Tech Center 1700 • Art Units: 1713 1718
This examiner grants 57% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18586037 | ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD OF ETCHING TITANIUM-CONTAINING LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE ETCHING COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18210461 | IN-SITU ALUMINIUM CLEANING USING ATOMIC LAYER ETCHING FOLLOWED BY ATOMIC LAYER DEPOSITION CAPPING FOR ENHANCED ALUMINIUM MIRRORS FOR VUV OPTICS | Non-Final OA | CORNING INCORPORATED |
| 18377615 | GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL POLISHING | Non-Final OA | Applied Materials, Inc. |
| 18091188 | ELECTRICAL LAYER WITH ROUGHENED SURFACES | Non-Final OA | Intel Corporation |
| 18560065 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18430313 | METHOD FOR ETCHING A PATTERN IN A LAYER OF A SUBSTRATE | Non-Final OA | Tokyo Electron Limited |
| 18230771 | METHOD OF TREATING RAZOR BLADE CUTTING EDGES | Final Rejection | The Gillette Company LLC |
| 18230759 | METHOD OF TREATING RAZOR BLADE CUTTING EDGES | Final Rejection | The Gillette Company LLC |
| 18230778 | METHOD OF TREATING RAZOR BLADE CUTTING EDGES | Non-Final OA | The Gillette Company LLC |
| 18061617 | CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 17929779 | SYSTEM AND METHODS FOR POSITIONING BIOMATERIAL ON A SUBSTRATE | Non-Final OA | Seagate Technology LLC |
| 18231403 | SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 18251483 | METAL-GAS-FILLED CELL AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | KYOTO UNIVERSITY |
| 17792227 | POLISHING AGENT, STOCK SOLUTION FOR POLISHING AGENT, AND POLISHING METHOD | Non-Final OA | Showa Denko Materials Co., Ltd. |
| 18373394 | WET PROCESSING WITH AUTOMATIC PROCESS CONTROL | Final Rejection | Yield Engineering Systems, Inc. |
| 18462386 | METHOD FOR PROCESSING SUBSTRATE | Non-Final OA | PSK INC. |
| 18268198 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | PSK INC. |
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