DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application is being examined under the pre-AIA first to invent provisions.
Drawings
The drawings are objected to as failing to comply with 37 CFR 1.84(p)(4) because reference character “410” has been used to designate both “molding compound” and “additional molding compound”. Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Specification
The use of the term “DreamPak” and “aQFN”, which is a trade name or a mark used in commerce, has been noted in this application. The term should be accompanied by the generic terminology; furthermore the term should be capitalized wherever it appears or, where appropriate, include a proper symbol indicating use in commerce such as ™, SM , or ® following the term.
Although the use of trade names and marks used in commerce (i.e., trademarks, service marks, certification marks, and collective marks) are permissible in patent applications, the proprietary nature of the marks should be respected and every effort made to prevent their use in any manner which might adversely affect their validity as commercial marks.
Claim Rejections - 35 USC § 112
The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
Claims 1, 3-10, 12-15 and 21, 22 and 25-32 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention. There appears to be no adequate description in the original specification (in the prior-filed application #13/475,674, filed on May 18, 2012) and/or the elected embodiment of Figs. 5 (detail view of RDL 430, semiconductor die 450, and RDL460), 6 (final structure) and 7A-7C (process sequence for forming additional conductive section 670 as shown in Fig. 6) for the claim limitations of “a substrate; a plurality of metal pillars on a top surface of the substrate; a semiconductor component on the substrate, wherein the semiconductor comprises one or more dies; wherein the mold compound has a top surface above the top surface of the semiconductor component; an interposer laterally adjacent to each of the plurality of metal pillars”, as recited in claim 1; “the interposer directly contacts each of the plurality of metal pillars”, as recited in claim 8; “a substrate; a plurality of metal pillars on a top surface of the substrate; a semiconductor component on the substrate, wherein the semiconductor comprises one or more dies; an interposer laterally adjacent to each of the plurality of metal pillars; wherein the mold compound has a second height greater than the first height; a first plurality of solder balls on a bottom surface of the substrate”, as recited in claim 9; “a substrate; a plurality of metal pillars on a top surface of the substrate; a semiconductor component on the substrate, wherein the semiconductor comprises one or more dies; wherein the second molding compound has a top surface above the top surface of the semiconductor component; wherein the top surface of the second molding compound is coplanar with a top surface of the insulating layer”, as recited in claim 21; “a top surface of the insulating layer is coplanar with the top surface of the mold compound”, as recited in claim 27; “a top-most surface of the RDL is co-planar with a top-most surface of the mold compound”, as recited in claim 28.
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1, 3-10, 12-15 and 26-32 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
The claimed limitation of "an interposer laterally adjacent to each of the plurality of metal pillars", as recited in claims 1 and 9, which indefinite and renders the claim uncertain because said limitation is inconsistent with the (specification) disclosure: i.e. paragraph [0028], lines 6-8 and Fig. 4A disclose that "the interposer (frame) includes through-molding vias (TMVs) 415". See MPEP §2173.03. Also, it is unclear as to how an interposer can be laterally adjacent to itself since each of the plurality of metal pillars is a part of the interposer.
Response to Arguments
Applicant's arguments filed July 14, 2026 have been fully considered but they are not persuasive.
Applicant argues that “with respect to the claim language "an interposer laterally adjacent to each of the plurality of metal pillars" as recited in claims 1 and 9, Applicant respectfully submits that paragraph [0028] and Figures 4A-4D provide support. Paragraph [0028] states that "[t]he interposer frame 411 includes through-molding vias (TMVs) 415, which are isolated from each other by the molding compound 410." As-Filed Specification, paragraph [0028]. The interposer frame 411 is a composite structure comprising both the TMVs 415 and the molding compound 410. The molding compound 410 portion of the interposer frame 411 is laterally adjacent to each TMV 415 (the metal pillars). Figures 4A-4D clearly show element 410 positioned laterally adjacent to element 415.
The applicant admitted that “the interposer frame 411 is a composite structure comprising both the TMVs 415 and the molding compound 410” and “element 410 positioned laterally adjacent to element 415”; however, claim cites the interposer (frame), not the molding compound, positioned laterally adjacent to each of the plurality of metal pillars (TMV).
Therefore, the original disclosure and/or the elected embodiment of Figs. 5 (detail view of RDL 430, semiconductor die 450, and RDL460), 6 (final structure) and 7A-7C (process sequence for forming additional conductive section 670 as shown in Fig. 6) does not reasonably convey to one of ordinary skill that the inventor possessed the claimed subject matter encompassing “an interposer laterally adjacent to each of the plurality of metal pillars”, as recited in claims 1 and 9.
Applicant argues that “with respect to basic elements such as "a substrate" and "the semiconductor component comprises one or more dies," Applicant respectfully submits that paragraph [0034] states "the die 450 includes a substrate 524 comprising silicon or other semiconductive materials." As-Filed Specification, paragraph [0034]. Additionally, the originally filed claims expressly recite these elements”.
The examiner respectfully disagrees because paragraph [0034] never discloses “the semiconductor component comprises one or more dies”; and the substrate 524 as disclosed in paragraph [0034] is referring to the die 450 (an intermediate product), not a substrate of a semiconductor package (a final product).
Applicant argues that “with respect to the claim language "an interposer laterally adjacent to each of the plurality of metal pillars" as recited in claims 1 and 9, the Office asserted that this limitation is inconsistent with the specification. Applicant respectfully submits that no inconsistency exists. As explained above in the response to the 35 U.S.C. § 112(a) rejection, the interposer frame 411 is a composite structure comprising both TMVs 415 and molding compound 410. The molding compound 410 portion of the interposer frame 411 is laterally adjacent to each TMV 415. Figures 4A-4D clearly include this arrangement.
The applicant admitted that “the interposer frame 411 is a composite structure comprising both the TMVs 415 and the molding compound 410” and “element 410 positioned laterally adjacent to element 415”; however, claim cites the interposer (frame), not the molding compound, positioned laterally adjacent to each of the plurality of metal pillars (TMV).
Therefore, inconsistency exists; and an artisan would not know how to arrange the interposer laterally adjacent to itself since each of plurality of metal pillars is a part of the interposer.
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MEIYA LI whose telephone number is (571)270-1572. The examiner can normally be reached Monday-Friday 7AM-3PM.
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/MEIYA LI/Primary Examiner, Art Unit 2811
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