Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1712 1713 1715 1716 1792 2811 2818 2891 2892 2893
This examiner grants 68% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18909746 | PLASMA DEPOSITION APPARATUS AND PLASMA DEPOSITION METHOD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18640181 | PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO. LTD. |
| 18636099 | PLASMA DIAGNOSTIC DEVICE, AND SEMICONDUCTOR PROCESSING EQUIPMENT USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18425048 | DEPOSITION SYSTEM AND PROCESSING SYSTEM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18931963 | MANUFACTURE OF SURFACE RELIEF STRUCTURES | Non-Final OA | Snap Inc. |
| 18476341 | MANUFACTURING DEVICE OF DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18458088 | APPARATUS AND METHODS FOR COMBINATORIAL MATERIAL SCREENING AND DISCOVERY | Final Rejection | The University of British Columbia |
| 18452725 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | ASM IP Holding B.V. |
| 18726395 | APPARATUS FOR PROCESSING SUBSTRATE | Non-Final OA | JUSUNG ENGINEERING CO., LTD. |
| 18589392 | BIASED OR FLOATING PROCESS SHIELD TO REDUCE ION LOSS TO CONTROL FILM DEPOSITION AND IMPROVE STEP COVERAGE | Final Rejection | Applied Materials, Inc. |
| 18456836 | SEMICONDUCTOR PROCESSING CHAMBER LID AND COATING | Final Rejection | Applied Materials, Inc. |
| 18817042 | PLASMA ADJUSTMENT USING SOURCE-LESS RESONANT STRUCTURE | Non-Final OA | Tokyo Electron Limited |
| 18620541 | WAFER TEMPERATURE MEASUREMENT FOR WET ETCHING BATH APPLICATIONS | Non-Final OA | Tokyo Electron Limited |
| 18690810 | PLASMA PROCESSING APPARATUS, CONTROL METHOD, AND STORING MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 18613747 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18463435 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Kokusai Electric Corporation |
| 18336524 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18934952 | Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid Thermal Activation Process | Non-Final OA | Beijing E-Town Semiconductor Technology, Co., LTD |
| 18938634 | SHOWER HEAD ASSEMBLY AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18536378 | SUBSTRATE PROCESSING APPARATUS AND METHOD | Non-Final OA | SEMES CO., LTD. |
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