Prosecution Insights
Last updated: April 19, 2026
Application No. 17/894,296

ELECTROSTATIC CHUCK, SUBSTRATE SUPPORT, PLASMA PROCESSING APPARATUS, AND METHOD OF MANUFACTURING ELECTROSTATIC CHUCK

Non-Final OA §103
Filed
Aug 24, 2022
Examiner
CROWELL, ANNA M
Art Unit
1716
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Tokyo Electron Limited
OA Round
1 (Non-Final)
45%
Grant Probability
Moderate
1-2
OA Rounds
3y 10m
To Grant
76%
With Interview

Examiner Intelligence

Grants 45% of resolved cases
45%
Career Allow Rate
191 granted / 424 resolved
-20.0% vs TC avg
Strong +31% interview lift
Without
With
+31.0%
Interview Lift
resolved cases with interview
Typical timeline
3y 10m
Avg Prosecution
39 currently pending
Career history
463
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
56.0%
+16.0% vs TC avg
§102
19.1%
-20.9% vs TC avg
§112
13.2%
-26.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 424 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I, Species II (claims 1-2 and 5-9) in the reply filed on December 22, 2025 is acknowledged. Claims 3-4 and 10-15 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected species and invention, there being no allowable generic or linking claim. Claim Interpretation Claim 1 recites the limitation “wherein each of the plurality of convex portions excluding at least a tip-side layer is formed of second ceramic particles” which is directed to a non-elected Species I-Figure 4. For purpose of clarity and search, the examiner is examining the elected Species II-Figure 8. Hence , the limitation of “wherein each of the plurality of convex portions is formed of second ceramic particles” will be searched with regards to claim 1. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claim(s) 1-2, 5-7, and 9 is/are rejected under 35 U.S.C. 103 as being unpatentable over Maeta (U.S. 2021/0006182) in view of Kamitani et al. (U.S. 7,586,734). Referring to Figures 1-3 and paragraphs [0063]-[0070],[0096]-[0102], Maeta discloses an electrostatic chuck 1 for electrostatically attracting a substrate, comprising: a chuck body 2 formed of first ceramic particles and having a substrate-facing surface facing the substrate attracted to the electrostatic chuck (par. [0061]); and a plurality of convex portions 22 formed on the substrate-facing surface of the chuck body (par.[0069]), wherein each of the plurality of convex portions excluding at least a tip-side layer is formed of second ceramic particles having a major axis diameter of 20 mm or more and 2,000 mm or less (par.[0101]-[0102]). Maeta is silent on the convex portions having a porosity of 0.1% or more and 1.0% or less. Referring to column 13, lines 51-55 and column 14, lines 1-14, Kamitani et al. teach an electrostatic chuck wherein the chuck body has a porosity of 0.1% or more and 1.0% or less in order to prevent insulation breakdown from repetitive voltage impression. Therefore, it would have been obvious to one of ordinary skill in the art, before the effective filing date of the claimed invention, to have modified the convex portion of Maeta to have a porosity of 0.1% or more and 1.0% or less as taught by Kamitani et al. in order to prevent insulation breakdown from repetitive voltage impression. With respect to claim 2, the electrostatic chuck of Maeta further includes wherein a surface roughness of an endmost surface 22a of each of the plurality of convex portions 22 is 0.01 mm or less in terms of an arithmetic mean roughness (pars.[0096]-[0097]). With respect to claim 5, the electrostatic chuck of Maeta in view of Kamitani et al., wherein each of the plurality of convex portions, including the tip-side layer, is entirely formed of the second ceramic particles having the major axis diameter of 20 mm or more and 2,000 mm or less, and has the porosity of 0.1% or more and 1.0% or less (Maeta-par.[0101]-[0102]), Kamitani et al.- col. 13, lines 51-55 and col. 14, lines 1-14). With respect to claim 6, the electrostatic chuck of Maeta further includes wherein a surface roughness of the substrate-facing surface 11d of the chuck body is 0.01 mm or less in terms of an arithmetic mean roughness (par.[0202]). With respect to claim 7, a substrate support comprising: the electrostatic chuck of Maeta; and further includes a base 3 having an upper surface on which the electrostatic chuck is provided (par.[0061]). With respect to claim 9, referring to Figures 1-3 and paragraphs [0063]-[0070],[0096]-[0102], Maeta discloses an electrostatic chuck 1 for electrostatically attracting a substrate, comprising: a chuck body 2 formed of first ceramic particles and having a substrate-facing surface facing the substrate attracted to the electrostatic chuck (par.[0061]); and a plurality of convex portions 22 formed on the substrate-facing surface of the chuck body (par.[0069]), wherein the plurality of convex portions are formed by forming a layer of second ceramic particles on the substrate-facing surface of the chuck body, selectively irradiating portions of the layer of the second ceramic particles corresponding to the plurality of convex portions with light (par.[0192], i.e. laser) so that a major axis diameter of the second ceramic particles in irradiated portions is set to 20 mm or more and 2,000 mm or less and subsequently removing unirradiated portions in the layer of the second ceramic particles (par.[0101]-[0102]). Maeta is silent on a porosity of the irradiated portions is set to 0.1% or more and 1.0% or less. Referring to column 13, lines 51-55 and column 14, lines 1-14, Kamitani et al. teach an electrostatic chuck wherein the chuck body has a porosity of 0.1% or more and 1.0% or less in order to prevent insulation breakdown from repetitive voltage impression. Therefore, it would have been obvious to one of ordinary skill in the art, before the effective filing date of the claimed invention, to have modified the irradiated portion of Maeta to have a porosity of 0.1% or more and 1.0% or less as taught by Kamitani et al. in order to prevent insulation breakdown from repetitive voltage impression. Claim(s) 8 is/are rejected under 35 U.S.C. 103 as being unpatentable over Maeta (U.S. 2021/0006182) in view of Kamitani et al. (U.S. 7,586,734) as applied to claims 1-2, 5-7, and 9 above, and further in view of Hayashi (U.S. 2015/0243541). The teachings of Maeta in view of Kamitani et al. have been discussed above. Specifically, Maeta discloses a substrate support. Maeta in view of Kamitani et al. is silent on a processing chamber configured to be depressurized and accommodate the substrate support. Referring to Figure 1 and paragraph [0034], Hayashi teaches that it is conventionally known in the art during substrate processing for a processing chamber to be configured to be depressurized and accommodate the substrate support. Therefore, it would have been obvious to one of ordinary skill in the art, before the effective filing date of the claimed invention, to have modified the apparatus of Maeta in view of Kamitani et al. to include a processing chamber configured to be depressurized and accommodate the substrate support as taught by Hayashi since it is a conventionally known component used in substrate processing under vacuum conditions. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Liu et al.’703, Halm et al.’660, Miyashita et al.’222, Anada et al.’813, Ishikawa et al.’597, Sasaki et al.’114, teach an electrostatic chuck having a plurality of convex portions formed on the substrate-facing surface. Miyamoto et al.’860 and Muneishi et al. teach the diameter of the convex portions. Ono’410 and Tamagawa et al.’838 teach a surface roughness of the convex portions. Morioka et al.’961 teach the diameter and surface roughness of the convex portions. Any inquiry concerning this communication or earlier communications from the examiner should be directed to Michelle CROWELL whose telephone number is (571)272-1432. The examiner can normally be reached Monday-Thursday 10:00am-6:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Parviz Hassanzadeh can be reached at 571-272-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Michelle CROWELL/Examiner, Art Unit 1716 /SYLVIA MACARTHUR/Primary Examiner, Art Unit 1716
Read full office action

Prosecution Timeline

Aug 24, 2022
Application Filed
Mar 04, 2026
Non-Final Rejection — §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12603255
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
2y 5m to grant Granted Apr 14, 2026
Patent 12604708
ATOMIC LAYER ETCH SYSTEMS FOR SELECTIVELY ETCHING WITH HALOGEN-BASED COMPOUNDS
2y 5m to grant Granted Apr 14, 2026
Patent 12555741
MAGNETIC HOUSING SYSTEMS
2y 5m to grant Granted Feb 17, 2026
Patent 12548739
PLASMA SOURCE FOR SEMICONDUCTOR PROCESSING
2y 5m to grant Granted Feb 10, 2026
Patent 12525439
APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING
2y 5m to grant Granted Jan 13, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
45%
Grant Probability
76%
With Interview (+31.0%)
3y 10m
Median Time to Grant
Low
PTA Risk
Based on 424 resolved cases by this examiner. Grant probability derived from career allow rate.

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