Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1718 2872
This examiner grants 58% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18586037 | ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD OF ETCHING TITANIUM-CONTAINING LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE ETCHING COMPOSITION | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18483176 | METHOD FOR MANUFACTURING PHOTOMASK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18091188 | ELECTRICAL LAYER WITH ROUGHENED SURFACES | Non-Final OA | Intel Corporation |
| 18560065 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18430313 | METHOD FOR ETCHING A PATTERN IN A LAYER OF A SUBSTRATE | Non-Final OA | Tokyo Electron Limited |
| 18230759 | METHOD OF TREATING RAZOR BLADE CUTTING EDGES | Final Rejection | The Gillette Company LLC |
| 18230778 | METHOD OF TREATING RAZOR BLADE CUTTING EDGES | Non-Final OA | The Gillette Company LLC |
| 18230771 | METHOD OF TREATING RAZOR BLADE CUTTING EDGES | Final Rejection | The Gillette Company LLC |
| 17929779 | SYSTEM AND METHODS FOR POSITIONING BIOMATERIAL ON A SUBSTRATE | Non-Final OA | Seagate Technology LLC |
| 18061617 | CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18462386 | METHOD FOR PROCESSING SUBSTRATE | Non-Final OA | PSK INC. |
| 18268198 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | PSK INC. |
| 18251483 | METAL-GAS-FILLED CELL AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | KYOTO UNIVERSITY |
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