Prosecution Insights
Last updated: May 28, 2026
Application No. 17/884,528

MRAM STRUCTURE AND METHOD OF FABRICATING THE SAME

Final Rejection §102
Filed
Aug 09, 2022
Priority
Jul 08, 2022 — TW 111125724
Examiner
MAI, ANH D
Art Unit
2893
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
UNITED MICROELECTRONICS CORPORATION
OA Round
3 (Final)
38%
Grant Probability
At Risk
4-5
OA Rounds
0m
Est. Remaining
48%
With Interview

Examiner Intelligence

Grants only 38% of cases
38%
Career Allowance Rate
262 granted / 697 resolved
-30.4% vs TC avg
Moderate +10% lift
Without
With
+9.9%
Interview Lift
resolved cases with interview
Typical timeline
3y 7m
Avg Prosecution
29 currently pending
Career history
754
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
82.6%
+42.6% vs TC avg
§102
11.7%
-28.3% vs TC avg
§112
5.1%
-34.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 697 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Status of the Claims Group I, Species 1, as shown in FIG. 7, is elected. Response filed March 08, 2026 is acknowledged. Non-Elected Invention and Species, claims 8-13 have been withdrawn from consideration. Claims 1-13 are pending. Action on merits of claims 1-7 follows. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by MAO (US. Patent No. 8,138,562) of record. With respect to claim 1, MAO teaches a magnetoresistive random access memory (MRAM) structure as claimed including: a magnetic tunnel junction (MTJ) (24b, t, f), a first spin orbit torque (SOT) element (24e, lower), a conductive layer (24e, upper) and a second SOT element (26a) disposed from bottom to top; a protective layer (27) disposed on the second SOT element (26a), wherein the protective layer (27) covers and contacts a top surface of the second SOT element (26a), and the protective layer (27) is an insulator; and a first conductive via (32a) penetrating the protective layer (27) and contacting the second SOT element (26a). (See Fig. 13). With respect to claim 2,the MRAM structure of MAO further comprises a spacer (25) contacting a sidewall of the MTJ, a sidewall of the first SOT element, a sidewall of the conductive layer, and the spacer being disposed below the second SOT element (26a). With respect to claim 3, the MRAM structure of MAO, further comprises a second conductive via (23) disposed below the MTJ and contacting the MTJ. With respect to claim 4, a width of the second SOT element (26a) of MAO is greater than a width of the conductive layer. With respect to claim 5, the MRAM structure of MAO further comprises a dielectric layer (29) surrounding the protective layer (27) and the second SOT element (26a). With respect to claim 6, a material of the dielectric layer (29) and a material of the protective layer (27) of MAO are different. With respect to claim 7, the protective layer (27) of MAO comprises a nitrogen-containing material. Response to Arguments Applicant's arguments filed March 08, 2026 have been fully considered but they are not persuasive. Applicant argues: the Mao fails to disclose the requisite "first SOT element" located between the MTJ (24f/24t/24b) and the designated conductive layer (top electrode 24e). However, according to MAO, layer 24e comprises a composite of either Ru/Ta/Ru or Ru/Ta. MAO, col. 7, lines 3-12, teaches: “In an embodiment wherein the top electrode 24e is a composite with an upper Ta layer, the Ta layer serves as a hardmask or stop layer for subsequent CMP … In another embodiment, the top electrode 24e may be a composite with a so called capping layer that contacts a free layer 24f and an uppermost hard mask such as Ta”. According to the above, the composite layer 24e comprises a capping layer that contacts the free layer 24f is the Ru layer and the uppermost hard mask is Ta layer. It is determined that the capping layer the contact the free layer 24f is the “first SOT layer” (Ru layer) and the uppermost hard mask layer is “conductive layer” (Ta layer) and layer 26a is the “second SOT layer” Therefore, the limitation: “a magnetic tunnel junction (MTJ), a first spin orbit torque (SOT) element, a conductive layer and a second SOT element disposed from bottom to top” is met. Note that, Ruthenium (Ru) is well known in the art to be a non-magnetic metal, hence SOT layer. Note that, the Office Action has never indicated that layer 24f is the SOT layer. The limitations are met. The rejection of all claims is maintained. Conclusion THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANH D MAI whose telephone number is (571)272-1710 (Email: Anh.Mai2@uspto.gov). The examiner can normally be reached 10:00-4:00PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Sue A Purvis can be reached at 571-272-1236. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ANH D MAI/Primary Examiner, Art Unit 2893
Read full office action

Prosecution Timeline

Aug 09, 2022
Application Filed
Dec 31, 2025
Non-Final Rejection mailed — §102
Mar 08, 2026
Response Filed
Apr 03, 2026
Final Rejection mailed — §102
May 14, 2026
Request for Continued Examination
May 19, 2026
Response after Non-Final Action
May 21, 2026
Non-Final Rejection (signed) — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

4-5
Expected OA Rounds
38%
Grant Probability
48%
With Interview (+9.9%)
3y 7m (~0m remaining)
Median Time to Grant
High
PTA Risk
Based on 697 resolved cases by this examiner. Grant probability derived from career allowance rate.

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