Prosecution Insights
Last updated: October 02, 2026

Examiner: DIALLO, MAMADOU L

Tech Center 3600 • Art Units: 2811 2819 2895 2897 3648

This examiner grants 92% of resolved cases

Analysis

Mamadou L. Diallo exhibits a very high allowance rate of 91.9% across 1346 resolved cases in Art Unit 2811. This high volume of resolutions, combined with the high allowance percentage, indicates a very favorable environment for applicants in Tech Center 3600. The median days to allowance is 733, which is relatively fast, suggesting that the examiner moves cases through the system efficiently. The interview lift is low at 3.0%, which implies that the high allowance rate is consistent regardless of whether an interview is conducted.

Practitioners can expect a high probability of success with this examiner, as the 91.9% allowance rate is among the highest in the data set. The 733-day median timeline suggests that applicants will not face excessive delays. Because the interview lift is only 3.0%, practitioners might find that written arguments are sufficient to secure an allowance, as the examiner is already highly inclined to grant patents. The large sample size of 1346 cases adds a high degree of statistical reliability to these performance metrics in Art Unit 2811.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

91.9%
Allow Rate
+39.9% vs TC avg
1,353
Total Applications
+3.0%
Interview Lift
733
Avg Prosecution Days
Based on 1346 resolved cases, 2023–2026

Rejection Statute Breakdown

4.1%
§101 Eligibility
33.8%
§102 Novelty
40.9%
§103 Obviousness
9.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18632486 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18773377 DISPLAY APPARATUS Non-Final OA SAMSUNG DISPLAY CO., LTD.
18647013 PACKAGED CHIP AND BACKLIGHT MODULE INCLUDING THE SAME Non-Final OA CARUX TECHNOLOGY PTE. LTD.
18774379 CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE Non-Final OA Infineon Technologies AG
18783824 BOND PAD WITH ENHANCED RELIABILITY Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18778946 DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18784164 BONDING STRUCTURE AND METHOD OF FORMING SAME Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18762706 DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.

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