Tech Center 2800 • Art Units: 2816 2894 2899
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18089471 | THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES | Non-Final OA | Intel Corporation |
| 18516965 | MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE | Non-Final OA | VueReal Inc. |
| 17848238 | CMOS-COMPATIBLE RRAM DEVICES | Non-Final OA | TetraMem Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy