Listed by the USPTO as SHAH, SAMIR
Tech Center 2800 • Art Units: 1787 1794 2872
This examiner grants 37% of resolved cases
SHAH, SAMIR works in Tech Center 2800 and Art Unit 1787, with 529 resolved cases. The allowance rate is 36.7%, and the median time to allowance is 1503 days. The interview lift is 35.1%, indicating that interviews are associated with a meaningful improvement in allowance outcomes, even though the overall allowance result is low and the median timing is extended. No art unit benchmark is supplied.
The docket prominently includes NITTO DENKO Corporation, Lintec Corporation, and Toppan Holdings Inc. The leading firms are SUGHRUE MION, PLLC, Barnes & Thornburg LLP (IN), and Buchanan Ingersoll & Rooney PC. Practitioners should plan for sustained prosecution and assess claim scope carefully before filing. The interview figure supports early examiner engagement, but the allowance measure indicates that interviews should be paired with rigorous written responses and amendment discipline.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18124255 | RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18770262 | ELECTROPHOTOGRAPHIC MEMBER, ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS, AND ELECTRICALLY CONDUCTIVE RESIN COMPOSITION | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18875436 | BALLS COMPRISING A FERRITE MATERIAL AND USE OF BALLS COMPRISING A FERRITE MATERIAL | Non-Final OA | TDK Electronics AG |
| 18253623 | CELLULOSE BASED MULTILAYER PACKAGING WITH BARRIER PROPERTIES FOR 3D-OBJECTS | Final Rejection | SOCIETE DES PRODUITS NESTLE S.A. |
| 18253920 | LID MATERIAL FOR PTP AND PTP BODY | Non-Final OA | TOPPAN Holdings Inc. |
| 18253594 | LID MATERIAL FOR PTP AND PTP BODY | Final Rejection | TOPPAN Holdings Inc. |
| 17784476 | TRANSPARENT SUBSTRATE WITH THIN FILM MULTILAYER COATING | Non-Final OA | SAINT-GOBAIN GLASS FRANCE |
| 17914009 | DECORATIVE SHEET AND DECORATIVE RESIN MOLDED ARTICLE | Final Rejection | Dai Nippon Printing Co., Ltd. |
| 18855122 | INTERLAYER FILM FOR LAMINATED GLASS AND METHOD FOR MANUFACTURING SAME AND LAMINATED GLASS AND METHOD FOR MANUFACTURING SAME | Non-Final OA | SEKISUI CHEMICAL CO., LTD. |
| 18561201 | PEELABLE AND SEALABLE LIDSTOCK MATERIAL FOR CONTAINERS | Final Rejection | AMCOR FLEXIBLES NORTH AMERICA, INC. |
| 18009390 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL | Final Rejection | NITTO DENKO CORPORATION |
| 18009136 | PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL | Final Rejection | NITTO DENKO CORPORATION |
| 17951378 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL | Final Rejection | NITTO DENKO CORPORATION |
| 18843423 | SPECTACLE LENS AND METHOD FOR MANUFACTURING SAME | Non-Final OA | HOYA LENS THAILAND LTD. |
| 18983539 | MACHINE DIRECTION-ORIENTED POLYMERIC FILM, AND METHOD OF MAKING THE MACHINE DIRECTION-ORIENTED POLYMERIC FILM | Non-Final OA | BERRY GLOBAL, INC. |
| 18871854 | COATED PAPER ARTICLE | Non-Final OA | Dow Global Technologies LLC |
| 18863010 | HOLLOW PARTICLES, RESIN COMPOSITION, RESIN MOLDED BODY, ENCAPSULATING RESIN COMPOSITION, CURED PRODUCT AND SEMICONDUCTOR DEVICE | Non-Final OA | ZEON CORPORATION |
| 18287705 | INSULATION MATERIAL, METHOD FOR PRODUCING AN INSULATION MATERIAL, AND METHOD FOR RECYCLING AN INSULATION MATERIAL | Final Rejection | LEONHARD KURZ Stiftung & Co. KG |
| 14781671 | MULTILAYER POLYMER STRUCTURES | Final Rejection | TRINSEO EUROPE GMBH |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy36.7% of resolved applications examined by Samir Shah were allowed (529 resolved cases), compared with 33.0% across Art Unit 1787 over the last five years.
This examiner's interview lift is +35.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Samir Shah took 1,503 days on average from filing to allowance.
Samir Shah examines applications in Art Unit 1787 in Tech Center 2800 (Semiconductors, Circuits & Optics).
