Prosecution Insights
Prosecution Insights
43 pending office actions • 18 art units • 41 examiners • 0 of 43 (0%) have an AI response strategy ready • 96 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 43 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 43 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 32 (74%) |
| §102 only | 9 (21%) |
| No statute on record | 2 (5%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHIEM, DINH D | 3 | 72.4% | +16.3% |
| WILLIS, TREMESHA S | 1 | 77.9% | +17.3% |
| AYCHILLHUM, ANDARGIE M | 1 | 84.2% | +14.8% |
| YUSHIN, NIKOLAY K | 1 | 93.2% | +2.1% |
| LE, THAO P | 1 | 92.5% | -1.1% |
| SPALLA, DAVID C | 1 | 84.3% | +4.8% |
| GREEN, TAJANAE NICOLE | 1 | 100.0% | +0.0% |
| PARTHASARATHY, ROHIT | 1 | 90.6% | +12.5% |
| ULLAH, ELIAS | 1 | 84.6% | +8.0% |
| NADAV, ORI | 1 | 60.3% | +20.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18373853 | PACKAGE STRUCTURE | ULLAH, ELIAS | 23d overdue |
| 18402649 | ELECTRONIC ASSEMBLY | LE, THAO P | 8d |
| 18406044 | PACKAGE STRUCTURE | YUSHIN, NIKOLAY K | 15d |
| 18418125 | PACKAGE STRUCTURE | AYCHILLHUM, ANDARGIE M | 50d |
| 18506094 | OPTOELECTRONIC STRUCTURE | GREEN, TAJANAE NICOLE | 62d |
| 18510493 | ELECTRONIC DEVICE | SPALLA, DAVID C | 63d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17949143 | OPTOELECTRONIC PACKAGE | CHIEM, DINH D | 118d overdue |
| 18605706 | ELECTRONIC DEVICE | WILLIS, TREMESHA S | 44d overdue |
| 18127624 | PACKAGE DEVICE AND ELECTRONIC DEVICE | CHIEM, DINH D | 3d overdue |
| 18371377 | PACKAGE STRUCTURE | NADAV, ORI | 5d |
| 18490615 | ELECTRONIC DEVICE | PARTHASARATHY, ROHIT | 15d |
| 18128988 | PACKAGE STRUCTURE | CHIEM, DINH D | 20d |
| 18418125 | PACKAGE STRUCTURE | AYCHILLHUM, ANDARGIE M | 50d |
| Art Unit | Apps |
|---|---|
| 2874 | 8 |
| 2899 | 7 |
| 2893 | 5 |
| 2898 | 4 |
| 2818 | 3 |
| 2847 | 2 |
| 2812 | 2 |
| 2815 | 2 |
| 2811 | 1 |
| 3624 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18605706 | ELECTRONIC DEVICE | WILLIS, TREMESHA S | 2847 | §102 | Non-Final OA | 44d overdue | Pending | Mar 14, 2024 |
| 18418125 | PACKAGE STRUCTURE | AYCHILLHUM, ANDARGIE M | 2847 | §103 | Non-Final OA | 50d | Pending | Jan 19, 2024 |
| 18406044 | PACKAGE STRUCTURE | YUSHIN, NIKOLAY K | 2893 | §103 | Non-Final OA | 15d | Pending | Jan 05, 2024 |
| 18402649 | ELECTRONIC ASSEMBLY | LE, THAO P | 2818 | §102 | Non-Final OA | 8d | Pending | Jan 02, 2024 |
| 18510493 | ELECTRONIC DEVICE | SPALLA, DAVID C | 2893 | §103 | Non-Final OA | 63d | Pending | Nov 15, 2023 |
| 18506094 | OPTOELECTRONIC STRUCTURE | GREEN, TAJANAE NICOLE | 2874 | §102 | Non-Final OA | 62d | Pending | Nov 09, 2023 |
| 18490615 | ELECTRONIC DEVICE | PARTHASARATHY, ROHIT | 2899 | Other | Non-Final OA | 15d | Pending | Oct 19, 2023 |
| 18373853 | PACKAGE STRUCTURE | ULLAH, ELIAS | 2893 | §102 | Non-Final OA | 23d overdue | Pending | Sep 27, 2023 |
| 18371377 | PACKAGE STRUCTURE | NADAV, ORI | 2811 | §103 | Non-Final OA | 5d | Pending | Sep 21, 2023 |
| 18244205 | INTERPOSER STRUCTURE AND PACKAGE STRUCTURE | ESKRIDGE, CORY W | 3624 | §103 | Non-Final OA | 9d | Pending | Sep 08, 2023 |
| 18239726 | ELECTRONIC DEVICE | LEE, CHEUNG | 2812 | §103 | Non-Final OA | 39d | Pending | Aug 29, 2023 |
| 18237880 | PACKAGE STRUCTURE | HAIDER, WASIUL | 2812 | §103 | Non-Final OA | 5d | Pending | Aug 24, 2023 |
| 18227892 | BONDING STRUCTURE AND PACKAGE STRUCTURE | FAN, SU JYA | 2818 | §103 | Non-Final OA | 9d | Pending | Jul 28, 2023 |
| 18227896 | BOND STRUCTURE | RAMOS-DIAZ, FERNANDO JOSE | 2818 | §102 | Non-Final OA | 38d overdue | Pending | Jul 28, 2023 |
| 18207088 | PACKAGE STRUCTURE | NIELSEN, DEREK LANG | 2899 | §103 | Final Rejection | 56d | Pending | Jun 07, 2023 |
| 18206579 | PACKAGE STRUCTURE | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Non-Final OA | 23d | Pending | Jun 06, 2023 |
| 18202243 | ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE | PAPE, ALYSSA MORGAN | 3794 | — | Non-Final OA | 59d overdue | Pending | May 25, 2023 |
| 18144162 | ELECTRONIC PACKAGE | JEAN BAPTISTE, WILNER | 2899 | §102 | Final Rejection | 23d | Pending | May 05, 2023 |
| 18135076 | PACKAGE DEVICE | BEDTELYON, JOHN M | 2874 | §102 | Non-Final OA | 2d overdue | Pending | Apr 14, 2023 |
| 18132351 | ELECTRONIC DEVICE | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | 16d overdue | Pending | Apr 07, 2023 |
| 18129769 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | THOMASON, DARBY MARGARET | 2874 | §103 | Final Rejection | 25d overdue | Pending | Mar 31, 2023 |
| 18128988 | PACKAGE STRUCTURE | CHIEM, DINH D | 2874 | §103 | Non-Final OA | 20d | Pending | Mar 30, 2023 |
| 18127624 | PACKAGE DEVICE AND ELECTRONIC DEVICE | CHIEM, DINH D | 2874 | §103 | Final Rejection | 3d overdue | Pending | Mar 28, 2023 |
| 18116269 | PACKAGE STRUCTURE | ANGUIANO, MICHAEL | 2899 | §103 | Final Rejection | 71d | Pending | Mar 01, 2023 |
| 18099056 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | STARK, JARRETT J | 2898 | §103 | Non-Final OA | 6d | Pending | Jan 19, 2023 |
| 18098395 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | HANUMASAGAR, SHAMITA S | 2814 | §103 | Non-Final OA | 66d overdue | Pending | Jan 18, 2023 |
| 18092145 | OPTICAL DEVICE | ENDRESEN, KIRSTEN DANIELA | 2874 | §103 | Non-Final OA | 9d | Pending | Dec 30, 2022 |
| 18092148 | OPTICAL MODULE | BAGHDASARYAN, HOVHANNES | 3645 | §103 | Final Rejection | 41d | Pending | Dec 30, 2022 |
| 18090438 | ELECTRONIC DEVICE WITH ELECTROMAGNET | CHAU, LISA N | 1785 | §103 | Non-Final OA | 5d overdue | Pending | Dec 28, 2022 |
| 18088498 | PACKAGE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE PACKAGE | DYKES, LAURA M | 2892 | §103 | Final Rejection | 26d | Pending | Dec 23, 2022 |
| 18076417 | ELECTRONIC DEVICE | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103 | Final Rejection | 2d overdue | Pending | Dec 07, 2022 |
| 17966698 | ELECTRONIC MODULE AND ELECTRONIC APPARATUS | MELLINGER, CORBYN DAVID | 2899 | §103 | Final Rejection | 34d | Pending | Oct 14, 2022 |
| 17956682 | ELECTRONIC PACKAGE | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Non-Final OA | 17d overdue | Pending | Sep 29, 2022 |
| 17950041 | SEMICONDUCTOR PACKAGE | ESIABA, NKECHINYERE OTUOMASIRICH | 2817 | §103 | Non-Final OA | 36d overdue | Pending | Sep 21, 2022 |
| 17949143 | OPTOELECTRONIC PACKAGE | CHIEM, DINH D | 2874 | §103 | Final Rejection | 118d overdue | Pending | Sep 20, 2022 |
| 17856893 | OPTICAL DEVICE | RADKOWSKI, PETER | 2874 | §103 | Non-Final OA | 42d overdue | Pending | Jul 01, 2022 |
| 17738768 | ELECTRONIC PACKAGE | WYATT, JOSHUA SCOTT | 2815 | §102 | Final Rejection | 114d overdue | Pending | May 06, 2022 |
| 17676092 | ELECTRONIC DEVICE WITH FRAME COMPONENT | CHEN, DAVID Z | 2815 | §103 | Final Rejection | 98d overdue | Pending | Feb 18, 2022 |
| 17503229 | OPTOELECTRONIC PACKAGE STRUCTURE INCLUDING A THERMAL CONDUCTIVE ELEMENT FOR HEAT DISSIPATION | GOLUB-MILLER, MARCIA A | 2828 | §103 | Non-Final OA | 23d overdue | Pending | Oct 15, 2021 |
| 17460057 | ELECTRONIC DEVICE | GREEN, TELLY D | 2898 | §103 | Final Rejection | 96d overdue | Pending | Aug 27, 2021 |
| 17092196 | WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | BELL, LAUREN R | 2896 | §103 | Non-Final OA | 71d overdue | Pending | Nov 06, 2020 |
| 17025972 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | CHEN, JACK S J | 2893 | §102 | Non-Final OA | 309d overdue | Pending | Sep 18, 2020 |
| 16877197 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | BOYLE, ABBIGALE A | 2899 | §103 | Final Rejection | 114d overdue | Pending | May 18, 2020 |
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