Tech Center 2800 • Art Units: 2811
This examiner grants 69% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18489493 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18457313 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18227469 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18309144 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17984376 | METHOD OF FABRICATING SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17868126 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17829446 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17731615 | SEMICONDUCTOR DEVICES HAVING STRESSED ACTIVE REGIONS THEREIN THAT SUPPORT ENHANCED CARRIER MOBILITY | Final Rejection | Samsung Electronics Co., Ltd. |
| 17730336 | SEMICONDUCTOR ULTRAVIOLET LIGHT EMITTING DEVICE PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17028001 | INTERNALLY STACKED NPN WITH SEGMENTED COLLECTOR | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17915640 | IMAGING ELEMENT AND IMAGING DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18492118 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17810466 | MULTI STACK OPTICAL ELEMENTS USING TEMPORARY AND PERMANENT BONDING | Non-Final OA | Applied Materials, Inc. |
| 17576300 | Light Emission System with MicroLED Device Isolation | Final Rejection | Google LLC |
| 18234502 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18366845 | METHODS FOR FORMING IMAGE SENSORS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17335985 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18233697 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A METAL OXIDE ETCH STOP LAYER AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC. |
| 18234046 | MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18166788 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) |
| 14942170 | ENHANCEMENT OF ORGANIC PHOTOVOLTAIC CELL OPEN CIRCUIT VOLTAGE USING ELECTRON/HOLE BLOCKING EXCITON BLOCKING LAYERS | Non-Final OA | THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
| 18446753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18365068 | Memory Array and Methods of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18495266 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | SEMES CO., LTD. |
| 18458723 | ELIMINATING INTERCONNECT STRAINS IN MICROCIRCUITS | Non-Final OA | Raytheon Company |
| 17507201 | LIGHT EMITTING DIODE PACKAGES | Final Rejection | CreeLED, Inc. |
| 18493791 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18177102 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17844974 | MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIELECTRIC STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18522222 | DISPLAY PANELS | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
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