Listed by the USPTO as LEE, ALEXANDER N
Tech Center 2800 • Art Units: 1716 1737 2812 2891
This examiner grants 75% of resolved cases
LEE, ALEXANDER N works in Tech Center 2800 and Art Unit 1716. The record includes 118 resolved cases, an allowance rate of 75.4%, and a median of 1232 days to allowance. Interviews are associated with an 11.0% lift in allowance outcomes. The profile indicates a moderate allowance history and a comparatively extended recorded path to allowance.
The listed companies are Taiwan Semiconductor Manufacturing Company, Ltd., Shin-Etsu Chemical Co., Ltd., and Samsung Electronics Co., Ltd. The listed firms are Studebaker Brackett PLLC, OLIFF PLC, and WHDA, LLP. Counsel can use interviews as a possible supplement to written responses, particularly when discussion may clarify the technical boundaries of the claims.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18177742 | CHEMICAL LIQUID SUPPLY METHOD AND PATTERN FORMING METHOD | Non-Final OA | FUJIFILM Corporation |
| 17867327 | COLORING RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE | Final Rejection | FUJIFILM Corporation |
| 18613810 | ORGANIC SALT, PHOTORESIST COMPOSITION INCLUDING THE SAME AND METHOD OF FORMING PATTERN BY USING THE PHOTORESIST PATTERN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18413399 | EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18131279 | GAS-PHASE METHOD OF FORMING RADIATION-SENSITIVE PATTERNABLE MATERIAL | Non-Final OA | ASM IP Holding, B.V. |
| 17758567 | POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PERFORMANCE OF METAL-CONTAINING EUV RESIST | Final Rejection | Lam Research Corporation |
| 18565488 | COMPOSITION FOR REMOVING EDGE BEAD FROM METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF REMOVING EDGE BEAD USING SAME | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18511327 | LAYER STACK FOR EXTREME ULTRAVIOLET LITHOGRAPHY | Non-Final OA | Tokyo Electron Limited |
| 18193324 | Dry Developing Metal-Free Photoresists | Non-Final OA | Tokyo Electron Limited |
| 18542142 | Reflective Mask Blank, Reflective Mask, and Manufacturing Method Thereof | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18207250 | ONIUM SALT, RESIST COMPOSITION AND PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18309793 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18180936 | RESIST MATERIAL AND PATTERN FORMING METHOD | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18447568 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18232264 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18231540 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
| 17302880 | PHOTORESIST MATERIALS AND ASSOCIATED METHODS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17246496 | PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17875322 | NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18690984 | PHOTOSENSITIVE RESIN PRINTING PLATE PRECURSOR FOR RELIEF PRINTING, AND PRINTING PLATE | Non-Final OA | TOYOBO MC Corporation |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy75.4% of resolved applications examined by Alexander N Lee were allowed (118 resolved cases), compared with 45.4% across Art Unit 1716 over the last five years.
This examiner's interview lift is +11.0 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Alexander N Lee took 1,232 days on average from filing to allowance.
Alexander N Lee examines applications in Art Unit 1716 in Tech Center 2800 (Semiconductors, Circuits & Optics).
