DETAILED ACTION
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1 and 9 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Kanaoka et al (11,030,507).
Regarding claims 1 and 9, Kanaoka et al disclose an antenna substrate 40 comprising a wiring module with a circuit structure 50,60 and a waveguide structure 20,30 bonded to the circuit structure (the waveguide integrally connected with the circuit structure); and an antenna module provided on the wiring module and comprising an antenna layer 10 allowing a signal to be transmitted to the antenna layer through the waveguide structure (figs1,10-14) and an electronic component 80,90 provided on the antenna substrate.
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claims 2, 10 and 17-19 are rejected under 35 U.S.C. 103(a) as being unpatentable over Kanaoka et al (11,030,507) in view of Oster et al (10,452,571).
Kanaoka et al had been discussed but fail to teach a plurality of circuit layers formed on the plurality of insulating layers, the electronic component is a radio frequency chip, which is provided on another side of the wiring module of the antenna substrate opposite to a side where the antenna module is provided, allowing the electronic component to transmit a signal to the antenna layer through the waveguide structure, wherein the electronic component is provided on the circuit structure of the wiring module and electrically connected to the circuit layer of the circuit structure and a plurality of conductive components provided on the circuit structure and on the same side as the electronic component. However, Oster et al teach a microelectronic package communications having layers of circuit layers disposed on the dielectric layers and a radio frequency chip, which is provided on another side of the wiring module of the antenna substrate opposite to a side where the antenna module is provided, allowing the electronic component to transmit a signal to the antenna layer through the waveguide structure (figs1-8). It would have been obvious before the effective filing date of the claimed invention to a person having ordinary skilled in the art to provide Kanaoka et al with a plurality of circuit layers formed on the plurality of insulating layers, the electronic component is a radio frequency chip, which is provided on another side of the wiring module of the antenna substrate opposite to a side where the antenna module is provided, allowing the electronic component to transmit a signal to the antenna layer through the waveguide structure, wherein the electronic component is provided on the circuit structure of the wiring module and electrically connected to the circuit layer of the circuit structure and a plurality of conductive components provided on the circuit structure and on the same side as the electronic component for the purpose of improving the antenna gain.
Allowable Subject Matter
Claims 3-8 and 11-16 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. The patents to Kim, Wang, Wodrich and Sugimura are cited as of interested and illustrated a similar structure to an antenna substrate comprising a wiring module.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to THO GIA PHAN whose telephone number is (571)272-1826. The examiner can normally be reached on M-F (8-430).
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dimary Lopez can be reached on (571) 270-7893. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/THO G PHAN/
Primary Examiner, Art Unit 2845
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