DETAILED ACTION
This Action is responsive to the communication filed on 09/24/2024.
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
Claim Rejections - 35 USC § 112
Claims 1-8 are rejected under 35 U.S.C. 112(b) as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, regards as the invention.
Claim 1 recites the limitation "the other principal surface" (emphasis added) in lines 8-9. There is insufficient antecedent basis for this limitation in the claim.
Additionally, it is unclear whether or not the recited claim limitation of "the other principal surface" (emphasis added) is meant to refer to back to “a one principal surface” (emphasis added) or introduce another principal surface.
For purposes of compact prosecution, the Examiner will interpret “the other principal surface” as a surface facing the opposite direction of the one principal surface.
Claims 2-8 are also rejected under 35 U.S.C. 112(b) as being indefinite due to the claims’ dependency to Claim 1.
Claims 5-7 are rejected under 35 U.S.C. 112(b) as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, regards as the invention.
Claim 5, which depends from Claim 1, recites the limitation "the plurality of through holes" (emphasis added) in line 2. There is insufficient antecedent basis for this limitation in the claim.
Claims 6-7 are also rejected under 35 U.S.C. 112(b) as being indefinite due to the claims’ dependency to Claim 5.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-4 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Raposas (US 2020/0211933).
Regarding claim 1, Raposas (see, e.g., FIG. 1-FIG. 4, FIG. 6) discloses a semiconductor device comprising:
a lead frame 110, 111, 131 including a plate-shaped die pad 110 and a lead 111, the die pad 110 having one principal surface e.g., top surface of 110 with a mounting region e.g., center of 110 for mounting a semiconductor chip 180, the die pad 110 including a side portion e.g., inner side 121 and a frame-shaped protrusion 130 on the side portion e.g., inner side 121 in top view, the protrusion 130 overhanging in a lateral direction in an eave shape along the one principal surface e.g., top surface of 110 (Para 0020, Para 0021, Para 0024);
the semiconductor chip 180 mounted on the mounting region e.g., center of 110 (Para 0021); and
a sealing body 190 covering a side surface e.g., side surface of 110 of the die pad 110 while exposing the other principal surface e.g., bottom surface of 110 of the die pad 110 and sealing the semiconductor chip 180 on the one principal surface e.g., top surface of 110 of the die pad 110, the sealing body 190 holding the die pad 110 and the lead 111, wherein the die pad 110 has a through hole 121 penetrating the protrusion 130 in a direction e.g., vertical direction intersecting with the one principal surface e.g., top surface of 110 (Para 0020, Para 0024).
Regarding claim 2, Raposas (see, e.g., FIG. 1-FIG. 4, FIG. 6) teaches the semiconductor device according to claim 1, wherein the through hole 121 is formed so as to penetrate a portion of a base e.g., inner boundary of the protrusion 130.
Regarding claim 3, Raposas (see, e.g., FIG. 1-FIG. 4, FIG. 6) teaches the semiconductor device according to claim 2, wherein the through hole 121 includes a notch portion 126 terminating without reaching the other principal surface e.g., bottom surface of 110 of the die pad 110 from a portion inside the base e.g., inner boundary of the protrusion 130 of the one principal surface of the die pad 110 (Para 0020-Para 0021).
Regarding claim 4, Raposas (see, e.g., FIG. 1-FIG. 4, FIG. 6) teaches the semiconductor device according to claim 1, wherein the through hole 121 penetrates the protrusion 130 in a direction e.g., vertical direction perpendicular to the one principal surface e.g., top surface of 110.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANTONIO CRITE whose telephone number is (571) 270-5267. The examiner can normally be reached Monday - Friday, 10:00 am - 6:30 pm.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Kretelia Graham can be reached at (571) 272-5055. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/ANTONIO B CRITE/Primary Examiner, Art Unit 2817
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