Prosecution Insights
Last updated: October 16, 2026
Application No. 19/172,208

RADIATION IMAGING APPARATUS AND MANUFACTURING METHOD

Non-Final OA §102
Filed
Apr 07, 2025
Priority
Apr 11, 2024 — JP 2024-063718
Examiner
LEE, SHUN K
Art Unit
2884
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Canon Inc.
OA Round
1 (Non-Final)
42%
Grant Probability
Moderate
1-2
OA Rounds
2y 0m
Est. Remaining
59%
With Interview

Examiner Intelligence

Grants 42% of resolved cases
42%
Career Allowance Rate
307 granted / 723 resolved
-25.5% vs TC avg
Strong +17% interview lift
Without
With
+16.7%
Interview Lift
resolved cases with interview
Typical timeline
3y 6m
Avg Prosecution
32 currently pending
Career history
779
Total Applications
across all art units

Statute-Specific Performance

§101
2.3%
-37.7% vs TC avg
§103
54.3%
+14.3% vs TC avg
§102
14.6%
-25.4% vs TC avg
§112
25.8%
-14.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 723 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Drawings The drawings are objected to as failing to comply with 37 CFR 1.84(p)(5) because they include the following reference character(s) not mentioned in the description: 1101. Corrected drawing sheets in compliance with 37 CFR 1.121(d), or amendment to the specification to add the reference character(s) in the description in compliance with 37 CFR 1.121(b) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance. Specification The lengthy specification has not been checked to the extent necessary to determine the presence of all possible minor errors. Applicant's cooperation is requested in correcting any errors of which applicant may become aware in the specification. Claim Interpretation MPEP § 2111.01 states that “… Under a broadest reasonable interpretation (BRI), words of the claim must be given their plain meaning, unless such meaning is inconsistent with the specification. The plain meaning of a term means the ordinary and customary meaning given to the term by those of ordinary skill in the art at the relevant time. The ordinary and customary meaning of a term may be evidenced by a variety of sources, including the words of the claims themselves, the specification, drawings, and prior art. However, the best source for determining the meaning of a claim term is the specification - the greatest clarity is obtained when the specification serves as a glossary for the claim terms …”. Thus under a broadest reasonable interpretation, the greatest clarity is obtained when the specification (e.g., see “… In this specification, radiation includes not only X-rays but also α-rays, β-rays, γ-rays, particle beams, and cosmic rays …” in paragraph 20) serves as a glossary for the claim term “radiation”. The specification (e.g., see “… heat insulation member 160 may be bonded to the housing 150 via an adhesive layer (not illustrated), such as a double-sided tape or an adhesive, or may be physically fixed by a fastening member, such as a screw …” in paragraph 42) serves as a glossary for the claim term “attached”. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned at the time any inventions covered therein were effectively filed absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned at the time a later invention was effectively filed in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-4, 8-13, and 14-20 is/are rejected under U.S.C. 102(a)(1) as being anticipated by Bogumil et al. (US 2019/0353810). In regard to claim 1, Bogumil et al. disclose a radiation imaging apparatus comprising: (a) a sensor panel configured to detect radiation (e.g., see “… sensor layer 704 which may comprise a scintillator layer laminated onto the two-dimensional array of photosensitive cells, is placed on the lead layer 702 and is seated on the top side of the multi layered core 500 as shown in FIG. 7B …” in Fig. 7A and paragraph 38); (b) a cable configured to be connected to the sensor panel (e.g., see “… conductive communication lines (CoFs) 605 … CoF 605 extends around an edge of the foam layer 502, as described herein, and is electrically connected to the sensor layer 704 at one end, and is electrically connected to the ROICs of PCB 604 at another end …” in Fig. 12 and paragraphs 37 and 42); (c) a board configured to be connected to the sensor panel via the cable (e.g., see “… CoF 605 extends around an edge of the foam layer 502, as described herein, and is electrically connected to the sensor layer 704 at one end, and is electrically connected to the ROICs of PCB 604 at another end …” in Fig. 6A and paragraph 42); (d) a plurality of heat insulation members (e.g., “… foam used for foam layer 502 and the end caps 507, and other foam components described herein may include high density, thermoplastic, closed cell foams having good heat and flame resistance, heat and electrical insulating properties, a high strength to weight ratio and low moisture absorption …” in paragraph 36) which are separate members including a first heat insulation member (e.g., see “… foam layer 502 …” in Figs. 5A-B and paragraph 36) and a second heat insulation member (e.g., see “… end caps 507 …” in Figs. 5A-B and paragraph 36); and (e) a housing configured to house the sensor panel, the cable, the board, and the plurality of heat insulation members, the housing including an incident surface through which radiation is incident on the sensor panel, a rear surface on a side opposite to the incident surface, and a side wall connecting the incident surface and the rear surface (e.g., see “… enclosure 800 is a five-sided enclosure formed as a unitary integrated whole having only one open end parallel to a width of the multi-layer core 500. In another separate embodiment, the enclosure 800 may be formed as a four-sided enclosure, such as a flat tube having a rectangular cross section with two opposing open ends. In such an embodiment, the multi-layer core 500 could be inserted into either open end of the four-sided enclosure and two enclosure end caps 802 could be used to seal the opposing open ends of such an enclosure …” in Figs. 8A-B, Fig. 12, and paragraph 40); wherein the first heat insulation member is disposed between the sensor panel and the board (e.g., see “… foam layer 502 …” in Figs. 5A-B, Fig. 12, and paragraph 36), wherein the second heat insulation member is disposed between the cable and the side wall (e.g., see “… end caps 507 …” in Figs. 5A-B, Fig. 12, and paragraph 36), and wherein an internal space (e.g., see “… substantially planar, rectangular high density foam layer 502 machined to form recessed pockets 503 on two major sides thereof …” in Figs. 5A-B and paragraph 35) of the housing (e.g., see “… enclosure 800 …” in Fig. 12 and paragraph 40) includes a space (e.g., see “… recessed pockets 503 …” in Fig. 8A) on a side with the incident surface and a space (e.g., see “… recessed pockets 503 …” in Fig. 8B) on a side with the rear surface, between which is a position where the first heat insulation member (e.g., see “… foam layer 502 …” in Fig. 12 and paragraph 36) and the second heat insulation member (e.g., see “… end caps 507 …” in Fig. 12 and paragraph 36) hold the cable (e.g., see “… CoF 605 …” in Fig. 12 and paragraph 42) therebetween. In regard to claim 2 which is dependent on claim 1, Bogumil et al. also disclose a support base configured to support the sensor panel on a first surface (e.g., see “… sensor layer 704 which may comprise a scintillator layer laminated onto the two-dimensional array of photosensitive cells, is placed on the lead layer 702 and is seated on the top side of the multi layered core 500 as shown in FIG. 7B …” in Fig. 7A and paragraph 38), wherein the first heat insulation member (e.g., see “… foam layer 502 …” in Fig. 7A) is disposed to a second surface of the support base (e.g., see “… lead layer 702 …” in Fig. 7A), the second surface being opposite the first surface. In regard to claim 3 which is dependent on claim 2, Bogumil et al. also disclose that when viewed from a side on which radiation is incident, a positional relationship in which a part of the first heat insulation member protrudes from a perimeter of the support base is satisfied (e.g., see a part of the “… foam layer 502 …” protruding from a perimeter of the “… lead layer 702 …” in Fig. 7A). In regard to claim 4 which is dependent on claim 2, Bogumil et al. also disclose that the first heat insulation member has a part which is in contact with a side surface of the support base (e.g., see the “… foam layer 502 …” has a part which is in contact with a side surface of the “… lead layer 702 …” in Fig. 7A). In regard to claim 8 which is dependent on claim 1, Bogumil et al. also disclose a support base configured to support the sensor panel on a first surface, wherein the first heat insulation member is disposed on a side surface of the support base (e.g., see the “… foam layer 502 …” is disposed on a side surface of the “… lead layer 702 …” in Fig. 7A). In regard to claim 9 which is dependent on claim 1, Bogumil et al. also disclose that a material of the first heat insulation member and the second heat insulation member is resin or foamable resin (e.g., “… foam used for foam layer 502 and the end caps 507, and other foam components described herein may include high density, thermoplastic, closed cell foams … poly vinylidene fluoride based foam may be used. Alternatively, the foam components may be formed from silicone or rubber…” in paragraph 36). In regard to claim 10 which is dependent on claim 1, Bogumil et al. also disclose that the first heat insulation member (e.g., see “… foam layer 502 …” in Fig. 12 and paragraph 36) and the second heat insulation member (e.g., see “… end caps 507 …” in Fig. 12 and paragraph 36) are compressed by holding the cable (e.g., see “… CoF 605 …” in Fig. 12 and paragraph 42) therebetween. In regard to claim 11 which is dependent on claim 1, Bogumil et al. also disclose that the cable is a flexible board including an integrated circuit (IC) chip (e.g., “… IC chip 1202 of the CoF 605 …” in paragraph 42), and wherein, in a state where the first heat insulation member and the second heat insulation member hold the cable therebetween, the IC chip is in the space on the side with the rear surface (e.g., see “… IC chip 1202 …” in the space on the side with the rear surface in Fig. 12). In regard to claim 12 which is dependent on claim 1, Bogumil et al. also disclose another cable configured to be connected to the sensor panel (e.g., see “… gate driver circuitry 606 and/or the ROICs 604 may include conductive communication lines (CoFs) 605 extending from the PCBS 604, 606, around an edge of the foam layer 502 and ground plane 504 assembly to enable digital communication between the PCB electronics and the radiographic sensor array on the top side of the multi layered core 500 which includes the two­dimensional array of photo-sensitive cells …” in Fig. 6A and paragraph 37), wherein in a region between the cable (e.g., see the CoF “605” along a first side in Fig. 6A) and the another cable (e.g., see the CoF “605” along a different second side in Fig. 6A), a part of the first heat insulation member is in to contact with a part of the second heat insulation member (e.g., see Fig. 6B). In regard to claim 14 which is dependent on claim 1, Bogumil et al. also disclose that the housing includes a front member having the incident surface and a rear member having the rear surface (e.g., see “… enclosure 800 is a five-sided enclosure formed as a unitary integrated whole having only one open end parallel to a width of the multi-layer core 500. In another separate embodiment, the enclosure 800 may be formed as a four-sided enclosure, such as a flat tube having a rectangular cross section with two opposing open ends. In such an embodiment, the multi-layer core 500 could be inserted into either open end of the four-sided enclosure and two enclosure end caps 802 could be used to seal the opposing open ends of such an enclosure …” in Fig. 12 and paragraph 40), and wherein the second heat insulation member is in contact with both the front member and the rear member (e.g., see “… end caps 507 …” in contact with both the front member and the rear member in Fig. 12). In regard to claim 15 which is dependent on claim 1, Bogumil et al. also disclose that the housing includes a front member having the incident surface and a rear member having the rear surface (e.g., see “… enclosure 800 is a five-sided enclosure formed as a unitary integrated whole having only one open end parallel to a width of the multi-layer core 500. In another separate embodiment, the enclosure 800 may be formed as a four-sided enclosure, such as a flat tube having a rectangular cross section with two opposing open ends. In such an embodiment, the multi-layer core 500 could be inserted into either open end of the four-sided enclosure and two enclosure end caps 802 could be used to seal the opposing open ends of such an enclosure …” in Figs. 8A-B, Fig. 12, and paragraph 40), and wherein the second heat insulation member is attached to one of the front member and the rear member (e.g., see end cap “507” is physically fixed to one of the front and rear members by external aluminum enclosure cap “807” in Fig. 12). In regard to claim 16 which is dependent on claim 1, Bogumil et al. also disclose that the housing includes a front member having the incident surface, a rear member having the rear surface, and a side wall member connecting the front member and the rear member (e.g., see “… enclosure 800 is a five-sided enclosure formed as a unitary integrated whole having only one open end parallel to a width of the multi-layer core 500. In another separate embodiment, the enclosure 800 may be formed as a four-sided enclosure, such as a flat tube having a rectangular cross section with two opposing open ends. In such an embodiment, the multi-layer core 500 could be inserted into either open end of the four-sided enclosure and two enclosure end caps 802 could be used to seal the opposing open ends of such an enclosure …” in Figs. 8A-B, Fig. 12, and paragraph 40), and wherein the second heat insulation member is attached to the side wall member (e.g., see end cap “507” is physically fixed to the side wall member by external aluminum enclosure cap “807” in Fig. 12). In regard to claim 17 which is dependent on claim 1, Bogumil et al. also disclose a plurality of cables configured to include the cable (e.g., see “… gate driver circuitry 606 and/or the ROICs 604 may include conductive communication lines (CoFs) 605 extending from the PCBS 604, 606, around an edge of the foam layer 502 and ground plane 504 assembly to enable digital communication between the PCB electronics and the radiographic sensor array on the top side of the multi layered core 500 which includes the two­dimensional array of photo-sensitive cells …” in Fig. 6A and paragraph 37), wherein when viewed from the side on which radiation is incident, and a perimeter of the sensor panel is seen as a quadrilateral shape (e.g., see “… sensor layer 704 …” in Figs. 7A-B and paragraph 38), the sensor panel has a first side to which any of the plurality of cables is connected and a second side to which no cable of the plurality of cables is connected (e.g., see Figs. 6A-B). In regard to claim 18 which is dependent on claim 17, Bogumil et al. also disclose that the second heat insulation member is disposed on a side with the first side (e.g., see “… end caps 507 …” disposed on two sides with in Fig. 6A), and the second heat insulation member is absent on a side with the second side (e.g., see “… end caps 507 …” are absent on two sides in Fig. 6A). In regard to claim 19 which is dependent on claim 18, Bogumil et al. also disclose that the first heat insulation member is in contact with a predetermined region of the side wall facing the second side (e.g., see Fig. 8A). In regard to claim 20, Bogumil et al. disclose a manufacturing method of a radiation imaging apparatus including a sensor panel configured to detect radiation (e.g., see “… sensor layer 704 which may comprise a scintillator layer laminated onto the two-dimensional array of photosensitive cells, is placed on the lead layer 702 and is seated on the top side of the multi layered core 500 as shown in FIG. 7B …” in Fig. 7A and paragraph 38), a cable configured to be connected to the sensor panel (e.g., see “… conductive communication lines (CoFs) 605 … CoF 605 extends around an edge of the foam layer 502, as described herein, and is electrically connected to the sensor layer 704 at one end, and is electrically connected to the ROICs of PCB 604 at another end …” in Fig. 12 and paragraphs 37 and 42), a board configured to be connected to the sensor panel via the cable (e.g., see “… CoF 605 extends around an edge of the foam layer 502, as described herein, and is electrically connected to the sensor layer 704 at one end, and is electrically connected to the ROICs of PCB 604 at another end …” in Fig. 6A and paragraph 42), a plurality of heat insulation members (e.g., “… foam used for foam layer 502 and the end caps 507, and other foam components described herein may include high density, thermoplastic, closed cell foams having good heat and flame resistance, heat and electrical insulating properties, a high strength to weight ratio and low moisture absorption …” in paragraph 36) which are separate members including a first heat insulation member (e.g., see “… foam layer 502 …” in Figs. 5A-B and paragraph 36) and a second heat insulation member (e.g., see “… end caps 507 …” in Figs. 5A-B and paragraph 36), and a housing configured to house the sensor panel, the cable, the board, and the plurality of heat insulation members, the housing including an incident surface through which radiation is incident on the sensor panel, a rear surface on a side opposite to the incident surface, and a side wall connecting the incident surface and the rear surface (e.g., see “… enclosure 800 is a five-sided enclosure formed as a unitary integrated whole having only one open end parallel to a width of the multi-layer core 500. In another separate embodiment, the enclosure 800 may be formed as a four-sided enclosure, such as a flat tube having a rectangular cross section with two opposing open ends. In such an embodiment, the multi-layer core 500 could be inserted into either open end of the four-sided enclosure and two enclosure end caps 802 could be used to seal the opposing open ends of such an enclosure …” in Figs. 8A-B, Fig. 12, and paragraph 40), the manufacturing method comprising: (a) disposing the first heat insulation member between the sensor panel and the board (e.g., see “… foam layer 502 …” in Figs. 5A-B, Fig. 12, and paragraph 36); (b) disposing the second heat insulation member between the cable and the side wall (e.g., see “… end caps 507 …” in Figs. 5A-B, Fig. 12, and paragraph 36); and (c) holding the cable (e.g., see “… CoF 605 …” in Fig. 12 and paragraph 42) between the first heat insulation member (e.g., see “… foam layer 502 …” in Figs. 5A-B, Fig. 12, and paragraph 36) and the second heat insulation member (e.g., see “… end caps 507 …” in Figs. 5A-B, Fig. 12, and paragraph 36) in such a manner that an internal space (e.g., see “… substantially planar, rectangular high density foam layer 502 machined to form recessed pockets 503 on two major sides thereof …” in Figs. 5A-B and paragraph 35) of the housing (e.g., see “… enclosure 800 …” in Fig. 12 and paragraph 40) includes a space (e.g., see “… recessed pockets 503 …” in Fig. 8A) on a side with the incident surface and a space (e.g., see “… recessed pockets 503 …” in Fig. 8B) on a side with the rear surface. Allowable Subject Matter Claim(s) 5-7 and 13 is/are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: the instant application is deemed to be directed to a nonobvious improvement over the invention disclosed in US 2019/0353810. The improvement comprises in combination with other recited elements: (a) the support base is provided with a support column for attaching the board, and wherein the first heat insulation member has an opening through which the support column is passed as recited in dependent claim 5; (b) the first heat insulation member is disposed at a position spaced apart from the second surface of the support base with a gap between the first heat insulation member and the support base as recited in dependent claim 6; (c) the support base has a composite layered structure including a heat insulation layer as recited in dependent claim 7; and (d) at least a part of the second heat insulation member has a protrusion disposed between adjacent cables of the plurality of cables, and the protrusion is fitted into a recess in the first heat insulation member as recited in dependent claim 13. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US 2019/0313525 teaches a x-ray cassette. Any inquiry concerning this communication or earlier communications from the examiner should be directed to Shun Lee whose telephone number is (571)272-2439. The examiner can normally be reached Monday-Friday. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Uzma Alam can be reached at (571)272-3995. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SL/ Examiner, Art Unit 2884 /UZMA ALAM/Supervisory Patent Examiner, Art Unit 2884
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Prosecution Timeline

Apr 07, 2025
Application Filed
Aug 19, 2026
Non-Final Rejection mailed — §102 (current)

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Prosecution Projections

1-2
Expected OA Rounds
42%
Grant Probability
59%
With Interview (+16.7%)
3y 6m (~2y 0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 723 resolved cases by this examiner. Grant probability derived from career allowance rate.

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