Prosecution Insights
Prosecution Insights
3 pending office actions • 3 art units • 3 examiners • 0 of 3 (0%) have an AI response strategy ready
Based on the USPTO statutory response window for each pending office action. 3 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 3 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 2 (67%) |
| §112 only | 1 (33%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| DIALLO, MAMADOU L | 1 | 91.9% | +3.0% |
| PAGE, HANA C | 1 | 60.2% | +31.2% |
| HO, ANTHONY | 1 | 90.8% | +2.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18567657 | A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS WITH THERMAL INTERFACE MATERIALS COMPRISING RIGID PARTICLES | DIALLO, MAMADOU L | 41d |
| 18527697 | METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL INTERFACE MATERIAL FORMED THEREFROM, AND AN INTEGRATED CIRCUIT FORMED THEREFROM | HO, ANTHONY | 57d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18527731 | METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM | PAGE, HANA C | 86d overdue |
| Art Unit | Apps |
|---|---|
| 2897 | 1 |
| 1745 | 1 |
| 2817 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18567657 | A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS WITH THERMAL INTERFACE MATERIALS COMPRISING RIGID PARTICLES | DIALLO, MAMADOU L | 2897 | §103 | Non-Final OA | 41d | Pending | Dec 06, 2023 |
| 18527731 | METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM | PAGE, HANA C | 1745 | §103 | Non-Final OA | 86d overdue | Pending | Dec 04, 2023 |
| 18527697 | METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL INTERFACE MATERIAL FORMED THEREFROM, AND AN INTEGRATED CIRCUIT FORMED THEREFROM | HO, ANTHONY | 2817 | §112 | Non-Final OA | 57d | Pending | Dec 04, 2023 |
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