Tech Center 2800 • Art Units: 2800 2817 2818 2829 2893 2898
This examiner grants 84% of resolved cases
Suberr L Chi works in Tech Center 2800 and Art Unit 2800, with 657 resolved cases. The examiner maintains an allowance rate of 84.5%, suggesting a positive outlook for most applications. The interview lift is 2.8%, which indicates that interviews have a minimal impact on the 84.5% baseline allowance rate. This suggests that written arguments are likely the primary driver of success in this examiner's queue.
The median days to allowance is 1018, representing the typical duration for successful cases among the 657 resolved. This 1018-day metric is a key planning factor for practitioners in Art Unit 2800. While the 84.5% allowance rate is encouraging, the 2.8% interview lift suggests that verbal advocacy offers only a slight advantage. Applicants should expect a prosecution cycle of approximately 1018 days. These metrics provide a stable foundation for developing a strategy in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18637849 | MAGNETIC TUNNELING JUNCTION DEVICE AND MEMORY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18628099 | IMAGE SENSORS AND METHODS OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18602855 | SEMICONDUCTOR DECIVE AND PRODUCTION METHOD THEREFOR | Non-Final OA | TOYODA GOSEI CO., LTD. |
| 18577992 | Display Substrate, Manufacturing Method therefor, and Display Device | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18732807 | DISPLAY DEVICE AND A METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18427571 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 17886278 | ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 18742637 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 18750258 | SEMICONDUCTOR DEVICE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18611157 | BACKSIDE MONOLITHIC 3D INTEGRATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17883736 | THICK GATE OXIDE TRANSISTOR DEVICE AND METHOD | Final Rejection | Micron Technology, Inc. |
| 18618447 | OPTICAL PACKAGE WITH ELECTROMAGNETIC SHIELDING | Non-Final OA | STMicroelectronics International N.V. |
| 18673546 | ISOLATION STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18519092 | SEMICONDUCTOR DEVICE | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18502091 | MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | United Microelectronics Corp. |
| 18649686 | c/o onsemi | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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