Tech Center 2800 • Art Units: 2800 2877 2886
This examiner grants 79% of resolved cases
Michael P Lapage, in Tech Center 2800 and Art Unit 2800, has 795 resolved cases. His allowance rate pct is 78.6, and the median days to allowance is 922. These figures indicate the prosecution process in his docket. The 922-day median to allowance is a benchmark for applicants in this tech center and can be used to estimate the time to issuance.
The interview lift pct of 33.5 is a metric suggesting that interviews are a factor in securing an allowance. This 33.5 lift indicates that verbal advocacy is associated with resolving the examiner's concerns and improving the 78.6 allowance rate pct. The 795 resolved cases provide a data set for these prosecution metrics. A 33.5 lift is a metric in this profile, highlighting the role of direct communication with this examiner and its impact on the 78.6 allowance rate pct.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18918838 | SYSTEM FOR NONDESTRUCTIVE MEASUREMENT OF A SAMPLE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18692176 | PARTICLE SORTING DEVICE, ORIFICE UNIT FOR PARTICLE SORTING DEVICE, AND PARTICLE SORTING METHOD | Non-Final OA | Sony Group Corporation |
| 18613522 | COMPUTATIONAL SHEAR BY PHASE STEPPED SPECKLE HOLOGRAPHY | Non-Final OA | BAE Systems Information and Electronic Systems Integration Inc. |
| 18862331 | Determination of Inhomogeneities During Electrode Manufacturing for Battery Cells | Final Rejection | Siemens Aktiengesellschaft |
| 18871514 | SHAPE MEASUREMENT DEVICE AND SHAPE MEASUREMENT METHOD | Non-Final OA | HITACHI HIGH-TECH CORPORATION |
| 19226406 | INTERFERENCE FRINGE PROJECTION OPTICAL SYSTEM, SHAPE MEASUREMENT DEVICE, AND SHAPE MEASUREMENT METHOD | Non-Final OA | OLYMPUS MEDICAL SYSTEMS CORP. |
| 18398723 | INTEGRATED OPTICAL SENSOR CONTROLLER FOR DEVICEMANUFACTURING MACHINES | Final Rejection | Applied Materials, Inc. |
| 17498020 | FLOW CYTOMETER AND METHOD OF FLOW CYTOMETRY | Final Rejection | SYSMEX CORPORATION |
| 18957076 | MEASURING DEVICE AND ERROR CALIBRATION METHOD FOR MACHINE TOOL USING THE SAME | Non-Final OA | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 18178944 | SEMICONDUCTOR STRUCTURE, INSPECTION METHOD AND INSPECTION SYSTEM | Final Rejection | Winbond Electronics Corp. |
| 18587703 | SIDE-BY-SIDE OFF-CENTER DIE OVERLAY TARGET | Final Rejection | KLA Corporation |
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