Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811
This examiner grants 69% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18639224 | MICRO LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18413813 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18545419 | SEMICONDUCTOR MEMORY DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18489493 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18457313 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18227469 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18354041 | FIELD-EFFECT TRANSISTOR AND INTEGRATED CIRCUIT DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18315181 | MEMORY DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18304930 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17935119 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17662306 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18432609 | Through-substrate laser soldering with embedded absorbing layer | Non-Final OA | Apple Inc. |
| 17915640 | IMAGING ELEMENT AND IMAGING DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18374200 | LATERAL HIGH VOLTAGE SCR WITH INTEGRATED NEGATIVE STRIKE DIODE | Non-Final OA | Texas Instruments Incorporated |
| 18602041 | METHOD FOR FABRICATING MEMORY DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18230325 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18312766 | SEMICONDUCTOR MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17669378 | INTEGRATED CHIP, FERROELECTRIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18769781 | PARASITIC CAPACITANCE REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18412779 | SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17810466 | MULTI STACK OPTICAL ELEMENTS USING TEMPORARY AND PERMANENT BONDING | Non-Final OA | Applied Materials, Inc. |
| 17949474 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17845849 | METHOD FOR PREPARING MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIELECTRIC STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17741593 | MEMORY DEVICE HAVING PROTRUDING CHANNEL STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17507201 | LIGHT EMITTING DIODE PACKAGES | Non-Final OA | CreeLED, Inc. |
| 18492118 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18325008 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Winbond Electronics Corp. |
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