DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Priority
Acknowledgment is made of applicant’s claim for foreign priority under 35 U.S.C. 119 (a)-(d). The certified copy has been filed in parent Application No. TW113125442, filed on 07/08/2024.
Specification
Specification recites “lapping conductors” however, it is unclear what the applicant is intending with the phasing “lapping conductors”. In the literal definition, this would refer to a conductor manufactured using a lapping process, but that does not appear to be the case given that application is reciting structural claims and not method. Furthermore, the applicant never makes reference to a lapping process or any related process.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-10 rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 1 recites the limitation “two first lapping conductors connected between the grounding radiating body and the metal sidewall”. It is unclear what the applicant is intending with the phasing “lapping conductors”. In the literal definition, this would refer to a conductor manufactured using a lapping process, but that does not appear to be the case given that application is reciting structural claims and not method. Furthermore, the applicant never makes reference to a lapping process or any related process. Under a broadest reasonable interpretation (BRI), words of the claim must be given their plain meaning, unless such meaning is inconsistent with the specification. The plain meaning of a term means the ordinary and customary meaning given to the term by those of ordinary skill in the art at the relevant time.
Claims 2-10 are rejected for their dependence on claim 1.
Allowable Subject Matter
Claims 1-10 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action.
Regarding claim 1, Fang et al. (US20250007163) discloses in figs 4A-4B “An electronic device, comprising: a metal sidewall (126); and an antenna module disposed beside the metal sidewall and including: a feeding point (F1); a first antenna radiating body (121) including a first segment (A1-A2), a second segment (A2-A3), and a third segment (A2-A5), wherein the first segment extends from the feeding point, the second segment and the third segment extend from the first segment in opposite directions (see fig. 4A-4B), the feeding point, the first segment, and the second segment resonate a low frequency band (A1-A3 is a shorter length and therefore would resonate at a lower frequency), and the feeding point, the first segment, and the third segment resonate a first high frequency band (A1-A5 is longer and therefore would resonate at a higher frequency); a second antenna radiating body extending from the feeding point (A1-A6); a grounding radiating body connected with the second antenna radiating body and located beside the metal sidewall (G1), wherein the second antenna radiating body is located between the third segment and the grounding radiating body (see fig. 4A-4B), and two first conductors (O1-O3) connected between the grounding radiating body and the metal sidewall (see fig. 4A-4B)”.
However, Fang does not disclose “and two first overlapping conductors connected between the grounding radiating body and the metal sidewall, wherein the grounding radiating body, the two first lapping conductors, and the metal sidewall enclose a closed slot and resonate a second high frequency band at an edge of the closed slot”.
None of the prior art of record cures the deficiencies of Fang, therefore claim 1 is allowable over the prior art.
Claims 2-10 are allowable for their dependance on claim 1.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Channabasappa et al. (US10756433), Kuo et al. (US9647337), and Napoles et al. (US9484631).
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/AUSTIN M BACK/Examiner, Art Unit 2845
/DIMARY S LOPEZ CRUZ/Supervisory Patent Examiner, Art Unit 2845
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