Prosecution Insights
Last updated: October 27, 2026
Application No. 18/924,796

Systems and Methods for Monitoring Cleanliness of a Substrate Processing Chamber

Non-Final OA §102
Filed
Oct 23, 2024
Examiner
TOOHEY, RICHARD ORLANDO
Art Unit
2884
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Applied Materials Inc.
OA Round
3 (Non-Final)
82%
Grant Probability
Favorable
3-4
OA Rounds
5m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
59 granted / 72 resolved
+13.9% vs TC avg
Moderate +12% lift
Without
With
+11.8%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
22 currently pending
Career history
105
Total Applications
across all art units

Statute-Specific Performance

§101
4.0%
-36.0% vs TC avg
§103
43.4%
+3.4% vs TC avg
§102
27.2%
-12.8% vs TC avg
§112
22.9%
-17.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 72 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Arguments Applicant's arguments filed June 19, 2026 have been fully considered but they are not persuasive. Regarding amended claim 1 the applicant argues the rejection under 35 U.S.C. 102 is improper over Gottscho US 2019/0252163 because Gottscho fails to teach “wherein the analyzing includes identifying the shape of particles in the captured image, the location of particles on the component in the captured image, and streak signature of particles on the component in the captured image.” Regarding claims 2 and 10, the applicant argues the rejection under 35 U.S.C. 102 is improper over Gottscho US 2019/0252163 because Gottscho fails to teach “wherein the analyzing includes identifying at least one of number, size, or particle density of particles on the component in the image.” The Examiner respectfully disagrees. Regarding claim 1, paragraph [0040] of Gottscho reads: “Besides spectral information in the light reflected from the chamber walls, images of each exposed region of the chamber can be collected and analyzed for uneven coating wear, residue build-up, uneven pre-coats, etc….The image processor can collect images collected over multiple sessions of imaging, which can then be coalesced into a time-based history of changes in the build-up of residues and/or consumable part wear. In one configuration, by rotating while translating the light source and detector, parts of the chamber, specific areas, specific parts or the entire inside of the chamber can be image profiled.” Paragraph [0009] clarifies that the residue build up is particulate matter. Regarding the claim element in question, this reading teaches wherein the analyzing includes identifying the shape of particles in the captured image (the broadest reasonable interpretation of “the shape of particles in the captured images” includes the shape of each individual particle and also the shape of the bulk of the plurality of particles in aggregate. Collecting a timeseries of images of residue build and analyzing the changes over time is analyzing the shape of the bulk of particulate matter), the location of particles on the component in the captured image (the images are collected over specific parts, areas, etc. which is the location on the component), and streak signature of particles on the component in the captured image (paragraph [0039] of the specification defines the streak signature as the shape or pattern of the wetted particulate matter as it is deposited on the component. Gottsch paragraph [0031] discloses that the analysis includes identifying the uniformity or non-uniformity of the residues and such an analysis of the timeseries combined with the shape constitutes a streak signature.) Regarding claims 3 and 10, Gottscho must only teach one element of the list “wherein the analyzing includes identifying at least one of number, size, or particle density of particles on the component in the image.” Paragraph [0031] of Gottscho discloses that the analysis includes identifying the uniformity or non-uniformity of the residues and such an analysis of the timeseries of the particulate residue build-up is at least analyzing the particle density. Therefore, the examiner maintains the rejection. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 1-20 are rejected under 35 U.S.C. 102(a)(1) and 35 U.S.C. 102(a)(2) as being anticipated by Gottscho US 2019/0252163. Regarding claim 1, Gottscho discloses a method of monitoring cleanliness of a substrate processing chamber (para. 0027, 0041), the method comprising: illuminating a surface of a component of the substrate processing chamber (fig. 3; para. 0068), the component surrounded by a chamber enclosure that is sealed from external light (fig. 2 #120; chamber 120 is entirely closed and thus sealed from external light), the surface being illuminated by UV light (para. 0067) generated from within a volume between the component and the enclosure (fig. 2; scope 158 generates the light and is between at least one side of the enclosure 120 and a component); capturing an image of the illuminated surface (para. 0041); analyzing the captured image (para. 0041); wherein the analyzing includes identifying the shape of particles in the captured image (the broadest reasonable interpretation of “the shape of particles in the captured images” includes the shape of each individual particle and also the shape of the bulk of the plurality of particles in aggregate. Collecting a timeseries of images of residue build and analyzing the changes over time is analyzing the shape of the bulk of particulate matter), the location of particles on the component in the captured image (the images are collected over specific parts, areas, etc. which is the location on the component), and streak signature of particles on the component in the captured image (paragraph [0039] of the specification defines the streak signature as the shape or pattern of the wetted particulate matter as it is deposited on the component. Gottsch paragraph [0031] discloses that the analysis includes identifying the uniformity or non-uniformity of the residues and such an analysis of the timeseries combined with the shape constitutes a streak signature.); determining based on the analyzing whether chamber cleaning is needed (para. 0041); and when it is determined that chamber cleaning is needed, generating an alert indicating that chamber cleaning is needed (para. 0041). Regarding claim 3, Gottscho discloses wherein the analyzing includes identifying at least one of number, size, particle density, or location of particles on the component (para. 0031-0032, 0040; metrics characterizing physical changes of residue build-up and uniformity of residues includes at least density and location information), and wherein the determining includes comparing the at least one of number, size, particle density, or location of particles on the component to one or more predefined thresholds indicative of deteriorated chamber cleanliness, and determining, based on the comparison whether chamber cleaning is needed (para. 0040-0041). Regarding claim 4, Gottscho discloses wherein the component includes a portion that houses a substrate support (fig. 2 #122; para. 0064). Regarding claim 5, Gottscho discloses wherein the determining includes processing the captured image with a machine learning model (para. 0029). Regarding claim 6, Gottscho discloses wherein capturing an image includes capturing a plurality of images or video (para. 0040-0041; images and pictures being plural implies more than one image). Regarding claim 7, Gottscho discloses wherein the surface is opaque or solid (fig. 3 #170a; the surface 170a is both solid and is reflecting incident light and is thus opaque). Regarding claim 8, Gottscho discloses a system configured to monitor cleanliness of a substrate processing chamber (#156, 108), the system comprising: a UV light source (#190; para. 0067); a camera (#180); and a controller coupled to at least one of the UV light source or the camera (fig. 3 #108 is coupled to the camera and light source), the controller comprising: one or more processors (fig. 3 #144, 146); and one or more non-transitory computer readable media having instructions stored thereon which, when executed by the one or more processors, cause the one or more processors to perform (para. 0070-0071; processors are described as being able to collect, process, and store data and executing instructions which implies the existence of non-transitory computer readable media, i.e. memory): illuminating a surface of a component of the substrate processing chamber (fig. 3; para. 0068), the component surrounded by a chamber enclosure that is sealed from external light (fig. 2 #120; chamber 120 is entirely closed and thus sealed from external light), the surface being illuminated by UV light (para. 0067) generated from within a volume between the component and the enclosure (fig. 2; scope 158 generates the light and is between at least one side of the enclosure 120 and a component); capturing an image of the illuminated surface (para. 0041); analyzing the captured image (para. 0041), wherein the analyzing includes identifying the shape of particles in the captured image (the broadest reasonable interpretation of “the shape of particles in the captured images” includes the shape of each individual particle and also the shape of the bulk of the plurality of particles in aggregate. Collecting a timeseries of images of residue build and analyzing the changes over time is analyzing the shape of the bulk of particulate matter), the location of particles on the component in the captured image (the images are collected over specific parts, areas, etc. which is the location on the component), and streak signature of particles on the component in the captured image (paragraph [0039] of the specification defines the streak signature as the shape or pattern of the wetted particulate matter as it is deposited on the component. Gottsch paragraph [0031] discloses that the analysis includes identifying the uniformity or non-uniformity of the residues and such an analysis of the timeseries combined with the shape constitutes a streak signature.); determining based on the analyzing whether chamber cleaning is needed (para. 0041); and when it is determined that chamber cleaning is needed, generating an alert indicating that chamber cleaning is needed (para. 0041). Regarding claim 10, Gottscho discloses wherein the analyzing includes identifying at least one of number, size, particle density, or location of particles on the component (para. 0031-0032, 0040; metrics characterizing physical changes of residue build-up and uniformity of residues includes at least density and location information), and wherein the determining includes comparing the at least one of number, size, particle density, or location of particles on the component to one or more predefined thresholds indicative of deteriorated chamber cleanliness, and determining, based on the comparison whether chamber cleaning is needed (para. 0040-0041). Regarding claim 11, Gottscho discloses wherein the determining includes processing the captured image with a machine learning model (para. 0029). Regarding claim 12, Gottscho discloses wherein capturing an image includes capturing a plurality of images or video (para. 0040-0041; images and pictures being plural implies more than one image). Regarding claim 13, Gottscho discloses wherein the surface is opaque or solid (fig. 3 #170a; the surface 170a is both solid and is reflecting incident light and is thus opaque). Regarding claim 14, Gottscho discloses wherein the component is a component of a wet clean chamber (para. 0002). Regarding claim 15, Gottscho discloses a substrate processing chamber (fig. 2) comprising: an enclosure surrounding a volume, the enclosure being sealed from external light (fig. 2 #120; chamber 120 is entirely closed and thus sealed from external light); a component disposed in the volume (fig. 3 #170; para. 0068; chamber part being equivalent to component); a UV light source disposed in the volume and configured to illuminate a surface of the component (fig. 2; scope 158 generates the light and is between at least one side of the enclosure 120 and a component); a camera disposed in the volume and configured to capture an image of the component when illuminated by the UV light source (#180; para. 0070); and a controller in communication with the UV light source and the camera (fig. 3 #108 is coupled to the camera and light source), the controller configured to analyze the image captured by the camera, wherein the analyzing includes identifying the shape of particles in the captured image (the broadest reasonable interpretation of “the shape of particles in the captured images” includes the shape of each individual particle and also the shape of the bulk of the plurality of particles in aggregate. Collecting a timeseries of images of residue build and analyzing the changes over time is analyzing the shape of the bulk of particulate matter), the location of particles on the component in the captured image (the images are collected over specific parts, areas, etc. which is the location on the component), and streak signature of particles on the component in the captured image (paragraph [0039] of the specification defines the streak signature as the shape or pattern of the wetted particulate matter as it is deposited on the component. Gottsch paragraph [0031] discloses that the analysis includes identifying the uniformity or non-uniformity of the residues and such an analysis of the timeseries combined with the shape constitutes a streak signature.), and determine, based on the analysis, whether chamber cleaning is needed (para. 0041, 0067), and generate an alert indicating that chamber cleaning is needed when it is determined that chamber cleaning is needed (para. 0041). Regarding claim 16, Gottscho discloses wherein at least one of the UV light source or the camera is remotely moveable within the volume (para. 0048; the scope 156 houses both the UV light and the camera and is remotely movable via arm 150). Regarding claim 17, Gottscho discloses wherein the component is a component of a wet clean chamber (para. 0002). Regarding claim 18, Gottscho discloses wherein the surface of the component is opaque or solid (fig. 3 #170a; the surface 170a is both solid and is reflecting incident light and is thus opaque). Regarding claim 19, Gottscho discloses a substrate support housed at least partially by the component (fig. 2 #122; para. 0064). Regarding claim 20, Gottscho discloses wherein the controller is configured to identify at least one of number, size, or particle density of particles on the component (para. 0031-0032, 0040, 0067; metrics characterizing physical changes of residue build-up and uniformity of residues includes at least particle density information). Regarding claim 21, Gottcho discloses wherein the analysis includes identifying at least one of number, size, or particle density of particles on the component in the image (para. 0031-0032, 0040, 0067; metrics characterizing physical changes of residue build-up and uniformity of residues includes at least particle density information), and wherein the determining includes comparing the at least one of number, size, or particle density of particles on the component to one or more predefined thresholds indicative of deteriorated chamber cleanliness, and determining, based on the comparison whether chamber cleaning is needed (para. 0040-0041). Allowable Subject Matter Claim 22 is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: Regarding claim 22, the prior art of record does not disclose or suggest wherein identifying the shape of particles includes identifying solid particles and flakes on the component, along with other claim limitations. Gottscho US 2019/0252163, does not disclose or suggest “wherein identifying the shape of particles includes identifying solid particles and flakes on the component," along with other claim limitations. Contact Information THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to Richard Toohey whose telephone number is (703)756-5818. The examiner can normally be reached Mon-Fri: 7:30am – 5pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, the applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Uzma Alam can be reached on (571)272-2995. The fax number for the organization where this application or processing is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /RICHARD O TOOHEY/Examiner, Art Unit 2884 /UZMA ALAM/Supervisory Patent Examiner, Art Unit 2884
Read full office action

Prosecution Timeline

Show 2 earlier events
Jun 04, 2026
Examiner Interview Summary
Jun 04, 2026
Applicant Interview (Telephonic)
Jun 19, 2026
Response Filed
Sep 09, 2026
Final Rejection mailed — §102
Oct 05, 2026
Applicant Interview (Telephonic)
Oct 05, 2026
Response after Non-Final Action
Oct 05, 2026
Examiner Interview Summary
Oct 22, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
82%
Grant Probability
94%
With Interview (+11.8%)
2y 5m (~5m remaining)
Median Time to Grant
High
PTA Risk
Based on 72 resolved cases by this examiner. Grant probability derived from career allowance rate.

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