2 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18606469 | SILICON PHOTONIC CHIP PACKAGE MODULE BASED ON PLASTIC ENCAPSULATION | LEPISTO, RYAN A | 2874 | Non-Final OA | Mar 15, 2024 |
| 17892348 | DRIVER CHIP, PACKAGING METHOD FOR OPTICAL FILTER STRUCTURE, OPTICAL SENSOR DEVICE AND PACKAGING METHOD THEREOF | NEWTON, VALERIE N | 2897 | Non-Final OA | Aug 22, 2022 |
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