Prosecution Insights
Last updated: October 04, 2026
Application No. 18/901,368

3D MICRO-CURVED EPITAXIAL STRUCTURE AND PREPARATION METHOD

Non-Final OA §112
Filed
Sep 30, 2024
Priority
Jan 26, 2024 — CN 202410108333X
Examiner
OJEH, NDUKA E
Art Unit
Tech Center
Assignee
Suzhou Han Hua Semiconductor Co. Ltd.
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
2m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allowance Rate
729 granted / 812 resolved
+29.8% vs TC avg
Minimal -2% lift
Without
With
+-2.2%
Interview Lift
resolved cases with interview
Typical timeline
2y 2m
Avg Prosecution
21 currently pending
Career history
816
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
53.5%
+13.5% vs TC avg
§102
28.7%
-11.3% vs TC avg
§112
12.2%
-27.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 812 resolved cases

Office Action

§112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Information Disclosure Statement The information disclosure statement (IDS) submitted on 5/6/2025 was filed. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Specification The abstract and title are consistent with the requirements set forth in the MPEP 608.01(b) and 606, respectively. Claim Objections Claim 1 is objected to because of the following informalities: Ga in line 10 should “Gallium (Ga)” similar to how the other elements were first introduced in the claims. Appropriate correction is required. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 1-10 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 1 recites the limitation "the upper surface of the base layer" in lines 7-8. There is insufficient antecedent basis for this limitation in the claim because there is no previous mention of an upper surface of the base layer in the claim. For examination purposes and for proper antecedence, the limitation is being interpreted as "an upper surface of the base layer." Appropriate correction is required. Claim 4 recites the limitation "the outer surface of the 3D micro-curved epitaxial structural unit" in lines 2. There is insufficient antecedent basis for this limitation in the claim because there is no previous mention of an outer surface of the 3D micro-curved epitaxial structural unit in the claim. For examination purposes and for proper antecedence, the limitation is being interpreted as "an outer surface of the 3D micro-curved epitaxial structural unit." Appropriate correction is required. Claim 6 recites the limitation "the upper surface of the base layer" and “the upper surface of the mask layer” in lines 7 and 12, respectively. There is insufficient antecedent basis for this limitation in the claim because there is no previous mention of an upper surface of the base layer and an upper surface of the mask layer in the claim. For examination purposes and for proper antecedence, the limitations are being interpreted as "an upper surface of the base layer" and “an upper surface of the mask layer.” Appropriate correction is required. Claim 9 recites the limitation "wherein the vertical height of each of the plurality of the 3D micro-curved epitaxial structural units from the bottom of the groove to the top of the upper surface" in lines 2-3. There is insufficient antecedent basis for this limitation in the claim because there is no previous mention of a vertical height, a bottom of the groove and a top of the upper surface. For examination purposes and for proper antecedence, the limitation is being interpreted as "wherein a vertical height of each of the plurality of the 3D micro-curved epitaxial structural units from a bottom of the groove to a top of the upper surface." Appropriate correction is required. Claims 2-3, 5, 7-8 and 10 are also rejected under 35 U.S.C. 112(b) as being indefinite for further limiting and dependent on indefinite claims 1 and 6. Allowable Subject Matter Regarding claim 6, Li et al., US PGPub. 2019/0214487 teaches a three-dimensional (3D) micro-curved epitaxial functional structure (fig. 20), comprising: a base layer (substrate 201, fig. 20) [0068], which includes a first epitaxial layer (210, fig. 18) [0058], arranged sequentially from bottom to top; a mask layer (203, fig. 20) [0068] located above the base layer (201); the mask layer (203)provided with grooves (where 215 are located, fig. 20; hereinafter called 203G) distributed at intervals; a plurality of 3D micro-curved epitaxial structural units (215, fig. 20) [0069], wherein a bottom part of each of the plurality of 3D micro-curved epitaxial structural units (215) is filled with the corresponding groove (203G), and an upper surface is a smooth 3D micro-curved structure (215), and each of the plurality of 3D micro-curved epitaxial structural units (215) is in contact with (an end/edge/corner of the upper surface, fig. 20) the upper surface of the mask layer (203) (Li et al., fig. 20). But Li fails to teach wherein a base layer (substrate 201) includes at least a sapphire substrate layer and a first epitaxial layer (210); and wherein the grooves (203G) penetrate the mask layer (203) and expose the upper surface of the base layer (201). Claims 1-10 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action. The following is a statement of reasons for the indication of allowable subject matter: the prior arts of record taken alone or in combination neither anticipates nor renders obvious a method for preparing a three-dimensional (3D) micro-curved epitaxial functional structure, comprising “step S3 of dry etching the mask layer to form spaced grooves, wherein the grooves penetrate through the mask layer and have their bottoms positioned on the upper surface of the base layer, to obtain a sample” in combination with “step S5 of performing photolithography on the 3D micro-curved epitaxial structural units to define an area to be etched; step S6 of wet etching the area to be etched to form a structure comprising one polar plane F3 and two semi-polar planes F1” and “a curvature of the 3D micro-curved epitaxial structural units is 1000R to 1800R” as recited in claim 1; and a three-dimensional (3D) micro-curved epitaxial functional structure comprising “a base layer, which includes at least a sapphire substrate layer and a first epitaxial layer, arranged sequentially from bottom to top,” wherein “the mask layer provided with grooves distributed at intervals, wherein the grooves penetrate the mask layer and expose the upper surface of the base layer” in combination with the limitation wherein “each of the plurality of 3D micro-curved epitaxial structural units is in contact with the upper surface of the mask layer” as recited in claim 6. Claims 2-5 and 6-10 would also be allowable for further limiting and depending upon allowable claims 1 and 6. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Lee et al. US Pat 10,366,884 (fig. 3D) and Lee et al. US Pat 9,378,950 (fig. 1F) both teach an epitaxial structure with a mask layer on a base layer, the mask having grooves with epitaxial structure in the grooves but the surface of the epitaxial layers are not curved. Any inquiry concerning this communication or earlier communications from the examiner should be directed to NDUKA E OJEH whose telephone number is (571)270-0291. The examiner can normally be reached M-F; 9am - 5pm.. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, DREW N RICHARDS can be reached at (571) 272-1736. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /NDUKA E OJEH/Primary Examiner, Art Unit 2892
Read full office action

Prosecution Timeline

Sep 30, 2024
Application Filed
Sep 21, 2026
Non-Final Rejection mailed — §112 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12751003
SEMICONDUCTOR DEVICE
2y 10m to grant Granted Sep 29, 2026
Patent 12751047
SEMICONDUCTOR DEVICE INCLUDING INTERFACIAL LAYER WITH CET SCALING AND METHOD FOR MANUFACTURING THE SAME
2y 10m to grant Granted Sep 29, 2026
Patent 12751168
DISPLAY DEVICE
2y 5m to grant Granted Sep 29, 2026
Patent 12745618
SEMICONDUCTOR DEVICE
2y 11m to grant Granted Sep 22, 2026
Patent 12745523
Display Apparatus Having Link Wirings
2y 8m to grant Granted Sep 22, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
88%
With Interview (-2.2%)
2y 2m (~2m remaining)
Median Time to Grant
Low
PTA Risk
Based on 812 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month