%
-2.0% vs TC avg
§112
9.7%
-30.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1017 resolved cases

Office Action

§102 §103
DETAILED ACTION Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. Claims 55-59, 62-63, 65-74 and 77-78 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Kitamura et al (2017/0229784 A1) [cited by applicant]. Regarding claims 55 and 68, Kitamura et al in figures 1-7 disclose a device comprising: at least one package 10, wherein each package comprises at least one integrated circuit 13 (fig4, para67) and at least one primary antenna 18; and at least one component 30, wherein each component comprises at least one secondary antenna 34 (fig4, para57); wherein the at least one component is attached to the at least one package 10 by adhesive 6 such that each secondary antenna is spaced from and stacked with one of the at least one primary antenna (fig4). Kitamura et al in figures 1-7 also disclose wherein the at least one package comprises one package 10 and the package includes a plurality of primary antennas (fig4), and wherein the at least one component comprises a plurality of components and each of the components includes at least one secondary antenna (fig4); a plurality of primary antennas 18 including the at least one primary antenna; and a plurality of secondary antennas 34 including the at least one secondary antenna; wherein the adhesive comprises solder 72 (figs30-33), and the at least one component is attached to the at least one package such that each secondary antenna is spaced from and stacked with one of the at least one primary antenna, wherein portions of the solder are between at least two primary antennas (solder ball 72 is between at least two primary antennas 18 when a second substrate 30c is soldered to the wiring substrate 10); each secondary antenna is spaced from and stacked with one of the at least one primary antenna such that each secondary antenna is substantially parallel to at least one primary antenna (fig4,10); the at least one package includes at least one first ground conductive portion 22 adjacent to at least one primary antenna, wherein the at least one ground conductive portion is for connection to ground, and/or at least one second ground conductive portion under at least one primary antenna, wherein the at least one second ground conductive portion includes or forms at least one aperture for providing a signal to the at least one primary antenna antenna and is separated from the primary antenna, wherein the at least one integrated circuit is under some or all of the at least one primary antenna, wherein the at least one package comprises at least one integrated circuit embedded in a printed circuit board laminate stack, and/or at least one integrated circuit embedded in a package with one or more molded dielectric layers (fig1); mounting the device or the at least one package on a printed circuit board (PCB) after attaching the at least one component to the at least one package or before attaching the at least one component to the at least one package (fig2). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 60-61, 64, 75-76 and 79 are rejected under 35 U.S.C. 103(a) as being unpatentable over Kitamura et al in view of Wang et al (US 2020/0035625 A1) [both cited by applicant]. Kitamura et al had been discussed but fail to teach each component comprises a surface, wherein the at least one primary antenna is on the surface, wherein the surface is substantially parallel to and facing away from the at least one package, and wherein at least one component includes a further surface, wherein the further surface is opposite the surface, and at least one component includes at least one further antenna on the further surface of the component, and wherein each further antenna is between one of the at least one primary antenna and one of the at least one secondary; at least one further component comprising at least one further secondary antenna, wherein the at least one further component is attached to the at least one component by adhesive such that each further secondary antenna is spaced from and stacked with one of the at least one secondary antenna. However, Wang et al teach each component comprises a surface, wherein the at least one primary antenna is on the surface, wherein the surface is substantially parallel to and facing away from the at least one package, and wherein at least one component includes a further surface, wherein the further surface is opposite the surface, and at least one component includes at least one further antenna on the further surface of the component, and wherein each further antenna is between one of the at least one primary antenna and one of the at least one secondary (fig10); at least one further component 212e comprising at least one further secondary antenna 225b, wherein the at least one further component is attached to the at least one component by adhesive such that each further secondary antenna is spaced from and stacked with one of the at least one secondary antenna AE (figs9-10). It would have been obvious before the effective filing date of the claimed invention to a person having ordinary skilled in the art to provide Kitamura et al with each component comprises a surface, wherein the at least one primary antenna is on the surface, wherein the surface is substantially parallel to and facing away from the at least one package, and wherein at least one component includes a further surface, wherein the further surface is opposite the surface, and at least one component includes at least one further antenna on the further surface of the component, and wherein each further antenna is between one of the at least one primary antenna and one of the at least one secondary; at least one further component comprising at least one further secondary antenna, wherein the at least one further component is attached to the at least one component by adhesive such that each further secondary antenna is spaced from and stacked with one of the at least one secondary antenna for the purpose of improving the antenna gain. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. The patents to Lee, We, Gu and Dalmia are cited as of interested and illustrated a similar structure to a device. Any inquiry concerning this communication or earlier communications from the examiner should be directed to THO GIA PHAN whose telephone number is (571)272-1826. The examiner can normally be reached on M-F (8-430). If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dimary Lopez can be reached on (571) 270-7893. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). /THO G PHAN/ Primary Examiner, Art Unit 2845
Read full office action

Prosecution Timeline

Nov 08, 2024
Application Filed
Jan 26, 2026
Non-Final Rejection — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
91%
Grant Probability
96%
With Interview (+4.7%)
2y 3m
Median Time to Grant
Low
PTA Risk
Based on 1017 resolved cases by this examiner. Grant probability derived from career allow rate.

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