Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2811 2819 2895 2897 3648
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18632486 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18610651 | SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18773377 | DISPLAY APPARATUS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18762706 | DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18602790 | MEMORY DEVICE CONTAINING NON-INTEGER AVERAGE NUMBER OF MEMORY OPENING FILL STRUCTURES PER COLUMN | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18647013 | PACKAGED CHIP AND BACKLIGHT MODULE INCLUDING THE SAME | Non-Final OA | CARUX TECHNOLOGY PTE. LTD. |
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