DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 01/29/2026 has been entered.
Response to Amendment
Claims 1-15 are pending in the Amendment filed 01/29/2026.
The rejection of claims 1-15 under 35 U.S.C. 103 as being unpatentable over Sugishima et al. (US 20230159864 A1) is withdrawn in view of Applicant’s amendment to independent claims 1 and 2 (excluding “hydroxylamine” from the claimed compositions).
However, claims 1-3, 6, and 8-10 are rejected over newly relied upon reference to Honda et al. (US 6103680 A).
Claims 1-2, 4-10, and 12 are rejected under 35 U.S.C. 103 as being unpatentable over newly cited reference to Sun et al. (CN 111381459 A, Machine Translation).
Claims 8-10 are rejected under 35 U.S.C. 112(d) or pre-AIA 35 U.S.C. 112, 4th paragraph, as being of improper dependent form for failing to further limit the subject matter of the claim upon which it depends.
Claims 11 and 13-15 are objected to as being dependent upon a rejected base claim.
Response to Arguments
Applicant’s arguments with respect to claims 1 and 2 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Claims 1-3, 6, and 8-10 are rejected over newly relied upon reference to Honda et al. (US 6103680 A), which teaches a composition comprising hydroxyethyl hydrazine, i.e. claimed compound (A) and EDTA, i.e., compound (B) [col. 6, Example 5; claim 1].
Claims 1-2, 4-10, and 12 are rejected under 35 U.S.C. 103 as being unpatentable over newly cited reference to Sun et al. (CN 111381459 A, Machine Translation), which teaches a cleaning composition comprising hydrazine derivatives and amines [claim 1, claim 5; Abstract].
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(d):
(d) REFERENCE IN DEPENDENT FORMS.—Subject to subsection (e), a claim in dependent form shall contain a reference to a claim previously set forth and then specify a further limitation of the subject matter claimed. A claim in dependent form shall be construed to incorporate by reference all the limitations of the claim to which it refers.
The following is a quotation of pre-AIA 35 U.S.C. 112, fourth paragraph:
Subject to the following paragraph [i.e., the fifth paragraph of pre-AIA 35 U.S.C. 112], a claim in dependent form shall contain a reference to a claim previously set forth and then specify a further limitation of the subject matter claimed. A claim in dependent form shall be construed to incorporate by reference all the limitations of the claim to which it refers.
Claims 8-10 are rejected under 35 U.S.C. 112(d) or pre-AIA 35 U.S.C. 112, 4th paragraph, as being of improper dependent form for failing to further limit the subject matter of the claim upon which it depends, or for failing to include all the limitations of the claim upon which it depends.
As to claims 8-10, each of the claimed recite intended uses of the claimed composition of claim 1. Each claim is therefore not given patentable weight because they are directed to an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II. As such, each of the claims 8-10 fail to further limit claim 1.
Applicant may cancel the claim(s), amend the claim(s) to place the claim(s) in proper dependent form, rewrite the claim(s) in independent form, or present a sufficient showing that the dependent claim(s) complies with the statutory requirements.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1-2 and 8-10 are rejected under 35 U.S.C. 102(a)(1)/(a)(2) as being anticipated by Honda et al. (US 6103680 A).
As to claim 1, Honda discloses a cleaning liquid for cleaning a substrate [Abstract] having a first metal atom-containing layer that contains ruthenium and a second metal atom-containing layer that contains a metal atom other than ruthenium, wherein both of the layers contact each other, wherein at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface [Abstract], the cleaning liquid comprising:
[Examiner Note: The above italicized preamble recitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.01, II.]
at least one hydrazine compound (A) selected from the group consisting of a compound represented by General Formula (al) [col. 6, Example 5, “HEH”, hydroxyethyl hydrazine], a hydrate of the compound, and a salt of the compound; and
at least one basic compound (B) selected from the group consisting of an amine other than the hydrazine compound (A) [col. 6, Example 5, “EDTA”] and a quaternary hydroxide,
(al) wherein R1 represents an organic group including no carbonyl group or a hydrogen atom, and R2 represents an organic group including no carbonyl group [col. 6, Example 5, “HEH”, hydroxyethyl hydrazine], and
wherein the cleaning liquid does not contain hydroxylamine [col. 6, Example 5].
As to claim 2, Honda discloses a cleaning liquid for cleaning a substrate [Abstract] having a first metal atom-containing layer that contains a noble metal atom and a second metal atom-containing layer that contains a base metal atom, wherein both of the layers contact each other, wherein at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface [Abstract], the cleaning liquid comprising:
[Examiner Note: The above italicized preamble recitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.01, II.]
at least one hydrazine compound (A) selected from the group consisting of a compound represented by General Formula (al) [col. 6, Example 5, “HEH”, hydroxyethyl hydrazine], a hydrate of the compound, and a salt of the compound; and
at least one basic compound (B) selected from the group consisting of an amine other than the hydrazine compound (A) [col. 6, Example 5, “EDTA”] and a quaternary hydroxide,
(al) wherein R1 represents an organic group including no carbonyl group or a hydrogen atom, and R2 represents an organic group including no carbonyl group [col. 6, Example 5, “HEH”, hydroxyethyl hydrazine], and
wherein the cleaning liquid does not contain hydroxylamine [col. 6, Example 5].
As to claim 8, Honda discloses the cleaning liquid according to claim 1, wherein the second metal atom containing layer contains copper.
Examiner Note: The above italicized limitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II.
As to claim 9, Honda discloses the cleaning liquid according to claim 1, wherein the cleaning liquid is used for cleaning the substrate after chemical mechanical polishing of a wiring layer, and the wiring layer is the first metal atom-containing layer or the second metal atom-containing layer.
Examiner Note: The above italicized limitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II.
As to claim 10, Honda discloses the cleaning liquid according to claim 1, wherein the cleaning liquid is used for cleaning the substrate after a via connected to a wiring layer is formed by a dual damascene Process.
Examiner Note: The above italicized limitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II.
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claims 3 and 6 are rejected under 35 U.S.C. 103 as being unpatentable over Honda et al. (US 6103680 A), as applied to claims 1-2 and 8-10 above.
As to claim 3, Honda discloses the cleaning liquid according to claim 1, further comprising a hydroxy carboxylic acid (C) [claim 1, “citric acid, lactic acid…tartaric acid, ethylene-diaminetetraacetic acid…and mixtures thereof”].
Here, Honda fails to explicitly disclose a composition of Example 5 [col. 6] further including a hydroxy carboxylic acid. However, Honda teaches that mixtures of carboxylic acids are suitable to form the cleaning composition, and therefore renders obvious the combination of Example 5 (i.e., EDTA) with other carboxylic acids, among them “citric acid, lactic acid…tartaric acid” [claim 1] which are “hydroxy carboxylic acid (C)” as recited in claim 3.
As to claim 6, Honda discloses the cleaning liquid according to claim 1, further comprising at least one selected from the group consisting of a buffer, an anticorrosive agent [claim 16], a surfactant [claim 16], and an organic solvent [claim 5].
Here, Honda fails to explicitly disclose a composition of Example 5 [col. 6] further including a buffer, an anticorrosive agent, a surfactant, and an organic solvent. However, Honda teaches that the cleaning composition may further include a water-miscible solvent [claim 5], and further a surfactant, corrosion inhibitor, or combination thereof [claim 15]. Honda therefore renders obvious the combination of Example 5 (i.e., EDTA) with an organic solvent, and further a surfactant, corrosion inhibitor, or combination thereof, in order to form an effective cleaning composition, as taught by Honda [claim 3; claim 15].
Claims 1-2, 4-10, and 12 are rejected under 35 U.S.C. 103 as being unpatentable over Sun et al. (CN 111381459 A, Machine Translation).
As to claim 1, Sun discloses a cleaning liquid for cleaning a substrate [Abstract] having a first metal atom-containing layer that contains ruthenium and a second metal atom-containing layer that contains a metal atom other than ruthenium, wherein both of the layers contact each other, wherein at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface [Abstract], the cleaning liquid comprising:
[Examiner Note: The above italicized preamble recitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.01, II.]
at least one hydrazine compound (A) selected from the group consisting of a compound represented by General Formula (al) [claim 1; claim 6, “ hydrazine ethanol”], a hydrate of the compound, and a salt of the compound; and
at least one basic compound (B) selected from the group consisting of an amine other than the hydrazine compound (A) [claims 1-3] and a quaternary hydroxide,
(al) wherein R1 represents an organic group including no carbonyl group or a hydrogen atom, and R2 represents an organic group including no carbonyl group [claim 1; claim 6, “ hydrazine ethanol”], and
wherein the cleaning liquid does not contain hydroxylamine [claim 1; claim 6].
Here, Sun fails to explicitly disclose a specific embodiment comprising the disclosed species hydrazine ethanol [claim 1, claim 6], but nonetheless would render obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to form a photoresist cleaning composition comprising the combination of hydrazine ethanol and an amine compound [claim 1-3] in order to form a cleaning composition effective to remove photoresist residue from semiconductor wafers comprising gold and silver, as taught by Sun [Abstract, claims 1-3].
As to claim 2, Honda discloses a cleaning liquid for cleaning a substrate [Abstract] having a first metal atom-containing layer that contains a noble metal atom and a second metal atom-containing layer that contains a base metal atom, wherein both of the layers contact each other, wherein at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface [Abstract], the cleaning liquid comprising:
[Examiner Note: The above italicized preamble recitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.01, II.]
at least one hydrazine compound (A) selected from the group consisting of a compound represented by General Formula (al) [claim 1; claim 6, “ hydrazine ethanol”], a hydrate of the compound, and a salt of the compound; and
at least one basic compound (B) selected from the group consisting of an amine other than the hydrazine compound (A) [claims 1-3] and a quaternary hydroxide,
(al) wherein R1 represents an organic group including no carbonyl group or a hydrogen atom, and R2 represents an organic group including no carbonyl group [claim 1; claim 6, “ hydrazine ethanol”], and
wherein the cleaning liquid does not contain hydroxylamine [claim 1; claim 6].
Here, Sun fails to explicitly disclose a specific embodiment comprising the disclosed species hydrazine ethanol [claim 1, claim 6], but nonetheless would render obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to form a photoresist cleaning composition comprising the combination of hydrazine ethanol and an amine compound [claim 1-3] in order to form a cleaning composition effective to remove photoresist residue from semiconductor wafers comprising gold and silver, as taught by Sun [Abstract, claims 1-3].
As to claim 4, Sun discloses the cleaning liquid according to claim 1, wherein the hydrazine compound (A) has a concentration of 1.0% by mass or less with respect to a total mass of the cleaning liquid [claim 11].
As to claim 5, Sun discloses the cleaning liquid according to claim 1, wherein the basic compound (B) is at least one selected from the group consisting of a quaternary hydroxide, a tertiary monoamine, and a tertiary alkanolamine [claims 3-4].
As to claim 6, Sun discloses the cleaning liquid according to claim 1, further comprising at least one selected from the group consisting of a buffer [claim 5], an anticorrosive agent, a surfactant, and an organic solvent.
As to claim 7, Sun discloses the cleaning liquid according to claim 6, wherein the buffer is a compound with pKa of 6 to 11 [claim 5, e.g., boric acid].
As to claim 8, Sun discloses the cleaning liquid according to claim 1, wherein the second metal atom-containing layer contains copper [Abstract].
Examiner Note: The above italicized limitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II.
As to claim 9, Sun discloses the cleaning liquid according to claim 1, wherein the cleaning liquid is used for cleaning the substrate after chemical mechanical polishing of a wiring layer, and the wiring layer is the first metal atom-containing layer or the second metal atom-containing layer [Abstract].
Examiner Note: The above italicized limitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II.
As to claim 10, Sun discloses the cleaning liquid according to claim 1, wherein the cleaning liquid is used for cleaning the substrate after a via connected to a wiring layer is formed by a dual damascene Process [Abstract].
Examiner Note: The above italicized limitation is not given patentable weight because it is interpreted as an intended use of the composition which does not limit the claimed composition. See MPEP 2111.02, II.
As to claim 12, Sun discloses a method for cleaning a substrate having a first metal atom-containing layer that contains a noble metal atom and a second metal atom-containing layer that contains a base metal atom, wherein both of the layers contact each other, [Abstract] the method comprising cleaning a substrate wherein at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface, using the cleaning liquid according to claim 1 [Abstract, claim 1].
Allowable Subject Matter
Claims 11 and 13-15 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
The following is a statement of reasons for the indication of allowable subject matter:
As to claim 11, the closest prior art of record to Honda et al. (US 6103680 A) fails to teach or suggest “the method comprising cleaning a substrate wherein at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface, using the cleaning liquid according to claim 1.” in conjunction with the preamble of claim 11 (“a substrate having a first metal atom-containing layer that contains a ruthenium atom and a second metal atom-containing layer that contains a metal atom other than ruthenium”).
Claims 13-15 are considered to contain allowable subject matter based on their dependence on claim 11.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure: The additionally cited references are cited to show compositions comprising hydrazine or derivatives thereof [Abstract].
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/CHRISTOPHER REMAVEGE/Examiner, Art Unit 1713