Listed by the USPTO as MOHAMED-ALY, KAREEM M
Tech Center 2800 • Art Units: 2898
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18808445 | ELECTRONIC PACKAGE DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18738595 | IMAGE SENSOR INCLUDING GROUND REGION | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18413115 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18816716 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18646110 | SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18789984 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18417572 | FLEXIBLE ELECTROLUMINESCENT DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18673791 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18614528 | DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18696969 | DISPLAY MODULES AND MANUFACTURING METHODS THEREOF | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18696953 | DISPLAY PANEL, MANUFACTURING METHOD, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18770313 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18696980 | METHOD FOR SEPARATING A BONDED WAFER | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18411422 | MEMS ARM FOR MICROELECTROMECHANICAL SYSTEM | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18416410 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your StrategyKareem M Mohamed-Aly examines applications in Art Unit 2898 in Tech Center 2800 (Semiconductors, Circuits & Optics).
