Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1712 1713 1715 1716 1792 2811 2818 2891 2892 2893
This examiner grants 68% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18636099 | PLASMA DIAGNOSTIC DEVICE, AND SEMICONDUCTOR PROCESSING EQUIPMENT USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18425048 | DEPOSITION SYSTEM AND PROCESSING SYSTEM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18476341 | MANUFACTURING DEVICE OF DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18402119 | MASK ASSEMBLY AND APPARATUS FOR MANUFACTURING DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18403024 | REACTANT DELIVERY SYSTEM AND REACTOR SYSTEM INCLUDING SAME | Final Rejection | ASM IP Holding B.V. |
| 18452725 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18654221 | HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSING CHAMBERS | Non-Final OA | Applied Materials, Inc. |
| 18500707 | MULTI-FLOW METHODS, AND RELATED APPARATUS, FOR SEMICONDUCTOR MANUFACTURING | Final Rejection | Applied Materials, Inc. |
| 18557675 | PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE TUNGSTEN FEATURES | Non-Final OA | Applied Materials, Inc. |
| 18367321 | MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS | Non-Final OA | Applied Materials, Inc. |
| 18456836 | SEMICONDUCTOR PROCESSING CHAMBER LID AND COATING | Final Rejection | Applied Materials, Inc. |
| 18817042 | PLASMA ADJUSTMENT USING SOURCE-LESS RESONANT STRUCTURE | Non-Final OA | Tokyo Electron Limited |
| 18620541 | WAFER TEMPERATURE MEASUREMENT FOR WET ETCHING BATH APPLICATIONS | Non-Final OA | Tokyo Electron Limited |
| 18431887 | PLASMA PROCESSING SYSTEM WITH DIRECT CURRENT SUPERPOSITION | Final Rejection | Tokyo Electron Limited |
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