Prosecution Insights
Last updated: October 02, 2026

Advanced Semiconductor Engineering Inc.

Technology area: Semiconductors, Circuits & Optics

32 pending office actions • 14 art units • 29 examiners • 0 of 32 (0%) have an AI response strategy ready • 104 patents granted in the last 365 days

Portfolio Summary

32
Total Pending OAs
21
Non-Final OAs
10
Final Rejections
1
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 10 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

7
Overdue
1
Due this week
2
Due this month
0
Due in next 60 days
0
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 10 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (7)Due ≤ 7 days (1)Due ≤ 30 days (2)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

18
Hard (56%)
12
Medium (38%)
2
Easy (6%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only9 (28%)
§102 only3 (9%)
§112 only1 (3%)
Double-patenting only1 (3%)
Multi-statute (no §101)18 (56%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

1
Life Sciences
3% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
20
Semiconductors
62% of docket
2
Mechanical / Eng
6% of docket
9
Business / Other
28% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

320 h
Manual time on pending OAs
64 h
Time saved (low, 20%)
112 h
Time saved (mid, 35%)
2.8 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
ENDRESEN, KIRSTEN DANIELA 2 71.3% +15.6%
PAPE, ALYSSA MORGAN 2 28.0% +43.1%
SRINIVASAN, SESHA SAIRAMAN 2 67.3% +27.4%
TRAN, HAI V 1 79.1% +18.6%
SMITH, GRAHAM P 1 77.1% +12.1%
ROBINSON, RYAN C 1 78.4% +14.4%
DINH, TUAN T 1 78.8% +22.1%
AL-TAWEEL, MUAAMAR QAHTAN 1 80.6% +19.7%
FERNANDES, ERROL V 1 85.4% +10.8%
PARKER, JOHN M 1 92.1% +0.9%

Quick Wins (2)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.

App #TitleExaminerDue in
18895205 SEMICONDUCTOR PACKAGE STRUCTURE FERNANDES, ERROL V —
18780208 ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME PARKER, JOHN M —

Hard Cases (19)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
17025972 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME BODNAR, JOHN A 309d overdue
18098395 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME HANUMASAGAR, SHAMITA S 66d overdue
18202243 ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE PAPE, ALYSSA MORGAN 59d overdue
18090438 ELECTRONIC DEVICE WITH ELECTROMAGNET CHAU, LISA N 5d overdue
18371377 PACKAGE STRUCTURE NADAV, ORI 5d
18092145 OPTICAL DEVICE ENDRESEN, KIRSTEN DANIELA 9d
19090371 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME TRAN, HAI V —
18923638 ELECTRONIC DEVICE DINH, TUAN T —

Interview Candidates (12)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
18202243 ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE PAPE, ALYSSA MORGAN 59d overdue
18092145 OPTICAL DEVICE ENDRESEN, KIRSTEN DANIELA 9d
19090371 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME TRAN, HAI V —
19033476 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME SMITH, GRAHAM P —
19006183 WEARABLE COMPONENT, EAR TIP, AND METHOD OF MANUFACTURING A WEARABLE COMPONENT ROBINSON, RYAN C —
18923638 ELECTRONIC DEVICE DINH, TUAN T —
18905113 ELECTRONIC DEVICE AL-TAWEEL, MUAAMAR QAHTAN —
18895205 SEMICONDUCTOR PACKAGE STRUCTURE FERNANDES, ERROL V —

Top Art Units

Art UnitApps
2893 4
2898 3
2874 2
3794 2
2812 2
2814 2
2845 1
2838 1
2899 1
2847 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
19090371 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME TRAN, HAI V — §102§103§112 Non-Final OA — Pending Mar 25, 2025
19033476 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME SMITH, GRAHAM P 2845 §103 Non-Final OA — Pending Jan 21, 2025
19006183 WEARABLE COMPONENT, EAR TIP, AND METHOD OF MANUFACTURING A WEARABLE COMPONENT ROBINSON, RYAN C — §102 Non-Final OA — Pending Dec 30, 2024
18923638 ELECTRONIC DEVICE DINH, TUAN T — §102§103 Non-Final OA — Pending Oct 22, 2024
18905113 ELECTRONIC DEVICE AL-TAWEEL, MUAAMAR QAHTAN 2838 §102§103 Non-Final OA — Pending Oct 02, 2024
18895205 SEMICONDUCTOR PACKAGE STRUCTURE FERNANDES, ERROL V — §103 Non-Final OA — Pending Sep 24, 2024
18780208 ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME PARKER, JOHN M — DP Non-Final OA — Pending Jul 22, 2024
18731221 ELECTRONIC DEVICE KLEIN, JORDAN M — §102§103§112Other Non-Final OA — Pending May 31, 2024
18674710 ELECTRONIC SYSTEM AND SEMICONDUCTOR MODULE TYNES JR., LAWRENCE C — §102§103§112 Non-Final OA — Pending May 24, 2024
18656565 ELECTRONIC DEVICE WARD, DAVID WILLIAM — §102§103§112 Non-Final OA — Pending May 06, 2024
18651653 ELECTRONIC PACKAGE GUMEDZOE, PENIEL M 2899 §102 Non-Final OA — Pending Apr 30, 2024
18633927 ELECTRONIC DEVICE STAHL, MICHAEL J — §102 Non-Final OA — Pending Apr 12, 2024
18605706 ELECTRONIC DEVICE BURNS, TREMESHA WILLIS 2847 §103 Final Rejection 44d overdue Pending Mar 14, 2024
18600579 PACKAGE STRUCTURE MOJADDEDI, OMAR F 2898 §102§103 Non-Final OA — Pending Mar 08, 2024
18437168 PACKAGE STRUCTURE GREAVING, JASON JAMES 2893 §102§103 Non-Final OA — Pending Feb 08, 2024
18406021 BONDING STRUCTURE AND PACKAGE STRUCTURE ROLAND, CHRISTOPHER M 2893 §103§112 Non-Final OA — Pending Jan 05, 2024
18527170 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME CHAN, CANDICE 2813 §102§103 Non-Final OA — Pending Dec 01, 2023
18371377 PACKAGE STRUCTURE NADAV, ORI 2811 §102§103§112 Final Rejection 5d Pending Sep 21, 2023
18369107 METHOD FOR MANUFACTURING OPTOELECTRONIC STRUCTURE AND A PACKAGE STRUCTURE ENDRESEN, KIRSTEN DANIELA 2874 §103 Final Rejection — Pending Sep 15, 2023
18230579 ELECTRONIC DEVICE CRAMER, HALEE PAIGE 2891 §102§103 Non-Final OA — Pending Aug 04, 2023
18206579 PACKAGE STRUCTURE MULERO FLORES, ERIC MANUEL 2898 §103 Non-Final OA 23d Pending Jun 06, 2023
18202243 ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE PAPE, ALYSSA MORGAN 3794 §102§103 Final Rejection 59d overdue Pending May 25, 2023
18132351 ELECTRONIC DEVICE ARROYO, TERESA M 2893 §112 Final Rejection 16d overdue Pending Apr 07, 2023
18118736 ELECTRONIC PACKAGE STRUCTURE SRINIVASAN, SESHA SAIRAMAN 2812 §103 Non-Final OA — Pending Mar 07, 2023
18116268 INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE PIZARRO CRESPO, MARCOS D 2814 §102§103§112 Non-Final OA — Pending Mar 01, 2023
18098395 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME HANUMASAGAR, SHAMITA S 2814 §103§112 Final Rejection 66d overdue Pending Jan 18, 2023
18092145 OPTICAL DEVICE ENDRESEN, KIRSTEN DANIELA 2874 §102§103§112 Final Rejection 9d Pending Dec 30, 2022
18090438 ELECTRONIC DEVICE WITH ELECTROMAGNET CHAU, LISA N 1785 §103§112 Final Rejection 5d overdue Pending Dec 28, 2022
18076417 ELECTRONIC DEVICE RODRIGUEZ VILLANU, SANDRA MILENA 2898 §103 Non-Final OA 2d overdue Pending Dec 07, 2022
18073522 ELECTRONIC DEVICE PAPE, ALYSSA MORGAN 3794 §103 Non-Final OA — Pending Dec 01, 2022
17494689 METHOD OF MANUFACTURING ELECTRICAL PACKAGES USING HALF-CUT AND GRINDING OPERATIONS OF ELECTRONIC UNITS SRINIVASAN, SESHA SAIRAMAN 2812 §103 Final Rejection — Pending Oct 05, 2021
17025972 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME BODNAR, JOHN A 2893 §102§103§112 Final Rejection 309d overdue Pending Sep 18, 2020

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