Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
42 pending office actions • 13 art units • 40 examiners • 0 of 42 (0%) have an AI response strategy ready • 41 patents granted in the last 365 days
Siliconware Precision Industries Co., Ltd. manages a large portfolio with 42 pending office actions in the Semiconductors, Circuits & Optics technology area. These actions are distributed across 13 distinct art units, reflecting a broad and complex range of technical subject matter. The company is currently interacting with 40 distinct examiners, which indicates a highly decentralized prosecution environment where many different officials are reviewing their applications.
The busiest examiner for the company is TURNER, BRIAN, who is responsible for 2 busiest examiner pending actions. Despite the high total of 42 pending office actions, the workload is so widely spread that TURNER, BRIAN only handles a small fraction of the cases. This distribution across 40 distinct examiners and 13 distinct art units means that the company must manage a vast array of examiner styles and art unit specificities. The high number of distinct examiners relative to the total actions suggests that almost every pending case is being handled by a different individual.
Based on the USPTO statutory response window for each pending office action. 9 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 9 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 21 (50%) |
| §102 only | 6 (14%) |
| Double-patenting only | 1 (2%) |
| Multi-statute (no §101) | 14 (33%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| TURNER, BRIAN | 2 | 83.4% | +4.4% |
| FAN, SU JYA | 2 | 75.9% | +11.1% |
| DAS, PINAKI | 1 | 86.8% | -1.8% |
| PARK, SAMUEL | 1 | 84.5% | +24.1% |
| GONZALES, VICENTE ROLANDO | 1 | 100.0% | +0.0% |
| ANYA, IGWE U | 1 | 85.0% | -3.7% |
| RAMALLO, GUSTAVO G | 1 | 95.2% | +2.4% |
| MILLER, JAMI VALENTINE | 1 | 94.9% | +3.9% |
| MAZUMDER, DIDARUL A | 1 | 86.5% | +7.8% |
| CUDA, BRENNEN STUART | 1 | — | — |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18816303 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | PARK, SAMUEL | — |
| 18815693 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE | GONZALES, VICENTE ROLANDO | — |
| 18790871 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MILLER, JAMI VALENTINE | — |
| 18780096 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MAZUMDER, DIDARUL A | — |
| 18428103 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | TURNER, BRIAN | — |
| 17858358 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18824512 | ELECTRONIC PACKAGE | DAS, PINAKI | — |
| 18806055 | PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF | ANYA, IGWE U | — |
| 18802090 | ELECTRONIC PACKAGE | RAMALLO, GUSTAVO G | — |
| 18768791 | CIRCUIT STRUCTURE | PATEL, AMOL H | — |
| 18754902 | ELECTRONIC PACKAGE | LEE, ALVIN LYNGHI | — |
| 18750600 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | WOODARD, AUSTIN TAYLOR | — |
| 18673978 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | KIM, TONG-HO | — |
| 18670484 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SPALLA, DAVID C | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18816303 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | PARK, SAMUEL | — |
| 18064404 | ELECTRONIC PACKAGE | FAN, SU JYA | — |
| 17989554 | ELECTRONIC PACKAGE | FAN, SU JYA | — |
| Art Unit | Apps |
|---|---|
| 2818 | 5 |
| 2817 | 3 |
| 2892 | 2 |
| 2896 | 2 |
| 2899 | 2 |
| 2812 | 2 |
| 2893 | 2 |
| 2835 | 1 |
| 2898 | 1 |
| 2814 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18824512 | ELECTRONIC PACKAGE | DAS, PINAKI | — | §102§103 | Non-Final OA | — | Pending | Sep 04, 2024 |
| 18816303 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | PARK, SAMUEL | — | §103 | Non-Final OA | — | Pending | Aug 27, 2024 |
| 18815693 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE | GONZALES, VICENTE ROLANDO | — | §103 | Non-Final OA | — | Pending | Aug 26, 2024 |
| 18806055 | PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF | ANYA, IGWE U | — | §102§103 | Non-Final OA | — | Pending | Aug 15, 2024 |
| 18802090 | ELECTRONIC PACKAGE | RAMALLO, GUSTAVO G | — | §102§103 | Non-Final OA | — | Pending | Aug 13, 2024 |
| 18790871 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MILLER, JAMI VALENTINE | — | §102 | Non-Final OA | — | Pending | Jul 31, 2024 |
| 18780096 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MAZUMDER, DIDARUL A | — | DP | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18769937 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | CUDA, BRENNEN STUART | — | §103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18768732 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MATTABONI, TIMOTHY JAMES | — | §103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18768791 | CIRCUIT STRUCTURE | PATEL, AMOL H | — | §102§103 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18757105 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | STARK, JARRETT J | — | §102 | Non-Final OA | — | Pending | Jun 27, 2024 |
| 18754902 | ELECTRONIC PACKAGE | LEE, ALVIN LYNGHI | — | §102§103§112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18750600 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | WOODARD, AUSTIN TAYLOR | — | §102§103§112 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18746714 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | CHAMBLISS, ALONZO | — | §102 | Non-Final OA | — | Pending | Jun 18, 2024 |
| 18734743 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | BERNSTEIN, ALLISON | — | §102 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18673978 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | KIM, TONG-HO | — | §102§103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18670484 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SPALLA, DAVID C | — | §102§103 | Non-Final OA | — | Pending | May 21, 2024 |
| 18654063 | HEAT DISSIPATION STRUCTURE | PAPE, ZACHARY | 2835 | §103 | Final Rejection | 61d | Pending | May 03, 2024 |
| 18631682 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | CHOU, SHIH TSUN A | — | §103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18581006 | CHIP CARRIER STRUCTURE | DYKES, LAURA M | 2892 | §103 | Final Rejection | — | Pending | Feb 19, 2024 |
| 18428103 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | TURNER, BRIAN | 2818 | §103 | Final Rejection | — | Pending | Jan 31, 2024 |
| 18426574 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SHOOK, DANIEL P | 2896 | §102§103 | Non-Final OA | — | Pending | Jan 30, 2024 |
| 18412005 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TRAN, BENJAMIN HOANG | 2817 | §103 | Non-Final OA | — | Pending | Jan 12, 2024 |
| 18396976 | PACKAGING STRUCTURE, ELECTRONIC PACKAGE, AND METHODS FOR MANUFACTURING THE SAME | ADROVEL, WILLIAM | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2023 |
| 18538415 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SUN, MICHAEL BRENNAN | 2892 | §102§103 | Final Rejection | — | Pending | Dec 13, 2023 |
| 18516192 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | HO, ANTHONY | 2817 | §102 | Non-Final OA | 70d | Pending | Nov 21, 2023 |
| 18479892 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | MUNOZ, ANDRES F | 2818 | §102§103§112 | Non-Final OA | — | Pending | Oct 03, 2023 |
| 18357459 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | PARTHASARATHY, ROHIT | 2899 | §103 | Final Rejection | — | Pending | Jul 24, 2023 |
| 18350850 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | CHEN, YU | 2896 | §103§112 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18350839 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 3d overdue | Pending | Jul 12, 2023 |
| 18220501 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | 34d | Pending | Jul 11, 2023 |
| 18324198 | WORKING SYSTEM FOR SEMICONDUCTOR PACKAGING PROCESS AND OPERATION METHOD THEREOF | MCCLAIN, GERALD | 3652 | §103Other | Non-Final OA | 56d | Pending | May 26, 2023 |
| 18319591 | CARRIER SUBSTRATE | NGUYEN, THANH T | 2893 | §102 | Non-Final OA | 22d | Pending | May 18, 2023 |
| 18310635 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §103 | Final Rejection | 9d overdue | Pending | May 02, 2023 |
| 18310072 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TYNES JR., LAWRENCE C | 2899 | §103 | Final Rejection | — | Pending | May 01, 2023 |
| 18309768 | ELECTRONIC PACKAGE | BOOTH, RICHARD A | 2812 | §103 | Final Rejection | 42d overdue | Pending | Apr 28, 2023 |
| 18064404 | ELECTRONIC PACKAGE | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Dec 12, 2022 |
| 17989554 | ELECTRONIC PACKAGE | FAN, SU JYA | 2818 | §103 | Final Rejection | — | Pending | Nov 17, 2022 |
| 17858358 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | Jul 06, 2022 |
| 17845302 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | KIM, JAHAE | 2897 | §103§112 | Final Rejection | — | Pending | Jun 21, 2022 |
| 17745709 | TESTING EQUIPMENT | PARK, HYUN D | 2857 | §103 | Non-Final OA | 9d | Pending | May 16, 2022 |
| 17411322 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | — | Pending | Aug 25, 2021 |
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