Listed by the USPTO as PATWARDHAN, ABHISHEK A
Tech Center 3700 • Art Units: 1717 1746 1785 2436 2891 3635 3724
This examiner grants 74% of resolved cases
Patwardhan, Abhishek A is assigned to Tech Center 3700 and Art Unit 1717, with 264 resolved cases. The allowance rate is 73.9%, the interview lift is 13.1%, and the median time to allowance is 936 days. The allowance rate is higher than the interview measure, indicating that the broader record is favorable while the measured incremental interview effect is more limited.
The listed companies are Honda Motor Co., Ltd., Nissan Chemical Corporation, and Toyota Motor Corporation. The leading firms are CKC & Partners Co., LLC, FOLEY & LARDNER LLP, and JCIPRNET. Practitioners may benefit from emphasizing clear written responses and targeted interviews, particularly where discussion can narrow the issues without delaying substantive prosecution.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19026515 | FILLET SHAPING DIE AND BONDING METHOD | Non-Final OA | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18960539 | FLAME RESISTANT AND THERMALLY CONDUCTIVE STRUCTURAL ACRYLIC ADHESIVE | Final Rejection | Illinois Tool Works Inc. |
| 19008259 | LAMINATION JIG FOR FUEL CELL COMPONENTS AND LAMINATION METHOD FOR FUEL CELL COMPONENTS | Final Rejection | HONDA MOTOR CO., LTD. |
| 18182383 | PRESSING APPARATUS AND PRESSING METHOD | Final Rejection | HONDA MOTOR CO., LTD. |
| 18855052 | HINGE WITH SECURITY ELEMENT FOR SECURE ARTICLE | Final Rejection | THALES DIS FRANCE SAS |
| 18595341 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18786165 | SOLVATED ADHESIVE COMPOSITION AND METHOD | Non-Final OA | Eaton Intelligent Power Limited |
| 18418961 | SHEET SEPARATION DEVICE AND LAMINATING SYSTEM | Non-Final OA | RICOH COMPANY, LTD. |
| 18488546 | FREE-FORM DISPENSING AND LAMINATION | Non-Final OA | Henkel AG & Co. KGaA |
| 19010575 | BONDING METHOD AND BONDING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18474731 | SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18655351 | COPPER FOIL COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | NAN YA PLASTICS CORPORATION |
| 18429574 | ADHESIVE AND ADHERING METHOD | Non-Final OA | DISCO CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy73.9% of resolved applications examined by Abhishek A Patwardhan were allowed (264 resolved cases), compared with 49.3% across Art Unit 1717 over the last five years.
This examiner's interview lift is +13.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Abhishek A Patwardhan took 936 days on average from filing to allowance.
Abhishek A Patwardhan examines applications in Art Unit 1717 in Tech Center 3700 (Medical Devices & Mechanical Engineering).
