Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
DETAILED ACTION
Double Patenting
1. The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13.
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Claims 1-13 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-13 of U.S. Patent No. US12150273. Although the claims at issue are not identical, they are not patentably distinct from each other because the claim of the instant application is rejected as being unpatentable over the claims of the US patent 12150273. Please see below for the mapping in the table.
Application: 18923003
US Patent: 12150273
1. A cooling apparatus for a power module comprising a plurality of cooling modules including a first cooling module and a second cooling module provided to be in contact with each of both surfaces of the power module, wherein each of the cooling module comprises a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other, formed with a plurality of cooling channels through the guide wall, and having one end of a first channel of the cooling channels blocked and the other end of a second channel opposite the one end blocked; a pin plate having one surface being in contact with the power module, having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof, and being coupled to the manifold cover so that the pin faces the guide wall, so that a cooling fluid flowing into the first channel flows in the second direction and then flows out through the second channel, and wherein the ends of the pin plates of the first cooling module and the second cooling module facing each other are connected to each other through a connection part to form a flow path through which the cooling fluid flows.
1. A cooling apparatus for a power module comprising a plurality of cooling modules including a first cooling module and a second cooling module provided to be in contact with each of both surfaces of the power module, wherein each of the cooling module comprises a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other, formed with a plurality of cooling channels through the guide wall, and having one end of a first channel of the cooling channels blocked and the other end of a second channel opposite the one end blocked; a pin plate having one surface being in contact with the power module, having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof, and being coupled to the manifold cover so that the pin faces the guide wall, so that a cooling fluid flowing into the first channel flows in the second direction and then flows out through the second channel, and wherein the pin plate of the first cooling module is in contact with one side surface of the power module, the pin plate of the second cooling module is in contact with the other side surface of the power module, and the ends of the pin plates of the first cooling module and the second cooling module facing each other are connected to each other through a connection part to distribute the cooling fluid.
2. The cooling apparatus for the power module of claim 1, wherein the first channel includes a first blocking part connecting first ends of first guide walls on both sides of the first channel to block an outlet side thereof, and the second channel includes a second blocking part connecting second ends of second guide walls on both sides of the second channel to block an inlet side thereof, and the second ends of the second guide walls are opposite the first ends of the first guide walls.
2. The cooling apparatus for the power module of claim 1, wherein the first channel includes a first blocking part connecting first ends of first guide walls on both sides of the first channel to block an outlet side thereof, and the second channel includes a second blocking part connecting second ends of second guide walls on both sides of the second channel to block an inlet side thereof, and the second ends of the second guide walls are opposite the first ends of the first guide walls.
3. The cooling apparatus for the power module of claim 1, wherein a crossing angle between the first direction and the second direction is 80 degrees to 100 degrees.
3. The cooling apparatus for the power module of claim 1, wherein a crossing angle between the first direction and the second direction is 80 degrees to 100 degrees.
4. The cooling apparatus for the power module of claim 1, wherein the first direction and the second direction vertically cross each other.
4. The cooling apparatus for the power module of claim 1, wherein the first direction and the second direction vertically cross each other.
5. The cooling apparatus for the power module of claim 1, wherein the first cooling module is to contact one surface of the power module and comprises an inlet through which the cooling fluid is to be introduced through a supply flow path and the second cooling module is to contact the other surface of the power module and comprises an outlet through which the cooling fluid is to flow out through a discharge flow path.
5. The cooling apparatus for the power module of claim 1, wherein the first cooling module is to contact one surface of the power module and comprises an inlet through which the cooling fluid is to be introduced through a supply flow path and the second cooling module is to contact the other surface of the power module and comprises an outlet through which the cooling fluid is to flow out through a discharge flow path.
6. The cooling apparatus for the power module of claim 5, wherein the inlet is disposed in the manifold cover of the first cooling module, and the outlet is disposed in the manifold cover of the second cooling module.
6. The cooling apparatus for the power module of claim 5, wherein the inlet is disposed in the manifold cover of the first cooling module, and the outlet is disposed in the manifold cover of the second cooling module.
7. The cooling apparatus for the power module of claim 1, wherein the pin plates of the first cooling module and the second cooling module facing each other are spaced apart from each other by a thickness of the power module, and the connection part is disposed at a point between the spaced pin plates.
7. The cooling apparatus for the power module of claim 1, wherein the pin plates of the first cooling module and the second cooling module facing each other are spaced apart from each other by a thickness of the power module, and the connection part is disposed at a point between the spaced pin plates.
8. The cooling apparatus for the power module of claim 1, wherein at least one pin among the plurality of pins of the pin plate protrudes from the pin plate, and the at least one pin has a shape in which a horizontal cross-sectional area is reduced toward the protruding end.
8. The cooling apparatus for the power module of claim 1, wherein at least one pin among the plurality of pins of the pin plate protrudes from the pin plate, and the at least one pin has a shape in which a horizontal cross-sectional area is reduced toward the protruding end.
9. The cooling apparatus for the power module of claim 8, wherein the at least one pin has a shape in which a vertical cross-sectional shape of the protruding end is a triangle or a curve.
9. The cooling apparatus for the power module of claim 8, wherein the at least one pin has a shape in which a vertical cross-sectional shape of the protruding end is a triangle or a curve.
10. The cooling apparatus for the power module of claim 1, wherein the manifold cover further includes a rim welded, adhered, or bolted to the pin plate.
10. The cooling apparatus for the power module of claim 1, wherein the manifold cover further includes a rim welded, adhered, or bolted to the pin plate.
11. The cooling apparatus for the power module of claim 1, wherein a plurality of power modules are to be arranged to be spaced apart from each other and between the plurality of cooling modules, so that the plurality of power modules share the plurality of cooling modules, and the plurality of cooling modules further includes a plurality of channel groups to correspond to each of the power module.
11. The cooling apparatus for the power module of claim 1, wherein a plurality of power modules are to be arranged to be spaced apart from each other and between the plurality of cooling modules, so that the plurality of power modules share the plurality of cooling modules, and the plurality of cooling modules further includes a plurality of channel groups to correspond to each of the power module.
12. The cooling apparatus for the power module of claim 11, wherein the first channel and the second channel are present in each of the plurality of channel groups, the first channel includes a first blocking part connecting first ends of first guide walls on both sides of the first channel to block an outlet side thereof, and the second channel includes a second blocking part connecting second ends of second guide walls on both sides of the second channel to block an inlet side thereof, and the second ends of the second guide walls are opposite the first ends of the first guide walls.
12. The cooling apparatus for the power module of claim 11, wherein the first channel and the second channel are present in each of the plurality of channel groups, the first channel includes a first blocking part connecting first ends of first guide walls on both sides of the first channel to block an outlet side thereof, and the second channel includes a second blocking part connecting second ends of second guide walls on both sides of the second channel to block an inlet side thereof, and the second ends of the second guide walls are opposite the first ends of the first guide walls.
13. The cooling apparatus for the power module of claim 12, wherein the first channel of one side channel group has the first blocking part connected to the second blocking part of the second channel of the other side channel group adjacent thereto, and the second channel of the one side channel group has the outlet side connected to an inlet side of the first channel of the other side channel group adjacent thereto.
13. The cooling apparatus for the power module of claim 12, wherein the first channel of one side channel group has the first blocking part connected to the second blocking part of the second channel of the other side channel group adjacent thereto, and the second channel of the one side channel group has the outlet side connected to an inlet side of the first channel of the other side channel group adjacent thereto.
Allowable Subject matter
2. Claims 1-13 are allowable, assuming double patenting and/or informalities are overcome.
The following is an examiners statement of reasons for allowance:
Upon conclusion of a comprehensive search of the pertinent prior art, the office indicates that the highlighted language of the claims constitutes reasons for allowance.
Regarding claim 1, patentability exists, at least in part with the claimed combination of elements and features of: a pin plate having one surf ace being in contact with the power module, having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof, and being coupled to the manifold cover so that the pin faces the guide wall, so that a cooling fluid flowing into the first channel flows in the second direction and then flows out through the second channel, and wherein the ends of the pin plates of the first cooling module and the second cooling module facing each other are connected to each other through a connection part to form a flow path through which the cooling fluid flows.
Claims 2-13 depends on claim 1, therefore allowable for the same reason.
Email Communication
3. Applicant is encouraged to authorize the Examiner to communicate via email by filing form PTO/SB/439 either via USPS, Central Fax, or EFS-Web. See MPEP 502.01, 502, 502.05.
Conclusion
4. The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Lee et al. US2020/0344920 discloses a cooling apparatus (100) for a power module ([0033]) comprising a plurality of cooling modules (110 & 300, see fig.3) including a first cooling module (110 & 300, see fig.3, “bottom portion”) and a second cooling module (110 & 300, see fig.3, “top portion”) provided to be in contact with each of both surfaces of the power module ([0040], “cooling plate 300 is in contact with both sides of power conversion module”), a pin plate (300) having one surface being in contact with the power module (see fig.3; [0040]), having a plurality of pins (310) extending in a second direction crossing a first direction formed on the other surface thereof (see fig.3),
Lee et al. does not explicitly teach wherein each of the cooling module comprises a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other, formed with a plurality of cooling channels through the guide wall, and having one end of a first channel of the cooling channels blocked and the other end of a second channel opposite the one end blocked… and being coupled to the manifold cover so that the pin faces the guide wall, so that a cooling fluid flowing into the first channel flows in the second direction and then flows out through the second channel, and wherein the ends of the pin plates of the first cooling module and the second cooling module facing each other are connected to each other through a connection part to form a flow path through which the cooling fluid flows.
Zhou et al. US2017/0055378 discloses a cooling apparatus (101, see fig.1) for a power module (190A-F, see fig.2A-2B; [0003]) comprising a plurality of cooling modules (170A-F, 140A-F & 174, see fig.2B; [0059]) including a first cooling module (170ACE, 140ACE & 174ACE) and a second cooling module (170BDF, 140BDF & 174BDF, see fig.2A-2C) provided to be in contact with each of both surfaces of the power module (see fig.2B-2C, “the cooling modules are in contact with each surface of the power module”), wherein each of the cooling module comprises a manifold cover (140A-F) provided with a plurality of guide walls (158, see fig.4A-4B; [0052]) extending in a first direction in a state of being spaced apart from each other (see fig.4A-4B, “extends sideways from left to right”), formed with a plurality of cooling channels (142 & 144; [0052]) through the guide wall (see fig.4A-4B), and having one end of a first channel of the cooling channels blocked and the other end of a second channel opposite the one end blocked (see fig.4A-4B); a pin plate (170A-F & 174A-F) having one surface being in contact with the power module (see fig.1-2C), having a plurality of pins (174A-F) extending in a second direction (see fig.5A-5B, “extends upwards”) crossing the first direction formed on the other surface thereof (see fig.2A-2C), and being coupled to the manifold cover so that the pin faces the guide wall (see fig.2C, 4A-4C; [0059]), so that a cooling fluid flowing into the first channel flows in the second direction and then flows out through the second channel (see fig4A-4B), and
Zhou et al. US2017/0055378 does not explicitly teach wherein the ends of the pin plates of the first cooling module and the second cooling module facing each other are connected to each other through a connection part to form a flow path through which the cooling fluid flows.
Applicants are directed to consider additional pertinent prior are included on the Notice of References Cited (PTOL 892) attached herewith. The Examiner has pointed out particular references contained in the prior art of record within the body of this action for the convenience of the Applicant. Although the specified citations are representative of the teachings in the art and are applied to the specific limitations within the individual claim, other passages and figures may apply. Applicant, in preparing the response, should consider fully the entire reference as potentially teaching all or part of the claimed invention, as well as the context of the passage as taught by the prior art or disclosed by the Examiner.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MICHAEL A MATEY whose telephone number is (571)270-5648. The examiner can normally be reached Monday-Friday 8-5 EST.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, JAYPRAKASH GANDHI can be reached at 5712723740. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/MICHAEL A MATEY/Primary Examiner, Art Unit 2841
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