Prosecution Insights
Prosecution Insights
37 pending office actions • 17 art units • 32 examiners • 0 of 37 (0%) have an AI response strategy ready • 44 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 9 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 9 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 22 (59%) |
| §102 only | 3 (8%) |
| Multi-statute (no §101) | 12 (32%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CUDA, BRENNEN STUART | 2 | — | — |
| VALENZUELA, PATRICIA D | 2 | 90.2% | +2.1% |
| TURNER, BRIAN | 2 | 83.2% | +4.5% |
| NGUYEN, THANH T | 2 | 83.3% | +14.1% |
| FAN, SU JYA | 2 | 75.7% | +11.1% |
| LEE, DOUGLAS | 1 | 45.0% | +13.5% |
| EGOAVIL, GUILLERMO J | 1 | 89.8% | +8.3% |
| SWANSON, ANDREW L | 1 | 66.1% | +11.4% |
| MILLER, JAMI VALENTINE | 1 | 94.9% | +3.9% |
| STUESSY, NOLAN GABRIEL | 1 | — | — |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18350839 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | VALENZUELA, PATRICIA D | 3d overdue |
| 18319591 | CARRIER SUBSTRATE | NGUYEN, THANH T | 22d |
| 18790871 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MILLER, JAMI VALENTINE | — |
| 18741472 | METHOD FOR WAFER DICING | VALENZUELA, PATRICIA D | — |
| 18428103 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | TURNER, BRIAN | — |
| 17968349 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, THANH T | — |
| 17858358 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18824303 | SEPARATION DEVICE | SWANSON, ANDREW L | 84d |
| 18903469 | ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF | EGOAVIL, GUILLERMO J | — |
| 18768762 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | STUESSY, NOLAN GABRIEL | — |
| 18673978 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | KIM, TONG-HO | — |
| 18654916 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, KHIEM D | — |
| 18403915 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TORNOW, MARK W | — |
| 18396976 | PACKAGING STRUCTURE, ELECTRONIC PACKAGE, AND METHODS FOR MANUFACTURING THE SAME | ADROVEL, WILLIAM | — |
| 18485878 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MICHAUD, NICHOLAS BRIAN | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18319591 | CARRIER SUBSTRATE | NGUYEN, THANH T | 22d |
| 18824303 | SEPARATION DEVICE | SWANSON, ANDREW L | 84d |
| 18904314 | MAINTENANCE DEVICE FOR TESTING EQUIPMENT AND METHOD OF USING THE SAME | LEE, DOUGLAS | — |
| 18064404 | ELECTRONIC PACKAGE | FAN, SU JYA | — |
| 17989554 | ELECTRONIC PACKAGE | FAN, SU JYA | — |
| 17968349 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, THANH T | — |
| Art Unit | Apps |
|---|---|
| 2818 | 7 |
| 2896 | 2 |
| 2898 | 2 |
| 2812 | 2 |
| 2893 | 2 |
| 2897 | 2 |
| 1714 | 1 |
| 2847 | 1 |
| 1745 | 1 |
| 2835 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18904314 | MAINTENANCE DEVICE FOR TESTING EQUIPMENT AND METHOD OF USING THE SAME | LEE, DOUGLAS | 1714 | §103 | Non-Final OA | — | Pending | Oct 02, 2024 |
| 18903469 | ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF | EGOAVIL, GUILLERMO J | 2847 | §102§103 | Non-Final OA | — | Pending | Oct 01, 2024 |
| 18824303 | SEPARATION DEVICE | SWANSON, ANDREW L | 1745 | §102§103 | Final Rejection | 84d | Pending | Sep 04, 2024 |
| 18790871 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MILLER, JAMI VALENTINE | — | §102 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18769937 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | CUDA, BRENNEN STUART | — | §103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768762 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | STUESSY, NOLAN GABRIEL | — | §102§103Other | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18754902 | ELECTRONIC PACKAGE | LEE, ALVIN LYNGHI | — | §103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18750600 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | WOODARD, AUSTIN TAYLOR | — | §103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18741472 | METHOD FOR WAFER DICING | VALENZUELA, PATRICIA D | — | §103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18673978 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | KIM, TONG-HO | — | §102§103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18660647 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | HO, TU TU V | — | §102 | Non-Final OA | — | Pending | May 10, 2024 |
| 18654916 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, KHIEM D | — | §102§103 | Non-Final OA | — | Pending | May 03, 2024 |
| 18654063 | HEAT DISSIPATION STRUCTURE | PAPE, ZACHARY | 2835 | §103 | Final Rejection | 61d | Pending | May 03, 2024 |
| 18623879 | ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRONIC STRUCTURE | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | Pending | Apr 01, 2024 |
| 18581006 | CHIP CARRIER STRUCTURE | DYKES, LAURA M | 2892 | §103 | Final Rejection | — | Pending | Feb 19, 2024 |
| 18428103 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | TURNER, BRIAN | 2818 | §103 | Final Rejection | — | Pending | Jan 31, 2024 |
| 18426574 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SHOOK, DANIEL P | 2896 | §103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18403915 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TORNOW, MARK W | 2891 | §102§103 | Non-Final OA | — | Pending | Jan 04, 2024 |
| 18396976 | PACKAGING STRUCTURE, ELECTRONIC PACKAGE, AND METHODS FOR MANUFACTURING THE SAME | ADROVEL, WILLIAM | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2023 |
| 18485878 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MICHAUD, NICHOLAS BRIAN | 2818 | §102§103 | Non-Final OA | — | Pending | Oct 12, 2023 |
| 18479892 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | MUNOZ, ANDRES F | 2818 | §102§103 | Final Rejection | — | Pending | Oct 03, 2023 |
| 18465773 | ELECTRONIC PACKAGE | CUDA, BRENNEN STUART | 2818 | §103 | Final Rejection | — | Pending | Sep 12, 2023 |
| 18360269 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | HIBBERT, DANIEL JOHNATHAN | 2899 | §102§112 | Non-Final OA | — | Pending | Jul 27, 2023 |
| 18350850 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | CHEN, YU | 2896 | §103 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18350839 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 3d overdue | Pending | Jul 12, 2023 |
| 18220501 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | 34d | Pending | Jul 11, 2023 |
| 18324198 | WORKING SYSTEM FOR SEMICONDUCTOR PACKAGING PROCESS AND OPERATION METHOD THEREOF | MCCLAIN, GERALD | 3652 | §103Other | Non-Final OA | 56d | Pending | May 26, 2023 |
| 18319591 | CARRIER SUBSTRATE | NGUYEN, THANH T | 2893 | §102 | Non-Final OA | 22d | Pending | May 18, 2023 |
| 18309768 | ELECTRONIC PACKAGE | BOOTH, RICHARD A | 2812 | §103 | Final Rejection | 42d overdue | Pending | Apr 28, 2023 |
| 18064404 | ELECTRONIC PACKAGE | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Dec 12, 2022 |
| 18063399 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | WEGNER, AARON MICHAEL | 2897 | §103§112 | Non-Final OA | — | Pending | Dec 08, 2022 |
| 17989554 | ELECTRONIC PACKAGE | FAN, SU JYA | 2818 | §103 | Final Rejection | — | Pending | Nov 17, 2022 |
| 17968349 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | NGUYEN, THANH T | 2893 | §103 | Non-Final OA | — | Pending | Oct 18, 2022 |
| 17858358 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17857887 | ELECTRONIC PACKAGE WITH A PLURALITY OF CARRIER STRUCTURES AND MANUFACTURING METHOD THEREOF | MCDONALD, JASON ANDREW | 2898 | §103 | Final Rejection | 24d overdue | Pending | Jul 05, 2022 |
| 17845302 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | KIM, JAHAE | 2897 | §103§112 | Final Rejection | — | Pending | Jun 21, 2022 |
| 17745709 | TESTING EQUIPMENT | PARK, HYUN D | 2857 | §103 | Non-Final OA | 9d | Pending | May 16, 2022 |
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