Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1718 2872
This examiner grants 58% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18586037 | ETCHING COMPOSITION FOR TITANIUM-CONTAINING LAYER, ETCHING METHOD OF ETCHING TITANIUM-CONTAINING LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE ETCHING COMPOSITION | Final Rejection | Samsung Electronics Co., Ltd. |
| 18778757 | POLISHING LIQUID AND POLISHING METHOD | Non-Final OA | FUJIFILM Corporation |
| 18891691 | SOLID RINSE AID COMPOSITION COMPRISING POLYACRYLIC ACID | Non-Final OA | ECOLAB USA INC. |
| 18648527 | METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18977848 | SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18624852 | SITU PROTECTIVE POLYMER VIA MILLING-EXCITATION | Non-Final OA | FEI Company |
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