Tech Center 1700 • Art Units: 1794
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18430475 | PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18551196 | SPUTTERING DEVICE FOR MULTILAYER OPTICAL RECORDING MEDIUM AND METHOD FOR MANUFACTURING MULTILAYER OPTICAL RECORDING MEDIUM | Non-Final OA | SONY GROUP CORPORATION |
| 17768918 | METHOD OF DEPOSITING LAYERS OF A THIN-FILM TRANSISTOR ON A SUBSTRATE AND SPUTTER DEPOSITION APPARATUS | Non-Final OA | Applied Materials, Inc. |
| 17685272 | BIASABLE ROTATING PEDESTAL | Non-Final OA | Applied Materials, Inc. |
| 18425323 | SENSOR IN CHAMBER INSERT RING ASSEMBLY | Final Rejection | Tokyo Electron Limited |
| 18531641 | DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO COPPER ALLOY BACKING PLATE | Non-Final OA | Honeywell International Inc. |
| 19100649 | MAGNETRON SPUTTERING APPARATUS | Non-Final OA | DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 19042250 | ION BEAM SPUTTERING APPARATUS AND METHOD | Non-Final OA | New Zealand Institute for Earth Science Limited |
| 19025816 | FABRICATION OF LOW DEFECTIVITY ELECTROCHROMIC DEVICES | Non-Final OA | View Operating Corporation |
| 18981170 | PERMEANCE MAGNETIC ASSEMBLY | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18107588 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS USING THE SAME | Non-Final OA | ASM IP Holding B.V. |
| 18090122 | MEMBRANE ELECTRODE ASSEMBLY FOR PEM WATER ELECTROLYSIS CAPABLE OF IMPROVING THE ELECTRICAL CONDUCTIVITY OF THE ELECTRODE LAYER AND METHOD OF MANUFACTURING THEREOF | Final Rejection | KOREA INSTITUTE OF ENERGY RESEARCH |
| 18860061 | ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND METHOD OF PREPARING THE SAME | Non-Final OA | Hyundai Kefico Corporation |
| 18858996 | COATING SYSTEM AND METHOD FOR SEMICONDUCTOR EQUIPMENT COMPONENTS | Non-Final OA | Oerlikon Surface Solutions AG, Pfäffikon |
| 18020412 | METHOD OF FORMING A CATHODE LAYER, METHOD OF FORMING A BATTERY HALF CELL | Final Rejection | Dyson Technology Limited |
| 18846614 | COATING MODULE WITH IMPROVED CATHODE ARRANGEMENT | Non-Final OA | SINGULUS TECHNOLOGIES AG |
| 18265585 | Sputtering Target And Method For Manufacturing The Same | Final Rejection | JX ADVANCED METALS CORPORATION |
| 17696636 | SYSTEM AND METHOD FOR ION-ASSISTED DEPOSITION OF OPTICAL COATINGS | Non-Final OA | KLA Corporation |
| 17308290 | ABLATING MATERIAL FOR AN OBJECT IN A PARTICLE BEAM DEVICE | Final Rejection | Carl Zeiss Microscopy GmbH |
| 18556881 | SEMICONDUCTOR-PACKAGING DEVICE | Final Rejection | JUSUNG ENGINEERING CO., LTD. |
| 17461928 | Deposition Method | Non-Final OA | SPTS TECHNOLOGIES LIMITED |
| 18257622 | SPUTTERING TARGET AND METHOD OF MANUFACTURING THE SAME | Final Rejection | KOLON INDUSTRIES, INC. |
| 18541027 | DEVICES AND METHODS FOR SPUTTERING AT LEAST TWO ELEMENTS | Non-Final OA | TechIFab GmbH |
| 18537523 | STABLE GROUND ANODE APERTURE FOR THIN FILM PROCESSING | Non-Final OA | INTEVAC, INC. |
| 18110269 | SYSTEM AND METHOD FOR MAKING THICK-MULTILAYER DIELECTRIC FILMS | Non-Final OA | INTEVAC, INC. |
| 18562293 | SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME | Non-Final OA | JX METALS CORPORATION |
| 17415912 | VACUUM TREATMENT APPARATUS AND METHOD FOR VACUUM PLASMA TREATING AT LEAST ONE SUBSTRATE OR FOR MANUFACTURING A SUBSTRATE | Non-Final OA | EVATEC AG |
| 18354609 | PLASMA MONITORING DEVICE | Final Rejection | Dah Young Vacuum Equipment Co., Ltd. |
| 17587058 | Sputtering Target And Method For Manufacturing The Same | Final Rejection | JX Nippon Mining & Metals Corporation |
| 18000561 | METHOD AND DEVICE FOR APPLYING A COATING, AND COATED BODY | Non-Final OA | CemeCon AG |
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