Prosecution Insights
Last updated: July 17, 2026
Application No. 18/967,532

ELECTRONIC PACKAGE STRUCTURE

Final Rejection §102
Filed
Dec 03, 2024
Priority
Feb 18, 2020 — continuation of 11/588,470 +1 more
Examiner
GANNON, LEVI
Art Unit
2849
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Advanced Semiconductor Engineering Inc.
OA Round
2 (Final)
83%
Grant Probability
Favorable
3-4
OA Rounds
5m
Est. Remaining
90%
With Interview

Examiner Intelligence

Grants 83% — above average
83%
Career Allowance Rate
1239 granted / 1498 resolved
+14.7% vs TC avg
Moderate +7% lift
Without
With
+6.8%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 0m
Avg Prosecution
42 currently pending
Career history
1528
Total Applications
across all art units

Statute-Specific Performance

§101
0.8%
-39.2% vs TC avg
§103
64.6%
+24.6% vs TC avg
§102
26.1%
-13.9% vs TC avg
§112
5.5%
-34.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1498 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 1-2 and 4-6 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Tseng et al. (US 10,812,017; “Tseng”; reference of record). Regarding claim 1, Tseng teaches an electronic package structure (figure 1), comprising: a carrier (100, 108); a first electronic component (101) disposed adjacent to the carrier (100, 108), wherein the first electronic component (101) comprises a heat source region (101H), a first surface (bottom), and a second surface (top) opposite the first surface; a second electronic component (102) is thermally connected to the heat source region (101H) by a connecting layer (102’), the second electronic component (102) comprising a third surface (bottom) and a fourth surface (top) opposite the third surface, the third surface (bottom) facing the second surface (top); a first wire (111B) electrically connecting the first electronic component (101) and the carrier (100, 108), wherein the first wire (111B) has a first end (left end) and a second end (right end) opposite to the first end, wherein the second end (right end) of the first wire (111B) is on the carrier (100, 108) and below a top surface of the carrier (100, 108) and the first end (left end) is on the second surface (top of 101); and a second wire (111A) electrically connecting the first electrical component (101) and the second electrical component (102), wherein the second wire (111A) has a first end (right end) and a second end (left end) opposite to the first end, wherein the first end (right end) of the second wire (111A) is on the second surface (top of 101) and the second end (left end) of the second wire (111A) is on the fourth surface (top of 102); wherein the third surface (bottom of 102) is bonded to the heat source region (101H) by a die attach film (Bonding layer 102’. Tseng teaches utilizing a die attach film as a bonding layer material. Col. 4, lines 43-44). As for claim 2, Tseng (figures 1 and 5) teaches wherein the carrier (100, 108) has a first surface (on 100C) recessed from the top surface of the carrier (100, 108), wherein an elevation of the first surface (on 100C) of the carrier is between (see configuration of figure 5) the first surface and the second surface of the first electronic component (101), wherein the first surface of the first electronic component (101) is an active surface, wherein the heat source region (101H) is embedded in the first electronic component (101) and exposed from the active surface (See figure 1). As for claim 4, Tseng teaches wherein the carrier is monolithic (See configuration of figure 1). Regarding claim 5, Tseng teaches wherein the first electronic component (101) is spaced apart from the carrier (100, 108) by a distance, wherein the third surface (bottom) is a backside surface, and the fourth surface (top) is an active surface, wherein the backside surface (bottom) of the second electronic component (102) is thermally connected to the heat source region (101H). As for claim 6, Tseng teaches wherein a horizontal distance between the first electronic component (101) and the carrier (100, 108) is less than a vertical distance between the first electronic component (101) and the carrier (1000, 108) in a cross-sectional view (See configuration of figure 1). Allowable Subject Matter Claims 8-20 are allowed. Claim 7 and 21 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: The best prior art references of record, Obata and Tseng, fail to teach: “a support component disposed at or near a center of a bottom surface of the first electronic component, wherein a width of the support component is less than a width of the first electronic component”, as set forth in claim 7; “wherein the elevation of the second surface is between an active surface of the first electronic component and a backside surface of the first electronic component opposite to the active surface”, as set forth in claim 8; and “wherein the support structure comprises a photoresist pillar directly contacting the first electronic component.”, as set forth in claim 14. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to LEVI GANNON whose telephone number is (571)272-7971. The examiner can normally be reached 7:00AM-4:30PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Menatoallah Youssef can be reached at 571-270-3684. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /LEVI GANNON/Primary Examiner, Art Unit 2836 April 22, 2026
Read full office action

Prosecution Timeline

Dec 03, 2024
Application Filed
Dec 01, 2025
Non-Final Rejection (signed) — §102
Jan 14, 2026
Non-Final Rejection mailed — §102
Mar 13, 2026
Interview Requested
Mar 24, 2026
Examiner Interview Summary
Mar 24, 2026
Applicant Interview (Telephonic)
Apr 13, 2026
Response Filed
Apr 24, 2026
Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
83%
Grant Probability
90%
With Interview (+6.8%)
2y 0m (~5m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 1498 resolved cases by this examiner. Grant probability derived from career allowance rate.

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