Tech Center 4100 • Art Units: 4100
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18663862 | Workpiece Surface Processing System for Semiconductor Wafers | Non-Final OA | Wolfspeed, Inc. |
| 18761626 | GRINDING METHOD OF WAFER | Non-Final OA | DISCO CORPORATION |
| 18737223 | METHOD FOR POLISHING A SUBSTRATE | Non-Final OA | ILLUMINA, INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy