Tech Center 1700 • Art Units: 1723 1754 1794 1795
This examiner grants 45% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18590406 | FOCUS RING ALIGNMENT APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17756200 | POWER STORAGE MODULE | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 17687961 | SPUTTERING APPARATUS AND METHOD FOR THIN FILM ELECTRODE DEPOSITION | Non-Final OA | Samsung Display Co., LTD. |
| 18418930 | METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER | Final Rejection | Applied Materials, Inc. |
| 17687157 | COIL FOR IMPROVED PROCESS CHAMBER DEPOSITION AND ETCH UNIFORMITY | Final Rejection | Applied Materials, Inc. |
| 18409974 | Hybrid Cathodes for ION Plasma Deposition Systems and Methods | Final Rejection | GE Infrastructure Technology LLC |
| 18399237 | SPUTTER TARGETS FOR SELF-DOPED SOURCE AND DRAIN CONTACTS | Final Rejection | Intel Corporation |
| 18911171 | Substrate Processing Apparatus | Final Rejection | Tokyo Electron Limited |
| 17862889 | SEMICONDUCTOR MANUFACTURING APPARATUS, CONDITION COMPENSATION METHOD, AND PROGRAM | Final Rejection | Tokyo Electron Limited |
| 17676411 | APPARATUS FOR PERFORMING SPUTTERING PROCESS AND METHOD THEREOF | Non-Final OA | Tokyo Electron Limited |
| 18286826 | ION MILLING DEVICE | Final Rejection | Hitachi High-Tech Corporation |
| 18120358 | LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME | Final Rejection | Tosoh SMD, Inc. |
| 17613065 | PVD COATINGS COMPRISING MULTI-ANION HIGH ENTROPY ALLOY OXY-NITRIDES | Non-Final OA | OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON |
| 18258499 | MAGNETRON SPUTTERING APPARATUS | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| 18286506 | SPUTTERING TARGET AND METHOD FOR FORMING CESIUM TUNGSTEN OXIDE FILM | Final Rejection | SUMITOMO METAL MINING Co., Ltd., |
| 18283870 | Sputtering Apparatus | Final Rejection | Sumitomo Precision Products Co., Ltd. |
| 18427610 | SYSTEMS AND METHODS FOR IN-SITU ETCHING PRIOR TO PHYSICAL VAPOR DEPOSITION IN THE SAME CHAMBER | Non-Final OA | OEM Group, LLC |
| 17757098 | METHOD OF SPUTTER-COATING SUBSTRATES OR OF MANUFACTURING SPUTTER COATED SUBSTRATES AND APPARATUS | Final Rejection | EVATEC AG |
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