Tech Center 2800 • Art Units: 2892
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18531078 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18503739 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18493166 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18470082 | SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO.,LTD. |
| 18648908 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18535254 | SURFACE TREATMENT METHOD OF QUANTUM DOTS, LIGHT-EMITTING DEVICE INCLUDING SURFACE-TREATED QUANTUM DOTS, AND DISPLAY DEVICE INCLUDING LIGHT-EMITTING DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18449812 | LIGHT EMITTING ELEMENT, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE COMPRISING THE LIGHT EMITTING ELEMENT | Non-Final OA | Samsung Display Co., LTD. |
| 18665958 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS TO CURB DETERIORIATION OF PICTURE QUALITY | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18746413 | HIGH RESOLUTION ADVANCED OLED SUB-PIXEL CIRCUIT AND PATTERNING METHOD | Non-Final OA | Applied Materials, Inc. |
| 18521306 | Light-Emitting Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18541181 | INTEGRATION OF DIFFERENT GATE DIELECTRICS NANOSHEET DEVICES | Non-Final OA | International Business Machines Corporation |
| 18060168 | ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL | Non-Final OA | International Business Machines Corporation |
| 17933874 | HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CONNECTIONS | Non-Final OA | International Business Machines Corporation |
| 18403727 | MANUFACTURING METHOD OF HEAT DISSIPATION LAYER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18520105 | SEMICONDUCTOR DEVICE INCLUDING INTERFACIAL LAYER WITH CET SCALING AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18677693 | MEMORY DEVICES INCLUDING SLOT STRUCTURES | Non-Final OA | Micron Technology, Inc. |
| 18470148 | PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK | Final Rejection | QUALCOMM Incorporated |
| 18470083 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18371685 | SUPERCONDUCTING VACUUM-BRIDGED JOSEPHSON JUNCTIONS | Final Rejection | IQM Finland Oy |
| 18404839 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18537470 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Non-Final OA | Commissariat à I'Énergie Atomique et aux Énergies Alternatives |
| 18517714 | LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD | Non-Final OA | Coherent LaserSystems GmbH & Co. KG |
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