Listed by the USPTO as CHACKO DAVIS, DABORAH
Tech Center 1700 • Art Units: 1722 1737 1795
This examiner grants 72% of resolved cases
CHACKO DAVIS, DABORAH has 997 resolved cases, with a 72.0% allowance rate and a median of 1228 days to allowance. The profile falls within Tech Center 1700 and art unit 1722. The 20.4% interview lift identifies interviews as a meaningful factor in the available prosecution record.
The listed companies are Shin-Etsu Chemical Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., and Tokyo Electron Limited. Their presence places chemical, semiconductor manufacturing, and equipment work among the principal technologies represented. SUGHRUE MION, PLLC, WHDA, LLP, and Morgan, Lewis & Bockius LLP (WA) are the leading listed firms, giving applicants several identifiable sources of prosecution experience for this docket.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18411337 | MANUFACTURING METHOD OF SEMICONDUCTOR CHIP, AND KIT | Final Rejection | FUJIFILM Corporation |
| 18170591 | TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR CIRCUIT WIRE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18587235 | SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 17943729 | Hybrid Development of EUV Resists | Non-Final OA | Tokyo Electron Limited |
| 17943926 | PATTERNING A SEMICONDUCTOR WORKPIECE | Non-Final OA | Tokyo Electron Limited |
| 18294072 | PELLICLE FOR EXPOSURE CAPABLE OF EASY ADJUSTMENT OF ATMOSPHERIC PRESSURE | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18436721 | ONIUM SALT, RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18286520 | Pellicle Frame Laminate and Method for Manufacturing Pellicle Using Said Laminate | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18376499 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18234049 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18361298 | DOSE REDUCTION BOTTOM ANTI-REFLECTIVE COATING FOR METALLIC PHOTORESIST | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18361609 | EUV RETICLE WITH EMBEDDED PROCESS ASSISTANCE LAYER AND METHOD OF MANUFACTURING THE EUV RETICLE | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17912202 | SYSTEMS AND METHODS FOR FORMING STRUCTURES ON A SURFACE | Final Rejection | ASML HOLDING N.V. |
| 18552645 | PATTERNING DEVICE FOR A LITHOGRAPHIC APPARATUS AND METHOD | Non-Final OA | ASML NETHERLANDS B.V. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy72.0% of resolved applications examined by Daborah Chacko Davis were allowed (997 resolved cases), compared with 60.4% across Art Unit 1722 over the last five years.
This examiner's interview lift is +20.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Daborah Chacko Davis took 1,228 days on average from filing to allowance.
Daborah Chacko Davis examines applications in Art Unit 1722 in Tech Center 1700 (Chemistry & Materials).
