Prosecution Insights
Prosecution Insights
1 pending office actions • 0 art units • 1 examiners • 0 of 1 (0%) have an AI response strategy ready
Apic Yamada Corporation maintains a patent portfolio with 1 pending office action currently active. This single action is being handled by 1 distinct examiner, showing a very limited current prosecution volume. The lack of multiple pending matters suggests a highly specific or intermittent filing strategy at this stage.
The busiest examiner identified in the data is CHI, SUBERR L, who is overseeing a single pending office action. Because this examiner accounts for the entirety of the pending workload, the immediate prosecution outcomes for the company are tied to this individual's specific review. No specific technology area or art unit data is provided for these pending matters.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §112 only | 1 (100%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHI, SUBERR L | 1 | 84.5% | +2.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18709804 | RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD | CHI, SUBERR L | — |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18709804 | RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD | CHI, SUBERR L | — | §112 | Non-Final OA | — | Pending | May 13, 2024 |
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